公开(公告)号：US20150201496A1

公开(公告)日：2015-07-16

申请号：US14419979

申请日：2012-08-10

Applicant: Jichang Liao ,  Ning Sun

Inventor： Jichang Liao ,  Ning Sun

IPC: H05K1/14 ,  H05K9/00 ,  H05K1/02

CPC classification number: H05K1/144 ,  H05K1/0209 ,  H05K3/0061 ,  H05K9/0024 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/10098 ,  H05K2201/10371

Abstract: A radio module comprises a top board (110) with all components mounted on a front surface (111) and a metal substrate on a back surface (112); a bottom board (120) with all components mounted on a front surface (121) and a metal substrate on a back surface (122), wherein the bottom board (120) is arranged so that the front surface (121) of the bottom board (120) is opposite to the front surface (111) of the top board (110); and at least one shielding board (130) provided between the top board (110) and the boom board (120) with certain vertical spacing. The top board (110), the bottom board (120), and the at least one shielding board (130) are arranged to be substantially in alignment in a vertical direction and be fastened with one another. A board-board electrical connection (140-1, 140-2) is established at least between the top board (110) and the bottom board (120).

Abstract translation: 无线电模块包括具有安装在前表面（111）上的所有部件和背面（112）上的金属基板的顶板（110）。 具有安装在前表面（121）上的所有部件和在后表面（122）上的金属基板的底板（120），其中底板（120）被布置成使得底板（120）的前表面（121） （120）与所述顶板（110）的前表面（111）相对; 以及至少一个屏蔽板（130），其以一定的垂直间距设置在所述顶板（110）和所述悬臂板（120）之间。 顶板（110），底板（120）和至少一个屏蔽板（130）被布置成在垂直方向上基本上对齐并且彼此紧固。 至少在顶板（110）和底板（120）之间建立板电连接（140-1,140-2）。

公开(公告)号：US20150195956A1

公开(公告)日：2015-07-09

申请号：US14591355

申请日：2015-01-07

Applicant: Enphase Energy, Inc.

Inventor： Ryan Linderman

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20409 ,  H01F27/022 ,  H01F27/08 ,  H01F2027/065 ,  H01L33/483 ,  H01L33/642 ,  H02M7/003 ,  H02S40/42 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K5/064 ,  H05K7/2039 ,  H05K7/20418 ,  H05K7/20436 ,  H05K7/20463 ,  H05K7/20472 ,  H05K7/2049 ,  H05K7/205 ,  H05K7/209 ,  H05K2201/066

Abstract: An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.

Abstract translation: 一种用于电气设备的热管理装置。 在一个实施例中，该装置包括设置在外壳内的主要散热器，其包含填充有至少一个电气部件的印刷电路板（PCB），其中所述主散热器是导热的，并且其中所述外壳的内部至少部分地 填充有封装材料; 耦合到所述外壳的第一壁的外表面的二次散热器，其中所述二次散热器是导热的; 以及耦合在主头扩展器和PCB之间的热界面，其中该热界面是导热的并且是电绝缘的。

公开(公告)号：US20150189734A1

公开(公告)日：2015-07-02

申请号：US14582898

申请日：2014-12-24

Applicant: DENSO CORPORATION

Inventor： Ryo NISHIMOTO ,  Shinsuke OOTA

IPC: H05K1/02 ,  B62D5/04 ,  H05K1/11

CPC classification number: H05K1/0209 ,  H05K3/3415 ,  H05K7/1432 ,  H05K2201/066 ,  H05K2201/10189 ,  Y02P70/613

Abstract: An electronic control unit includes a board, a heat-generating device, a connector, and a heatsink. The board has an insulating layer and a wiring pattern partially exposed outside the insulating layer. The heat-generating device is mounted on the board and electrically connected to the wiring pattern. The connector is located adjacent to the heat-generating device and has a connection terminal connected to the wiring pattern. The heatsink is located opposite to the board across the heat-generating device and in contact with the heat-generating device to dissipate heat of the heat-generating device. The wiring pattern has a land pattern including a mount portion and a connection portion. The heat-generating device is mounted on the mount portion. The connection terminal of the connector is connected to the connection portion.

