公开(公告)号：US09258897B2

公开(公告)日：2016-02-09

申请号：US13484381

申请日：2012-05-31

Applicant: Teruyuki Ishihara ,  Hidetoshi Noguchi ,  Hirofumi Futamura

Inventor： Teruyuki Ishihara ,  Hidetoshi Noguchi ,  Hirofumi Futamura

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K1/183 ,  H05K3/3452 ,  H05K3/4691 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/09136 ,  H05K2201/09854 ,  Y10T29/49128

Abstract: A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad.

Abstract translation: 布线基板具有在层叠结构体的第一表面侧具有凹部的层叠结构，在层叠结构体的与第一面侧相反一侧的第二面侧的阻焊层。 该叠层结构具有形成在该凹部的底部的第一表面侧焊盘和形成在层叠结构的第二表面侧的第二表面侧焊盘，该阻焊层具有第一开口部和第二开口 所述第一开口部露出所述第二表面侧焊盘，所述第二开口部形成在所述凹部的背面，所述凹部的背面不包括所述第二表面侧焊盘， 表面侧垫

公开(公告)号：US20150366102A1

公开(公告)日：2015-12-17

申请号：US14737943

申请日：2015-06-12

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Haruhiko MORITA ,  Takashi KARIYA

IPC: H05K7/20 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/429 ,  H01L23/367 ,  H01L2924/0002 ,  H05K1/0207 ,  H05K1/0209 ,  H05K3/4608 ,  H05K2201/09127 ,  Y10T29/49126 ,  Y10T29/49167 ,  H01L2924/00

Abstract: An electronic circuit apparatus includes a circuit substrate, a heat generating component positioned on the circuit substrate, a metal plate forming a portion of an inner layer of the circuit substrate and protruding from a side surface of the circuit substrate such that the metal plate has an exposed portion exposed to outside the circuit substrate, and an external component connected to the exposed portion of the metal plate and including one of an external heat dissipation component and an external cooling component.

Abstract translation: 电子电路装置包括电路基板，位于电路基板上的发热部件，形成电路基板的内层的一部分的金属板，从电路基板的侧面突出，使得金属板具有 露出部分暴露于电路基板外部，外部部件连接到金属板的暴露部分，并且包括外部散热部件和外部冷却部件之一。

公开(公告)号：US20150357275A1

公开(公告)日：2015-12-10

申请号：US14596770

申请日：2015-01-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-hun Jeon ,  Ho-jin Chun ,  Hyun-seok Cha ,  Jae-hoon Heo ,  Young-deok Kim

IPC: H01L23/498 ,  H05K1/18

CPC classification number: H05K1/181 ,  G11C5/063 ,  H01L23/538 ,  H01L24/16 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16225 ,  H05K1/0268 ,  H05K1/0286 ,  H05K3/4694 ,  H05K2201/09127 ,  H05K2201/09972

Abstract: A printed circuit board includes an in-line PCB region comprising an input/output control region including a first conductive line, and a main PCB region coupled to the in-line PCB region and comprising a semiconductor chip and an input/output signal generation region including a second conductive line. The input/output signal generation region is configured to detect whether or not the first and second conductive lines are electrically connected and to provide an input/output control signal to the semiconductor chip in response to determining whether or not the first and second conductive lines are electrically connected.

Abstract translation: 一种印刷电路板包括一个在线PCB区域，包括一个输入/输出控制区域，该输入/输出控制区域包括一个第一导线，以及一个连接到该在线PCB区域的主PCB区域，包括一个半导体芯片和一个输入/输出信号产生区域 包括第二导线。 输入/输出信号产生区域被配置为检测第一和第二导线是否电连接，并且响应于确定第一和第二导线是否是第一和第二导线是否被提供到半导体芯片的输入/输出控制信号 电连接。

公开(公告)号：US09198304B2

公开(公告)日：2015-11-24

申请号：US13441932

申请日：2012-04-09

Applicant: Biao Li

Inventor： Biao Li

IPC: H05K3/02 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K3/4691 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/308 ,  Y10T29/49155

Abstract: A method for manufacturing a rigid-flexible printed circuit board includes following steps. First, a flexible PCB is provided. The flexible PCB includes a base and an electrical trace layer on the base. The flexible PCB includes a first region and a second region connected to the first region. The first and second regions define a borderline. Second, a protective film and a peelable layer are sequentially formed on the electrical trace layer in the first region and part of the second region. Third, a copper coil, an adhesive tape and the flexible circuit board are laminated together. Fourth, the copper coil in the second region is etched to form an outer electrical trace layer. Last, the copper coil in the first region is removed and the peelable layer and the adhesive tape are peeled off, thereby obtaining an R-F PCB.

