公开(公告)号：US20050237365A1

公开(公告)日：2005-10-27

申请号：US11113576

申请日：2005-04-25

Applicant: Shuhei Hiwada

Inventor： Shuhei Hiwada

IPC: B41J2/045 ,  B41J2/05 ,  B41J2/055 ,  B41J2/14 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40

CPC classification number: B41J2/14209 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14459 ,  B41J2002/14491 ,  H05K3/0058 ,  H05K3/321 ,  H05K3/361 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/10977 ,  H05K2203/0195

Abstract: There is disclosed an electric device comprising: an actuator unit which includes a plurality of electrodes formed thereon; a printed wiring board which comprises: an electrically insulating flexible layer which has on one of its opposite sides protrusions for the respective electrodes, each of the protrusions forming a corresponding recess on the other side of the flexible layer; and a plurality of electrically conducting layers disposed on the respective protrusions to be in contact with the respectively corresponding electrodes; and a plurality of bonding parts each of which is in contact with one of the conducting layers and a corresponding one of the electrodes to completely cover a contact portion between the conducting layer and the electrode so as to maintain the contact therebetween.

Abstract translation: 公开了一种电气装置，包括：致动器单元，其包括形成在其上的多个电极; 一种印刷线路板，包括：电绝缘柔性层，其在相对侧的一个上相对于各个电极具有突起，每个突起在柔性层的另一侧上形成相应的凹部; 以及多个导电层，设置在各个突起上以与相应的电极接触; 以及多个接合部，其各自与导电层中的一个和相应的一个电极接触，以完全覆盖导电层和电极之间的接触部分，从而保持它们之间的接触。

公开(公告)号：US20050112913A1

公开(公告)日：2005-05-26

申请号：US10994826

申请日：2004-11-22

Applicant: Brooks Danley

Inventor： Brooks Danley

IPC: H01F5/04 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K1/00

CPC classification number: H01F5/04 ,  H01R12/59 ,  H05K1/189 ,  H05K3/306 ,  H05K2201/091 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/167

Abstract: Device and method including a generally flat and flexible circuit for electrically inter-connecting components therein are provided. The device includes a post including a recessed section configured to receive the flexible circuit through an opening in said circuit. The structures defining the opening in the flexible circuit may be configured to provide a snap-fit between the circuit and the recessed section of the post, and thus avoid undesirable movement of the flex circuit in the presence of vibration.

Abstract translation: 提供了一种包括用于电连接其中部件的大致扁平且柔性的电路的装置和方法。 该装置包括一个柱，该柱包括一个凹部，该凹部被构造成通过所述电路中的开口接收柔性电路。 限定柔性电路中的开口的结构可以被配置为在电路和柱的凹陷部分之间提供卡扣配合，并且因此避免在存在振动的情况下柔性电路的不期望的移动。

公开(公告)号：US20040262742A1

公开(公告)日：2004-12-30

申请号：US10876897

申请日：2004-06-25

Applicant: Tessera, Inc.

Inventor： Thomas H. DiStefano ,  John W. Smith ,  Tony Faraci

IPC: H01L023/10 ,  H01L023/34 ,  H01L023/02 ,  H01L023/04

CPC classification number: H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2224/81904 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H01L2924/00 ,  H01L2224/48

Abstract: A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a liquid material to form a compliant layer filling the space between the package element and the dielectric element, and surrounding the leads. The dielectric element and package element extend outwardly beyond the edges of the chip, and physically protect the chip. The assembly may be handled and mounted by conventional surface mounting techniques. The assembly may include additional circuit elements such as capacitors used in conjunction with the chip.

Abstract translation: 包括芯片的封装半导体芯片和诸如散热器的封装元件通过将芯片上的触点之间的柔性引线和诸如片材或板之类的电介质元件上的端子连接并将片或板远离芯片 并且注入液体材料以形成填充封装元件和电介质元件之间的空间并且围绕引线的柔性层。 介质元件和封装元件向外延伸超过芯片的边缘，并物理保护芯片。 组件可以通过常规的表面安装技术来处理和安装。 组件可以包括附加电路元件，例如与芯片结合使用的电容器。

公开(公告)号：US20030196830A1

公开(公告)日：2003-10-23

申请号：US10442396

申请日：2003-05-21

Applicant: 3M Innnovative Properties Company

Inventor： David C. Koskenmaki ,  Michael N. Miller ,  Naiyong Jing

IPC: H05K001/00

CPC classification number: H05B3/86 ,  G02F1/13439 ,  G02F1/155 ,  H05B3/286 ,  H05B2203/017 ,  H05K3/102 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0133 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/09827 ,  H05K2203/0278 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method for making a fine electrically conductive grid embedded in a polymer substrate. The method includes the steps of providing a polymer substrate, forming a pattern of grooves in the substrate, filling the grooves with electrically conductive powder, and then applying heat and/or pressure to the substrate. The application of heat and/or pressure to the substrate causes the grooves to collapse inward against the conductive powder. Collapsing the grooves compacts the conductive powder within the groove, thereby establishing a continuously conductive grid line or circuit. The narrow grid lines that result allow more light to transmit through the substrate. The method allows grid lines to be made with higher aspect ratios (ratio of line depth to line width) than is possible by previous methods.

