公开(公告)号：US20100149765A1

公开(公告)日：2010-06-17

申请号：US12591920

申请日：2009-12-04

Applicant: Yoo-Jin Song

Inventor： Yoo-Jin Song

IPC: H05K5/00

CPC classification number: H05K7/20963 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10446 ,  H05K2201/2036

Abstract: A plasma display apparatus includes a plasma display panel (PDP), a chassis base secured on a first side to the PDP and having a driving circuit board mounted on a second side, a tower-shaped fixing unit that protrudes above the second side of the chassis base, and a back cover secured to a tower unit of the tower-shaped fixing unit to cover the driving circuit board.

Abstract translation: 一种等离子体显示装置，包括等离子体显示面板（PDP），固定在PDP的第一面上并具有安装在第二面上的驱动电路板的底架，在第二侧上方突出的塔形固定单元 底座，以及固定在塔形固定单元的塔架单元上以覆盖驱动电路板的后盖。

公开(公告)号：US07683266B2

公开(公告)日：2010-03-23

申请号：US11494744

申请日：2006-07-28

Applicant: Kiyoshi Shibata ,  Ryosuke Usui ,  Yasunori Inoue

Inventor： Kiyoshi Shibata ,  Ryosuke Usui ,  Yasunori Inoue

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/445 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09609 ,  H05K2201/0969 ,  H05K2203/0323 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165

Abstract: A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are formed on the top ends of the pierced holes, and depressions are formed in the bottom ends of the pierced holes. Wiring pattern layers are formed on both sides of this metal substrate via respective insulating layers. In order to establish electrical connection between the wiring pattern layers, a conductor layer which connects the wiring pattern layers is formed through the metal substrate via the pierced holes. The conductor layer thereby establishes electrical conduction between the wiring pattern layers. Furthermore, a semiconductor chip is directly connected to the surface side of the circuit board via solder balls.

Abstract translation: 一种电路板和使用该电路板的电路装置，其可以防止由于热膨胀而引起的位移和膜剥落，并且抑制在升高的温度下的可靠性降低。 电路装置的电路板包括具有穿孔作为芯构件的金属基板。 在穿孔的顶端形成突起，在穿孔的底端形成凹部。 接线图案层通过各自的绝缘层形成在该金属基板的两侧上。 为了建立布线图案层之间的电连接，通过穿孔穿过金属基板形成连接布线图案层的导体层。 导体层由此在布线图案层之间建立导电。 此外，半导体芯片通过焊球直接连接到电路板的表面侧。

公开(公告)号：US20100059786A1

公开(公告)日：2010-03-11

申请号：US12616773

申请日：2009-11-11

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The assembly provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，衬底和粘合剂。 半导体器件电连接到衬底并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部向上延伸到粘合剂中的开口和基底中的孔，并且基部从柱横向延伸。 粘合剂在柱和基底之间以及基底和基底之间延伸。 组件提供垫和终端之间的信号路由。

公开(公告)号：US20100052005A1

公开(公告)日：2010-03-04

申请号：US12616775

申请日：2009-11-11

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L23/34

CPC classification number: H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US20100046201A1

公开(公告)日：2010-02-25

申请号：US12333302

申请日：2008-12-11

Applicant: Cheng WANG ,  Jin-Shu HUANG

Inventor： Cheng WANG ,  Jin-Shu HUANG

IPC: G09F13/00 ,  F21V21/00

CPC classification number: H05K1/0204 ,  H01L2224/32188 ,  H01L2224/48091 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00014

Abstract: An electronic assembly includes a thermally-conductive substrate, a circuit board device and a plurality of light emitting diode (LED) devices. The circuit board device is disposed on the thermally-conductive substrate. The LED devices are disposed on the thermally-conductive substrate. The LED device includes a plurality of electrical connection portions and at least one thermal connection portion. The electrical connection portions are electrically connected to the circuit board device. The thermal connection portion is thermally connected to the thermally-conductive substrate. The connection locations of the circuit board device connected to the electrical connection portions and the connection location of the thermally-conductive substrate connected to the thermal connection portion are at a same plane. In addition, a backlight module applying the electronic assembly is also provided.

