公开(公告)号：US20230247758A1

公开(公告)日：2023-08-03

申请号：US17588635

申请日：2022-01-31

Applicant: Navin Sakthivel ,  Aaron Avagliano ,  Dinesh Kommireddy ,  Marc Stephen Ramirez

Inventor： Navin Sakthivel ,  Aaron Avagliano ,  Dinesh Kommireddy ,  Marc Stephen Ramirez

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  E21B47/01

CPC classification number: H05K1/024 ,  H05K3/0044 ,  H05K3/4644 ,  E21B47/01 ,  H05K2201/10098 ,  H05K2201/09018 ,  H05K2203/107 ,  B33Y80/00

Abstract: A printed circuit board (PCB) including a rigid dielectric layer having a curved geometry, and a conductive layer attached to the dielectric layer. A method for making a printed circuit board (PCB) including depositing a layer of dielectric material onto a surface, curing and sintering the material on the surface, depositing a first layer of conductive material on the layer of dielectric material, and depositing a second layer of conductive material on the first layer of conductive material, the second layer being thinner in cross section than the first layer. A system for producing a curved rigid PCB including a housing, a build platform disposed in the housing, a mobile robotic depositor disposed upon the build platform, and a print head disposed in the housing and in printing proximity to the build platform, the head having a plurality of deposition nozzles and a laser.

公开(公告)号：US11658398B1

公开(公告)日：2023-05-23

申请号：US17000597

申请日：2020-08-24

Applicant: United States of America as represented by the Administrator of NASA

Inventor： James M. Downey ,  Bryan L. Schoenholz ,  Marie T. Piasecki

IPC: H01Q1/28 ,  H01Q3/30 ,  H01Q9/04 ,  H05K3/30 ,  H05K1/18 ,  H05K3/00 ,  H01Q1/40 ,  H01Q21/06 ,  H01Q21/00 ,  H01Q21/20 ,  H01Q1/02 ,  H01Q23/00

CPC classification number: H01Q1/286 ,  H01Q1/40 ,  H01Q3/30 ,  H01Q9/0414 ,  H01Q9/0457 ,  H01Q21/0075 ,  H01Q21/0087 ,  H01Q21/065 ,  H01Q21/20 ,  H05K1/181 ,  H05K3/0058 ,  H05K3/305 ,  H01Q1/02 ,  H01Q23/00 ,  H05K2201/09018 ,  H05K2201/10098

Abstract: A phased-array, conformal antenna and a method for forming same are disclosed. The method comprises forming a substantially planar layered antenna structure by fabricating a printed circuit board (PCB) on a substantially planar first substrate, adhering the PCB to a second substantially planar substrate, the second substantially planar substrate comprising an aerogel, adhering a plurality of antenna elements to the substantially planar second substrate to form the phased-array, adhering a protective layer to the one or more antenna elements, and shaping the substantially planar layered antenna structure to form a substantially curved layered antenna structure.

公开(公告)号：US20180083510A1

公开(公告)日：2018-03-22

申请号：US15708484

申请日：2017-09-19

Applicant: Black & Decker Inc.

Inventor： Madhur M. PUROHIT ,  Joshua M. LEWIS ,  Marcell E. COATES ,  Michael D. GROVE ,  Victor A. DORADO

IPC: H02K9/22 ,  H05K1/18 ,  H05K1/02 ,  H05K5/00 ,  H05K7/20 ,  H05K1/11 ,  H02K5/22 ,  H02K11/215 ,  H02K11/33 ,  H02K5/08 ,  H02K7/14 ,  B25F5/02

CPC classification number: H02K9/22 ,  B25F5/008 ,  B25F5/02 ,  H02K5/08 ,  H02K5/22 ,  H02K5/225 ,  H02K7/145 ,  H02K11/215 ,  H02K11/33 ,  H02K29/08 ,  H02K2203/03 ,  H02K2211/03 ,  H05K1/0203 ,  H05K1/115 ,  H05K1/181 ,  H05K3/284 ,  H05K5/0073 ,  H05K5/0086 ,  H05K5/0247 ,  H05K5/061 ,  H05K7/1427 ,  H05K7/2039 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10522

Abstract: An electronic module is provided for a power tool having an electric motor. The module includes a printed circuit board (PCB) having a first surface and a second surface; first set of power switches mounted on the first surface of the PCB; second set of power switches mounted on the PCB and electrically coupled to the first power switches forming an inverter bridge circuit for driving the electric motor; a first heat sink surface-mounted on the first surface of the PCB and having a planar main body disposed over the first power switches; a module housing arranged to receive the PCB therein; and a second heat sink secured to the module housing in thermal communication with the first heat sink to transfer heat from the first power switches.