Abstract translation: 制造刚性柔性印刷电路板的方法包括以下步骤。 首先，提供柔性PCB。 柔性PCB包括底座和底座上的电迹线层。 柔性PCB包括连接到第一区域的第一区域和第二区域。 第一个和第二个区域定义了一个边界。 其次，在第一区域和第二区域的一部分中的电迹线层上依次形成保护膜和可剥离层。 第三，铜线圈，胶带和柔性电路板层压在一起。 第四，蚀刻第二区域中的铜线圈以形成外部电迹线层。 最后，去除第一区域中的铜线圈，并剥离可剥离层和胶带，从而获得R-F PCB。

公开(公告)号：US20150282320A1

公开(公告)日：2015-10-01

申请号：US14666376

申请日：2015-03-24

Applicant: NEC Corporation

Inventor： Wenda HAO

IPC: H05K1/14 ,  H05K7/14

CPC classification number: H05K1/141 ,  H05K3/366 ,  H05K7/1485 ,  H05K7/1487 ,  H05K2201/044 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09127

Abstract: An electronic device includes a substrate having a connector formed on a main face, and a module having a terminal detachably connected to the connector of the substrate. The module includes an extended part which projects below the terminal in an installation direction. The substrate includes a bypass part which bypasses the extended part when the module is connected to the substrate. The bypass part is a cutout or a recess formed in the substrate. The extended part accommodates a plurality of components aligned in the installation direction. The extended part is extended from the lower end of the module by a difference between a first size, corresponding to multiple times the size of each component, and a second size ranging from the upper end of the module to the end of the terminal.

Abstract translation: 电子设备包括具有形成在主面上的连接器的基板和具有可拆卸地连接到基板的连接器的端子的模块。 该模块包括在安装方向上在终端下方突出的延伸部分。 当该模块连接到基板时，该基板包括旁路部分，旁路部分绕该延伸部分。 旁路部分是形成在基板中的切口或凹部。 延伸部容纳沿安装方向对准的多个部件。 扩展部分从模块的下端通过与每个部件的大小相对应的第一尺寸和从模块的上端到终端的端部的第二尺寸之间的差来延伸。

公开(公告)号：US20150108630A1

公开(公告)日：2015-04-23

申请号：US14459384

申请日：2014-08-14

Applicant: FUJITSU LIMITED

Inventor： Takaharu IZUNO ,  Osamu SAITO ,  Mitsuaki HAYASHI ,  Kenji JOKO ,  Hideaki MATSUMOTO ,  Minoru FUJII

IPC: H01L23/34 ,  H01L21/50

CPC classification number: H05K1/021 ,  H01L21/50 ,  H01L23/367 ,  H01L23/4006 ,  H01L23/4012 ,  H01L23/42 ,  H01L23/49833 ,  H01L2023/4043 ,  H01L2023/405 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/0203 ,  H05K1/0278 ,  H05K1/147 ,  H05K1/181 ,  H05K3/4629 ,  H05K3/4691 ,  H05K2201/066 ,  H05K2201/09081 ,  H05K2201/09127 ,  H05K2201/10409 ,  H05K2203/0195

Abstract: An electronic device includes a first circuit board; a heat sink fixed to the first circuit board to form a cavity between the heat sink and the first circuit board; and a plurality of electronic components fixed to a surface of the heat sink facing the first circuit board inside the cavity, the plurality of electric components having heights different from each other, wherein each of the plurality of electronic components is electrically coupled to the first circuit board by a second circuit board and being different from the first circuit board.

Abstract translation: 电子设备包括第一电路板; 固定在所述第一电路板上以在所述散热片和所述第一电路板之间形成空腔的散热片; 以及多个电子部件，其固定到所述散热器的面对所述空腔内的所述第一电路板的表面，所述多个电部件具有彼此不同的高度，其中所述多个电子部件中的每一个电耦合到所述第一电路 由第二电路板板和不同于第一电路板。

公开(公告)号：US20140353014A1

公开(公告)日：2014-12-04

申请号：US14295121

申请日：2014-06-03

Applicant: MUTUAL-TEK INDUSTRIES CO., LTD.

Inventor： Wen-Chin Lai

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/40

CPC classification number: H05K3/4691 ,  H05K3/4611 ,  H05K2201/09127 ,  Y10T29/49165

Abstract: A combined circuit board including a flexible circuit board (FCB), a rigid circuit board (RCB), and first and second conductive vias (CVs) is provided. The FCB includes a flexible dielectric layer (DL) and a circuit layer (CL) disposed thereon. The RCB includes a rigid DL and a CL including a main circuit (MC) and an out connection interface circuit (OCIC). The rigid DL is disposed on the FCB and includes first and second rigid dielectric portions (RDPs) apart from each other by a distance such that part of the FCB is exposed outside. The MC and the OCIC are disposed on the first and the second RDPs, respectively. The first CV disposed in the second RDP electrically connects a contact of the OCIC and the CL of the FCB. The second CV disposed in the first RDP electrically connects the MC and the CL of the FCB.