Abstract translation: 电子组件包括导热基板，电路板装置和多个发光二极管（LED）装置。 电路板装置设置在导热基板上。 LED装置设置在导热基板上。 LED装置包括多个电连接部分和至少一个热连接部分。 电连接部电连接到电路板装置。 热连接部分热连接到导热基板。 连接到电连接部分的电路板装置的连接位置和连接到热连接部分的导热基板的连接位置在同一平面。 此外，还提供了应用电子组件的背光模块。

公开(公告)号：US07649739B2

公开(公告)日：2010-01-19

申请号：US11526875

申请日：2006-09-26

Applicant: Makoto Murai ,  Ryosuke Usui ,  Yasuhiro Kohara

Inventor： Makoto Murai ,  Ryosuke Usui ,  Yasuhiro Kohara

IPC: H05K5/00

CPC classification number: H05K1/0206 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/0061 ,  H05K3/383 ,  H05K3/385 ,  H05K3/4652 ,  H05K2201/068 ,  H05K2201/09054 ,  H05K2201/2072 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.

Abstract translation: 电路装置在电路板和散热器之间的界面处具有优良的机械强度，并且具有优异的效率，用于通过电路板从电路元件散热至散热片。 电路装置包括用于安装电路元件的金属基绝缘板和安装有绝缘板的绝热板的散热器。 绝缘板具有沿着周边部分布置在面向散热器的表面上的突起。 突起的至少一部分通过膏层与散热片接触。

公开(公告)号：US07607790B2

公开(公告)日：2009-10-27

申请号：US11640587

申请日：2006-12-18

Applicant: Shou Lung Chen ,  Kwan Wah Ng ,  Ying Liu

Inventor： Shou Lung Chen ,  Kwan Wah Ng ,  Ying Liu

IPC: G09F13/04 ,  G02F1/13

CPC classification number: H05K1/0204 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133611 ,  H05K1/056 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/1572 ,  Y10S362/80

Abstract: Apparatuses for backlighting and manufacturing processes thereof are disclosed. There is provided a backlight module. The backlight module comprises a double-sided circuit board with thermal conducting material as one of the core layers; a plurality of light source components mounted on the first surface of the circuit board; and, a plurality of electronic components mounted on the second surface of the circuit board. The thermal conducting core layer discharges heat generated by the light source components. The circuit board has at least one window on the surface layer at the second surface to expose the thermal conducting core layer for thermal dissipation. As such, the component heights on the illuminating side of the circuit board are unified, and the reflector can be made as a smooth planar sheet to provide a more uniform backlight illumination compared to a single-side circuit board design. Further, such an arrangement reduces the complexity in manufacturing the reflector and hence the cost thereof.

Abstract translation: 公开了用于背光及其制造方法的装置。 提供背光模组。 背光模块包括具有导热材料作为芯层之一的双面电路板; 安装在电路板的第一表面上的多个光源组件; 以及安装在电路板的第二表面上的多个电子部件。 导热芯层对由光源部件产生的热量进行放电。 电路板在第二表面的表层上具有至少一个窗口，以露出导热芯层以进行散热。 因此，电路板的照明侧的部件高度是一体的，并且与单面电路板设计相比，反射器可以制成平滑的平面片材以提供更均匀的背光照明。 此外，这种布置降低了制造反射器的复杂性并因此降低了其成本。

公开(公告)号：US20090236707A1

公开(公告)日：2009-09-24

申请号：US12473477

申请日：2009-05-28

Applicant: Nan-Cheng Chen ,  Chun-Wei Chang ,  Chao-Wei Tseng

Inventor： Nan-Cheng Chen ,  Chun-Wei Chang ,  Chao-Wei Tseng

IPC: H01L23/34 ,  H01L23/495 ,  H01L23/498 ,  H01L23/48

CPC classification number: H05K7/205 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/0715 ,  H05K2201/09054 ,  H05K2201/10303 ,  H05K2201/10477 ,  H05K2201/10727

Abstract: An electronic device with enhanced heat spread. A printed circuit board is disposed in a casing and includes a first metal ground layer, a second metal ground layer, and a metal connecting portion. The first metal ground layer is opposite the second metal ground layer. The metal connecting portion is connected between the first and second metal ground layers. The second metal ground layer is connected to the casing. A chip is electrically connected to the printed circuit board and includes a die and a heat-conducting portion connected to the die and soldered with the first metal ground layer. Heat generated by the chip is conducted to the casing through the heat-conducting portion, first metal ground layer, metal connecting portion, and second metal ground layer.