公开(公告)号：US20170318677A1

公开(公告)日：2017-11-02

申请号：US15651056

申请日：2017-07-17

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Man Bok JEON

IPC: H05K1/14 ,  G02F1/1345 ,  H05K1/02 ,  H01L27/32

CPC classification number: H05K1/147 ,  G02F1/13452 ,  G09G2300/0408 ,  H01L27/3276 ,  H01L2251/5338 ,  H05K1/0281 ,  H05K2201/09018 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: A curved display device includes a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and an output wire unit connected to the driving chips, a printed circuit board (PCB) connected to the input wire unit of the semiconductor chip package, and a display panel including a display unit and a pad unit connected to the output wire unit of the semiconductor chip package, wherein the display panel, the semiconductor chip package, and the PCB are bendable in a first direction, and the driving chips of the of the semiconductor chip package are separated from each other in the first direction.

公开(公告)号：US20170290147A1

公开(公告)日：2017-10-05

申请号：US15623202

申请日：2017-06-14

Applicant: Taiwan Green Point Enterprises Co., Ltd.

Inventor： Pen-Yi LIAO ,  Hung-San PAN ,  Yu-Cheng CHEN ,  Hui-Ching CHUANG ,  Wen-Chia TSAI

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/18

CPC classification number: H05K3/0061 ,  H05K1/0203 ,  H05K1/0284 ,  H05K3/185 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2203/0709 ,  Y10T29/49156

Abstract: Disclosed herein is a circuit-and-heat-dissipation assembly which includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer and having an electroless plating layer which has a patterned catalyst seed layer comprising an active metal and formed on the insulator layer, and a reduced metal layer formed on the catalyst seed layer. Also disclosed herein is a method of making the circuit-and-heat-dissipation assembly.

公开(公告)号：US09713454B2

公开(公告)日：2017-07-25

申请号：US14699488

申请日：2015-04-29

Applicant: Analogic Corporation

Inventor： Peter Daniel Shippen

IPC: A61B6/03 ,  A61B6/00 ,  H05K1/14 ,  H05K3/36

CPC classification number: A61B6/56 ,  A61B6/035 ,  H05K1/142 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/09018

Abstract: A computed tomography (CT) imaging modality includes a stator and a rotor that rotates relative to the stator. The CT imaging modality includes a radiation source and a detector array for detecting at least some of the radiation. A first data communication component is coupled to the stator or the rotor for transmitting data between the stator and the rotor. The first data communication component includes a first circuit board assembly including a first conductive layer and a first dielectric layer and a second circuit board assembly including a second conductive layer and a second dielectric layer. The second conductive layer of the second circuit board assembly faces the first conductive layer of the first circuit board assembly. An insulating layer is disposed between the first conductive layer of the first circuit board assembly and the second conductive layer of the second circuit board assembly.

公开(公告)号：US20170079135A1

公开(公告)日：2017-03-16

申请号：US15123215

申请日：2014-05-28

Applicant: INTEL CORPORATION

Inventor： Chuan HU ,  Adel A. ELSHERBINI ,  Yoshihiro TOMITA ,  Shawna LIFF

IPC: H05K1/02 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H05K1/0283 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/1515 ,  H01L2924/181 ,  H05K1/036 ,  H05K1/185 ,  H05K3/1275 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09263 ,  H05K2201/10151 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure describe a wavy interconnect for bendable and stretchable devices and associated techniques and configurations. In one embodiment, an interconnect assembly includes a flexible substrate defining a plane and a wavy interconnect disposed on the flexible substrate and configured to route electrical signals of an integrated circuit (IC) device in a first direction that is coplanar with the plane, the wavy interconnect having a wavy profile from a second direction that is perpendicular to the first direction and coplanar with the plane. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了用于可弯曲和可拉伸装置的波浪互连以及相关技术和配置。 在一个实施例中，互连组件包括限定平面的柔性衬底和布置在柔性衬底上的波纹互连，并且被配置成沿与平面共面的第一方向布置集成电路（IC）器件的电信号，波形 互连件具有从垂直于第一方向并与该平面共面的第二方向的波状轮廓。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09538650B2

公开(公告)日：2017-01-03

申请号：US14416116

申请日：2013-08-23

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Tomohiro Nishida ,  Seiji Mori ,  Makoto Wakazono