Abstract translation: 电子控制单元包括板，发热装置，连接器和散热器。 该电路板具有绝缘层和局部暴露在绝缘层外部的布线图案。 发热装置安装在板上并电连接到布线图案。 连接器位于发热装置的附近，并且具有连接到布线图案的连接端子。 散热器位于与发热装置相对的板上，并且与发热装置接触以散热发热装置的热量。 布线图案具有包括安装部分和连接部分的焊盘图案。 发热装置安装在安装部分上。 连接器的连接端子连接到连接部分。

公开(公告)号：US20150186097A1

公开(公告)日：2015-07-02

申请号：US14444747

申请日：2014-07-28

Applicant: Ultravision Holdings, LLC

Inventor： William Y. Hall

IPC: G06F3/14 ,  G06F3/147

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1446 ,  G06F3/147 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/14 ,  G09G2300/026 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: In one embodiment, a modular multi-panel display system includes a mechanical support structure, and an array of LED display panels arranged in rows and columns and mounted to the mechanical support structure so as to form an integrated display. None of the LED display panels have a receiver card within the panel. A receiver box is mounted to the mechanical support. The receiver box is housed in a housing that is separate from housings of each of the LED display panels. The receiver box includes a receiver card coupled to feed data to be displayed on the integrated display to a plurality of the LED display panels. A control box is outside of the mechanical support and electrically connected to the receiver box through a data connection. A plurality of electrical connections electrically connects the receiver box with a first display panel in each row of display panels.

公开(公告)号：US20150181765A1

公开(公告)日：2015-06-25

申请号：US14276805

申请日：2014-05-13

Applicant: DELTA ELECTRONICS, INC.

Inventor： Cheng-Wei Hsu ,  Hung-Chuan Chen

IPC: H05K7/20 ,  H05K7/02 ,  H05K3/32

CPC classification number: H05K7/20509 ,  H05K1/0203 ,  H05K3/3447 ,  H05K7/2049 ,  H05K2201/066 ,  H05K2201/10409 ,  H05K2201/105 ,  Y10T29/49142

Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.

Abstract translation: 电子设备的散热模块包括壳体，电路板，至少一个发热元件和紧固组件。 壳体包括至少一个侧板。 所述至少一个发热元件通过固定元件牢固地固定在所述至少一个侧板上。 在通过紧固组件将至少一个侧板和电路板组合在一起之后，至少一个侧板和电路板通过回流炉，使得至少一个发热元件焊接在电路板上 。 由至少一个发热元件产生的热量被传递到壳体的至少一个侧板，以便消散掉。

公开(公告)号：US20150138786A1

公开(公告)日：2015-05-21

申请号：US14605919

申请日：2015-01-26

Applicant: CLEDOS green tech Limited

Inventor： James Wang ,  Kei May Lau ,  Parco Wong ,  Wei Xiong Liao ,  Terence Cho ,  Zhaojun Liu ,  Eddie Chong

IPC: F21V19/00

CPC classification number: H05K1/021 ,  F21K9/232 ,  F21K9/238 ,  F21V23/006 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K2201/066 ,  H05K2201/10106

Abstract: A lighting structure for holding light-emitting-diodes (“LEDs”) of an LED light bulb, wherein said lighting structure is in a grid form with a plurality of openings therein and having one or more locations for interconnecting LED lighting components disposed on said lighting structure, wherein the grid having a number of pre-selected intersections forming the grid, and wherein a number of pre-selected intersections is in proportion with the amount of desired ventilation and the number of LEDs generating the pre-determined amount of light. The lighting structure can be made from printed-circuit-board material and the openings of the grid can be in one of the following shapes: square, rectangular, circular, and oval.