Abstract translation: 具有增强散热性的电子设备。 印刷电路板设置在壳体中，并且包括第一金属接地层，第二金属接地层和金属连接部分。 第一金属接地层与第二金属接地层相对。 金属连接部分连接在第一和第二金属接地层之间。 第二金属接地层连接到外壳。 芯片电连接到印刷电路板，并且包括模具和连接到模具并与第一金属接地层焊接的导热部分。 由芯片产生的热量通过导热部分，第一金属接地层，金属连接部分和第二金属接地层传导到壳体。

公开(公告)号：US07580268B2

公开(公告)日：2009-08-25

申请号：US11316862

申请日：2005-12-27

Applicant: Takehide Miyazaki ,  Hirofumi Imabayashi ,  Katsumi Kanasaki ,  Akira Okada

Inventor： Takehide Miyazaki ,  Hirofumi Imabayashi ,  Katsumi Kanasaki ,  Akira Okada

IPC: H05K7/00

CPC classification number: H05K1/0263 ,  H05K1/0231 ,  H05K1/111 ,  H05K1/112 ,  H05K1/162 ,  H05K2201/0367 ,  H05K2201/09054 ,  H05K2201/09309 ,  H05K2201/10272 ,  H05K2201/10734

Abstract: A built-in capacitor type power feed device for an electrical component which solves the problems of the reduction in the noise margin of the power supply system accompanying the lower drive voltages of electrical components and the noise between the power supply and ground accompanying simultaneous switching waveforms, provided with a power supply for supplying power, a printed circuit board including a signal line pattern, a power bar having conductive projections provided in shapes and at positions corresponding to the shapes and positions of electrodes of the electrical component and provided outside of the printed circuit board, a ground bar provided outside of the printed circuit board, and a high dielectric layer provided at a part corresponding to the electrical component between the power bar and the ground bar, power from the power supply being fed to electrodes of the electrical component through the power bar and the ground bar.

Abstract translation: 一种内置电容式电气元件供电装置，其解决了随着电气元件的较低驱动电压和电源与地面之间的噪声伴随着同时开关波形而降低电源系统的噪声容限的问题 设置有用于供电的电源，包括信号线图案的印刷电路板，具有形状的导电突起的电源杆和与电气部件的电极的形状和位置相对应的位置，并设置在印刷的外部 电路板，设置在印刷电路板外部的接地棒，以及设置在与功率棒和接地棒之间的电气部件相对应的部分的高介电层，来自电源的电力被馈送到电气部件的电极 通过电源杆和接地棒。

公开(公告)号：US07561436B2

公开(公告)日：2009-07-14

申请号：US11160015

申请日：2005-06-06

Applicant: Scott D. Brandenburg ,  Bruce A. Myers

Inventor： Scott D. Brandenburg ,  Bruce A. Myers

IPC: H05K7/00

CPC classification number: H01L23/3675 ,  H01L23/36 ,  H01L23/3677 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit assembly containing a surface mount (SM) IC package wire bonded to a substrate and configured to conduct heat from the package into a heat sink through a heat-conducting member instead of the substrate. The package contains an IC device with input/output pads on a surface thereof that are connected with leads to conductors on the substrate. The heat sink is located adjacent the package so as not to be separated from the package by the substrate. The heat-conducting member is positioned adjacent the surface of the device opposite its input/output pads, and is bonded to the device and heat sink to provide a heat path between the package and heat sink that does not pass through the substrate.

Abstract translation: 一种电路组件，其包含结合到衬底上的表面安装（SM）IC封装线，并被配置为通过导热构件而不是衬底将热量从封装传导到散热器。 该封装包含IC器件，其表面上具有输入/输出焊盘，其与导体连接到衬底上的导体。 散热器位于封装附近，以便不被基板与封装分离。 导热构件邻近装置的与输入/输出垫相对的表面定位，并且结合到装置和散热器，以在封装和散热器之间提供不通过衬底的热路径。