IPC: H05K1/11 ,  H01L21/56 ,  H01L23/14 ,  H01L23/498 ,  H01L23/12 ,  H01L23/13 ,  H01L23/00 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/563 ,  H01L23/12 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1161 ,  H01L2224/131 ,  H01L2224/13113 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32237 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/3512 ,  H01L2924/3841 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09018 ,  H05K2201/10977 ,  H05K2203/0594 ,  H05K2203/0597 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/014

Abstract: In a wiring substrate, formation of voids due to underfill filling failure is suppressed. A wiring substrate includes an insulating base layer, an insulating layer laminated on the base layer, and an electrically conductive connection terminal projecting from the insulating layer inside an opening. The insulating layer has a first surface with an opening, and a second surface located within the opening and being concave toward the base layer in relation to the first surface. The second surface extends from the first surface to the connection terminal inside the opening. On a cut surface which is a flat surface extending along a lamination direction in which the insulating layer is laminated on the base layer, an angle which is larger than 0° but smaller than 90° is formed between a normal line extending from an arbitrary point on the second surface toward the outside of the insulating layer and a parallel line extending from the arbitrary point toward the connection terminal in parallel to the first surface.

Abstract translation: 在布线基板中，由于底部填充不充分而形成空隙被抑制。 布线基板包括绝缘基底层，层叠在基底层上的绝缘层和从开口内的绝缘层突出的导电连接端子。 绝缘层具有带有开口的第一表面和位于开口内的第二表面，并且相对于第一表面朝向基底层凹陷。 第二表面从开口内的第一表面延伸到连接端。 在沿绝缘层层叠在基层上的层叠方向延伸的平坦面的切割面上，在从任意点延伸的法线之间形成大于0°但小于90°的角度 在所述第二表面上朝向所述绝缘层的外侧，以及从所述任意点朝向所述连接端子平行于所述第一表面延伸的平行线。

公开(公告)号：US20160088726A1

公开(公告)日：2016-03-24

申请号：US14656837

申请日：2015-03-13

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Man Bok JEON

IPC: H05K1/02 ,  H05K1/18 ,  H05K5/00 ,  H05K1/11 ,  G09G3/36 ,  G09G3/32

CPC classification number: H05K1/147 ,  G02F1/13452 ,  G09G2300/0408 ,  H01L27/3276 ,  H01L2251/5338 ,  H05K1/0281 ,  H05K2201/09018 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: A curved display device includes a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and an output wire unit connected to the driving chips, a printed circuit board (PCB) connected to the input wire unit of the semiconductor chip package, and a display panel including a display unit and a pad unit connected to the output wire unit of the semiconductor chip package, wherein the display panel, the semiconductor chip package, and the PCB are bendable in a first direction, and the driving chips of the of the semiconductor chip package are separated from each other in the first direction.

Abstract translation: 一种弯曲显示装置包括：半导体芯片封装，包括基膜，基膜上的多个驱动芯片，以及连接到驱动芯片的输入线单元和输出线单元，连接到驱动芯片的印刷电路板 所述半导体芯片封装的输入线单元以及连接到所述半导体芯片封装的输出线单元的显示单元和焊盘单元的显示面板，其中所述显示面板，所述半导体芯片封装和所述PCB可弯曲成 第一方向，并且半导体芯片封装的驱动芯片在第一方向上彼此分离。

公开(公告)号：US09258907B2

公开(公告)日：2016-02-09

申请号：US13570365

申请日：2012-08-09

Applicant: Stephen Gonya ,  Kenn Twigg ,  Jim Patterson

Inventor： Stephen Gonya ,  Kenn Twigg ,  Jim Patterson

IPC: H05K1/11 ,  H01B13/00 ,  H05K3/46 ,  H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0298 ,  H05K1/0284 ,  H05K1/053 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4644 ,  H05K2201/09018 ,  H05K2203/0315

Abstract: A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.

Abstract translation: 描述了制造共形非平面多层电路的方法。 该方法可以包括提供具有非平面表面的衬底和在衬底上沉积第一适形电介质层，第一保形电介质层与衬底的非平面表面一致并且具有非平面表面。 该方法还可以包括在第一保形电介质层上施加第一保形电路层。 该方法可以包括在第一共形电路层上沉积第二共形介电层，第二共形绝缘层与第一共形电路层的非平面表面一致，以及在第二共形介电层上施加第二共形电路层。 连续层可以顺序沉积。 微电极可以在电路层之间提供电连接。