Abstract translation: 提供了包括柔性电路板（FCB），刚性电路板（RCB）和第一和第二导电通孔（CV）的组合电路板。 FCB包括设置在其上的柔性介电层（DL）和电路层（CL）。 RCB包括刚性DL和包括主电路（MC）和输出连接接口电路（OCIC）的CL。 刚性DL设置在FCB上并且包括彼此分开一定距离的第一和第二刚性介质部分（RDP），使得FCB的一部分暴露在外部。 MC和OCIC分别设置在第一和第二RDP上。 设置在第二RDP中的第一个CV电连接OCIC的触点和FCB的CL。 设置在第一个RDP中的第二个CV将FC和FC的CL电连接。

公开(公告)号：US08880165B2

公开(公告)日：2014-11-04

申请号：US13009769

申请日：2011-01-19

Applicant: Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

Inventor： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC: A61N1/00 ,  A61N1/36 ,  A61N1/05 ,  A61N1/375 ,  H01L23/498 ,  H05K3/36 ,  H05K1/03 ,  H05K3/46 ,  H05K3/32 ,  H05K3/42 ,  H01L21/56 ,  H05K3/40

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20140305683A1

公开(公告)日：2014-10-16

申请号：US14095878

申请日：2013-12-03

Applicant: Zhen Ding Technology Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd.

Inventor： BIAO LI

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/14 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/0909 ,  H05K2201/09109 ,  H05K2201/09127 ,  Y10T29/302

Abstract: A compact rigid-flexible board includes two flexible PCBs, two rigid substrates, a third trace layer and a fourth trace layer. The first flexible PCB includes a first depressing portion, a first exposed portion and a third depressing portion, and a separated second exposed portion. The second flexible PCB includes fourth and fifth depressing portions, and a second exposed portion. The first rigid substrate includes sixth, seventh, and eighth depressing portions. The second rigid substrate includes ninth and tenth depressing portions. The third trace layer, the sixth, first, fourth, and ninth depressing portions and the fourth trace layer are stacked in sequence. The third trace layer, the seven, second, fifth, and tenth depressing portions, and the fourth trace layer are stacked in sequence. The third trace layer and the eighth and third depressing portions are stacked in sequence.

Abstract translation: 紧凑的刚性柔性板包括两个柔性PCB，两个刚性基板，第三轨迹层和第四轨迹层。 第一柔性PCB包括第一按压部分，第一暴露部分和第三按压部分，以及分离的第二暴露部分。 第二柔性PCB包括第四和第五按压部分和第二暴露部分。 第一刚性基板包括第六，第七和第八按压部分。 第二刚性基板包括第九和第十按压部。 第三迹线层，第六，第一，第四和第九按压部分和第四迹线层依次层叠。 第三迹线层，七，第二，第五和第十按压部分和第四迹线层依次层叠。 第三迹线层和第八和第三按压部分依次层叠。

公开(公告)号：US20140182899A1

公开(公告)日：2014-07-03

申请号：US14133464

申请日：2013-12-18

Applicant: ZHEN DING TECHNOLOGY CO., LTD. ,  FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.

Inventor： BIAO LI

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4691 ,  H05K3/462 ,  H05K2201/09127 ,  Y10T156/1082

Abstract: A rigid-flexible printed circuit board includes a first circuit substrate, a third circuit substrate, and an adhesive sheet sandwiched between the first circuit substrate and the third circuit substrate. The first circuit substrate is a rigid circuit substrate. The third circuit substrate is a flexible circuit substrate, and includes an exposed area and two lamination areas. The exposed area is sandwiched between the two lamination areas. The first circuit substrate and the adhesive sheet are only laminated onto the two lamination areas. A dielectric layer of the first circuit substrate is a rigid epoxy glass cloth laminate, and a dielectric layer of the third circuit substrate is a flexible epoxy glass cloth laminate.

Abstract translation: 刚性柔性印刷电路板包括第一电路基板，第三电路基板和夹在第一电路基板和第三电路基板之间的粘合片。 第一电路基板是刚性电路基板。 第三电路基板是柔性电路基板，并且包括暴露区域和两个层叠区域。 暴露区域夹在两个层压区域之间。 第一电路基板和粘合片仅层叠在两个层叠区域上。 第一电路基板的电介质层是刚性环氧玻璃布层叠体，第三电路基板的电介质层是柔性环氧玻璃布层叠体。