Abstract translation: 一种用于保持LED灯泡的发光二极管（“LED”）的照明结构，其中所述照明结构为格栅形式，其中具有多个开口，并且具有一个或多个位置，用于互连布置在所述LED灯泡上的LED照明部件 照明结构，其中所述网格具有形成网格的多个预先选择的交叉点，并且其中多个预先选择的交叉点与所需通气量和产生预定量的光量的LED的数量成比例。 照明结构可以由印刷电路板材料制成，并且网格的开口可以是正方形，矩形，圆形和椭圆形的以下形状之一。

公开(公告)号：US08966747B2

公开(公告)日：2015-03-03

申请号：US13105696

申请日：2011-05-11

Applicant: Patrizio Vinciarelli ,  Michael B. Lafleur ,  Sean Timothy Fleming ,  Rudolph Mutter ,  Andrew T. D'Amico

Inventor： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Sean Timothy Fleming ,  Rudolph Mutter ,  Andrew T. D'Amico

IPC: H05K3/30 ,  H05K7/20 ,  H01R43/24 ,  H05K5/06 ,  B29C45/14 ,  B29C45/00

CPC classification number: H05K3/284 ,  B23P15/007 ,  B29C45/0055 ,  B29C45/14639 ,  B29C45/1679 ,  B29C2045/0058 ,  B29C2045/169 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0065 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/04 ,  H05K5/064 ,  H05K7/1427 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

Abstract translation: 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。 提供散热鳍片或表面安装可焊接表面。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积 密封剂，间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

公开(公告)号：US08946562B2

公开(公告)日：2015-02-03

申请号：US13352978

申请日：2012-01-18

Applicant: Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen

Inventor： Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E. M. Frushour ,  Jeffrey L. Jensen

IPC: H05K1/16

CPC classification number: H05K1/0218 ,  H01P3/088 ,  H01P11/003 ,  H05K1/0225 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/183 ,  H05K1/186 ,  H05K3/4611 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/0969 ,  H05K2203/063

Abstract: A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area. The device is electrically-coupled to one or more of the one or more electrically-conductive traces disposed on the first surface of the second electrically-insulating layer.

公开(公告)号：US08920934B2

公开(公告)日：2014-12-30

申请号：US13853982

申请日：2013-03-29

Applicant: Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

Inventor： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

IPC: B32B5/18 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/1056 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/047 ,  Y10S428/929 ,  Y10T428/12181 ,  Y10T428/12479 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81805

Abstract: Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.

Abstract translation: 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附接到微电子衬底以形成混合焊料 互连。

公开(公告)号：US20140374913A1

公开(公告)日：2014-12-25

申请号：US13925900

申请日：2013-06-25

Applicant: Infineon Technologies AG

Inventor： Ralf Otremba ,  Klaus Schiess ,  Anton Mauder

IPC: H01L25/18 ,  H01L25/00

CPC classification number: H01L23/3675 ,  H01L23/3107 ,  H01L23/4006 ,  H01L23/4093 ,  H01L23/49562 ,  H01L2224/06181 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1431 ,  H05K1/0203 ,  H05K1/0265 ,  H05K1/0287 ,  H05K3/3447 ,  H05K2201/066 ,  H05K2201/09227 ,  H01L2924/00

Abstract: Various embodiments may provide a circuit arrangement. The circuit arrangement may include a carrier having at least one electrically conductive line; a plurality of discrete encapsulated integrated circuits arranged on the carrier; wherein a first integrated circuit of the plurality of integrated circuits is in electrical contact with a second integrated circuit of the plurality of integrated circuits to form a first current path bypassing the carrier; and wherein the first integrated circuit of the plurality of integrated circuits is in electrical contact with the second integrated circuit of the plurality of integrated circuits to form a second current path via the at least one electrically conductive line.

Abstract translation: 各种实施例可以提供电路装置。 电路装置可以包括具有至少一个导电线的载体; 布置在载体上的多个分立封装集成电路; 其中所述多个集成电路的第一集成电路与所述多个集成电路中的第二集成电路电接触以形成绕过所述载体的第一电流路径; 并且其中所述多个集成电路中的所述第一集成电路与所述多个集成电路中的所述第二集成电路电接触以形成经由所述至少一个导电线路的第二电流路径。