公开(公告)号：US20100282499A1

公开(公告)日：2010-11-11

申请号：US12840792

申请日：2010-07-21

Applicant: Tomofumi KITADA ,  Hiroki MARUO ,  Ryo TAKAMI

Inventor： Tomofumi KITADA ,  Hiroki MARUO ,  Ryo TAKAMI

IPC: H05K1/03

CPC classification number: H05K3/363 ,  H01L2924/0002 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/09845 ,  H01L2924/00

Abstract: A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.

公开(公告)号：US07808796B2

公开(公告)日：2010-10-05

申请号：US11852888

申请日：2007-09-10

Applicant: Hidefumi Hatanaka ,  Tsutomu Adachi ,  Youichi Yokote ,  Miho Imashioya ,  Tomohiko Taniguchi

Inventor： Hidefumi Hatanaka ,  Tsutomu Adachi ,  Youichi Yokote ,  Miho Imashioya ,  Tomohiko Taniguchi

IPC: H05K7/00

CPC classification number: H05K1/183 ,  H01L23/552 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/49109 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10689 ,  Y10T29/49133 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic component module comprises a circuit board having a cavity in one principal surface thereof. The electronic component module also comprises a first semiconductor device accommodated within the cavity and a second semiconductor device disposed on the one principal surface of the circuit board so as to cover the first semiconductor device in plan view. The electronic component module further comprises a resin material disposed to cover at least a side surface of the second semiconductor device.

Abstract translation: 电子部件模块包括其一个主表面中具有空腔的电路板。 电子部件模块还包括容纳在腔内的第一半导体器件和设置在电路板的一个主表面上的第二半导体器件，以便在平面图中覆盖第一半导体器件。 电子部件模块还包括设置成覆盖第二半导体器件的至少侧面的树脂材料。

公开(公告)号：US20100238635A1

公开(公告)日：2010-09-23

申请号：US12789247

申请日：2010-05-27

Applicant: Ruiquan Yang ,  Haiqiang Sheng ,  Hongcai Li

Inventor： Ruiquan Yang ,  Haiqiang Sheng ,  Hongcai Li

IPC: H05K7/00 ,  H05K3/10

CPC classification number: H05K1/0243 ,  H05K1/021 ,  H05K1/024 ,  H05K1/025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/11 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/4688 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2201/10416 ,  H05K2203/063

Abstract: A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.

Abstract translation: 提供印刷电路板（PCB）。 PCB包括被压在一起的第一微波板材料，第二预浸料坯和第三普通板材料。 第一微波板材料，第二预浸料坯和第三普通板材分别设置有开口。 至少两个开口具有不同的尺寸。 在具有不同尺寸的至少两个开口的边界之间的区域中，提供钻孔以穿过该区域中的板材料。 有选择地使用后钻孔。 进一步提供射频装置及其制造方法。 因此，它适用于在同一单板上设计不同的电源模块和其他电路模块，并且与现有的基本PCB制造技术相兼容，这进一步具有低成本，并且可以满足大功率射频 不同频率的电路

公开(公告)号：US07795736B2

公开(公告)日：2010-09-14

申请号：US11715624

申请日：2007-03-08

Applicant: Jiun Hann Sir ,  Eng Huat Goh

Inventor： Jiun Hann Sir ,  Eng Huat Goh

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K1/115 ,  H05K3/423 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2203/0733 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments include interconnect of electrically conductive material with a contact surface, and a dielectric layer overlying the contact surface with a trench and via in the dielectric layer, the via extending to the contact surface. An interlock material is in the via with an interlock opening extending through the interlock material and into the interconnect. A layer of electroless material is on the base of the trench and the surfaces of the via, interlock material, and interlock opening. An subsequent interconnect is formed on the electroless material, in the trench, via, and interlock openings. The structure can be repeated to form a stack or column of interconnects that resist delamination.