Abstract translation: 一种制造嵌入聚合物基板中的精细导电栅格的方法。 该方法包括以下步骤：提供聚合物基材，在基材中形成凹槽图案，用导电粉末填充凹槽，然后向基材施加热和/或压力。 向衬底施加热和/或压力导致沟槽相对于导电粉末向内折叠。 折叠凹槽压缩凹槽内的导电粉末，从而建立连续导电的栅格线或电路。 导致的窄栅格线允许更多的光透过基板。 该方法允许以比以前的方法可能的更高的纵横比（线深度与线宽的比率）制成网格线。

公开(公告)号：US20030042045A1

公开(公告)日：2003-03-06

申请号：US09941058

申请日：2001-08-28

Inventor： David C. Koskenmaki ,  Michael N. Miller ,  Naiyong Jing

IPC: H05K001/11 ,  H01R012/04 ,  H05K003/10

CPC classification number: H05B3/86 ,  G02F1/13439 ,  G02F1/155 ,  H05B3/286 ,  H05B2203/017 ,  H05K3/102 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0133 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/09827 ,  H05K2203/0278 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method for making a fine electrically conductive grid embedded in a polymer substrate. The method includes the steps of providing a polymer substrate, forming a pattern of grooves in the substrate, filling the grooves with electrically conductive powder, and then applying heat and/or pressure to the substrate. The application of heat and/or pressure to the substrate causes the grooves to collapse inward against the conductive powder. Collapsing the grooves compacts the conductive powder within the groove, thereby establishing a continuously conductive grid line or circuit. The narrow grid lines that result allow more light to transmit through the substrate. The method allows grid lines to be made with higher aspect ratios (ratio of line depth to line width) than is possible by previous methods.

Abstract translation: 一种制造嵌入聚合物基板中的精细导电栅格的方法。 该方法包括以下步骤：提供聚合物基材，在基材中形成凹槽图案，用导电粉末填充凹槽，然后向基材施加热和/或压力。 向衬底施加热和/或压力导致沟槽相对于导电粉末向内折叠。 折叠凹槽压缩凹槽内的导电粉末，从而建立连续导电的栅格线或电路。 导致的窄栅格线允许更多的光透过基板。 该方法允许以比以前的方法可能的更高的纵横比（线深度与线宽的比率）制成网格线。

公开(公告)号：US20030027374A1

公开(公告)日：2003-02-06

申请号：US10255297

申请日：2002-09-26

Inventor： Zlata Kovac ,  Craig S. Mitchell ,  Thomas H. DiStefano ,  John W. Smith

IPC: H01L021/58

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

Abstract: A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.

公开(公告)号：US06461896B1

公开(公告)日：2002-10-08

申请号：US09565070

申请日：2000-05-05

Applicant: Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

Inventor： Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

IPC: H01L2144

CPC classification number: H05K1/111 ,  H01L21/563 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2225/1023 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10674 ,  H05K2203/1581 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/00

Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.

公开(公告)号：US06417997B1

公开(公告)日：2002-07-09

申请号：US09865814

申请日：2001-05-25

Applicant: Stephen P. Williams

Inventor： Stephen P. Williams

IPC: G11B548

CPC classification number: G11B5/4846 ,  G11B5/4853 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/091 ,  H05K2201/10772 ,  H05K2201/2036 ,  Y10T29/49144

Abstract: Mechanically formed standoffs in a disk drive integrated circuit interconnect reduces the cost of manufacturing and improves the reliability of the electrical interconnections thereof. Connection pads defined along the interconnect are bonded with bonding pads of a signal producing source and a signal processing source. The standoffs provide mechanical stops during the bonding process, enabling sufficient bonding material to form between bonding areas. The standoffs are mechanically formed with a punch and die assembly either directly through a bonding pad predefined along traces on the interconnect or adjacent the bonding pad. The standoffs formed through the bonding pads are covered with solder or other electrically conductive bonding material.

Abstract translation: 在磁盘驱动器集成电路互连中机械地形成的支座降低了制造成本并提高了其电互连的可靠性。 沿着互连件限定的连接焊盘与信号产生源和信号处理源的焊盘接合。 在接合过程中，间隙提供机械停止，使得能够在接合区域之间形成足够的接合材料。 该支座通过冲头和模具组件机械地形成，该冲头和模具组件可以直接通过沿着互连线上的迹线预定的接合焊盘，或者与焊盘相邻。 通过焊盘形成的支座被焊料或其它导电粘合材料覆盖。

公开(公告)号：US20020014518A1

公开(公告)日：2002-02-07

申请号：US09907599

申请日：2001-07-19

Inventor： Makoto Totani ,  Toshihiro Miyake ,  Tomohiro Yokochi ,  Takehito Teramae ,  Yoshitaro Yazaki ,  Kazuyuki Deguchi ,  Hajime Nakagawa

IPC: B23K031/02

CPC classification number: H05K3/363 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10772 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/065

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract translation: 形成在柔性印刷电路板上的焊盘通过焊料与刚性印刷电路板上形成的焊盘电连接。 此时，在刚性印刷电路板上的相邻的两个焊盘之间形成阻焊剂，并且端接有刚性印刷电路板和柔性印刷电路板之间的端部。 因此，即使剩余焊料被挤出到刚性印刷电路板上，阻焊剂也可以防止在焊盘之间形成焊料桥。

公开(公告)号：US06265765B1

公开(公告)日：2001-07-24

申请号：US08935962

申请日：1997-09-23

Applicant: Thomas H. DiStefano ,  John W. Smith ,  Tony Faraci

Inventor： Thomas H. DiStefano ,  John W. Smith ,  Tony Faraci

IPC: H01L2302

CPC classification number: H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2224/81904 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H01L2924/00 ,  H01L2224/48

Abstract: A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the chip, and injecting a liquid material to form a compliant layer filling the space between the package element and the dielectric element, and surrounding the leads. The dielectric element and package element extend outwardly beyond the edges of the chip, and physically protect the chip. The assembly may be handled and mounted by conventional surface mounting techniques. The assembly may include additional circuit elements such as capacitors used in conjunction with the chip.