Abstract translation: 实施例包括导电材料与接触表面的互连以及覆盖接触表面的电介质层，其中沟槽和电介质层中的通孔延伸到接触表面。 互锁材料在通孔中，具有延伸穿过互锁材料并进入互连件的互锁开口。 无电解材料层位于沟槽的底部和通孔，互锁材料和互锁开口的表面上。 在无电解材料，沟槽，通孔和互锁开口中形成随后的互连。 可以重复该结构以形成抵抗分层的互连的堆叠或列。

公开(公告)号：US20100220448A1

公开(公告)日：2010-09-02

申请号：US12781857

申请日：2010-05-18

Applicant: Masato NOMURA

Inventor： Masato NOMURA

IPC: H05K7/00

CPC classification number: H05K1/186 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/4605 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09845 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/49206 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A component-containing module includes a core substrate which includes a lower surface including recessed portions and a raised portion, and an upper surface facing the lower surface and which includes a plurality of in-plane conductors, an integrated circuit element arranged at a location which is above the upper surface and which corresponds to the raised portion, a first passive element and a second passive element disposed in the recessed portions of the lower surface, a composite resin layer which underlies the lower surface and which has a flat or substantially flat surface, and an external terminal electrode which is disposed on the flat or substantially flat surface of the composite resin layer and which is electrically connected to the in-plane conductors of the core substrate. The component-containing module enables electronic components, such as integrated circuit elements and passive elements, to be densely arranged and to be reduced in profile and size.

Abstract translation: 含有元件的模块包括：芯基板，其包括具有凹部和凸起部分的下表面，以及面向下表面的上表面，并且包括多个面内导体，集成电路元件，其布置在 在上表面上方并且对应于凸起部分，第一无源元件和设置在下表面的凹部中的第二无源元件，复合树脂层，其在下表面下方并且具有平坦或基本平坦的表面 以及外部端子电极，其设置在复合树脂层的平坦或基本上平坦的表面上并且电连接到芯基板的面内导体。 含元件的模块使诸如集成电路元件和无源元件之类的电子元件能够紧密地布置并且在外形和尺寸上减小。

公开(公告)号：US07777308B2

公开(公告)日：2010-08-17

申请号：US12259824

申请日：2008-10-28

Applicant: Se-Young Yang ,  Sun-Won Kang ,  Yeo-Hoon Yoon

Inventor： Se-Young Yang ,  Sun-Won Kang ,  Yeo-Hoon Yoon

IPC: H01L23/495

CPC classification number: H01L23/49555 ,  H01L23/49575 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3426 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10757 ,  Y02P70/613 ,  H01L2924/00

Abstract: Integrated circuit packages include an integrated circuit mounting substrate having a hole that defines an inner wall of the integrated circuit mounting substrate. An integrated circuit is provided in the hole. A sinuous lead frame extends from the integrated circuit and is connected to the inner wall. The sinuous lead frame extends back and forth along a given direction, and may include a U- and/or V-shape, and round and/or jagged portions. Related packaging methods are also disclosed.

Abstract translation: 集成电路封装包括具有限定集成电路安装基板的内壁的孔的集成电路安装基板。 在孔中设置集成电路。 引线框架从集成电路延伸并连接到内壁。 弯曲的引线框架沿着给定的方向来回延伸，并且可以包括U形和/或V形，以及圆形和/或锯齿形部分。 还公开了相关的包装方法。

公开(公告)号：US20100193225A1

公开(公告)日：2010-08-05

申请号：US12689353

申请日：2010-01-19

Applicant: Tomoyuki Abe ,  Norikazu Ozaki

Inventor： Tomoyuki Abe ,  Norikazu Ozaki

IPC: H05K1/09 ,  H05K1/11 ,  B44C1/22

CPC classification number: H05K1/167 ,  H05K3/108 ,  H05K3/243 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4641 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/0597 ,  H05K2203/1184 ,  H05K2203/1476

Abstract: Provided is a circuit board including a resin base, and a resistance element formed above the resin base. The resistance element includes a resistance pattern including an electrode portion and an extending portion, and an electrode formed on the electrode portion of the resistance pattern and including a foot portion reduced in thickness toward the extending portion.

Abstract translation: 提供了一种电路板，包括树脂基底和形成在树脂基底上方的电阻元件。 电阻元件包括电阻图案，其包括电极部分和延伸部分，以及电极，形成在电阻图案的电极部分上，并且包括朝向延伸部分减小厚度的脚部分。

公开(公告)号：US20100170700A1

公开(公告)日：2010-07-08

申请号：US12377134

申请日：2008-05-28

Applicant: Tadashi Nakamura ,  Fumio Echigo ,  Takayuki Kita ,  Kota Fukasawa ,  Shogo Hirai

Inventor： Tadashi Nakamura ,  Fumio Echigo ,  Takayuki Kita ,  Kota Fukasawa ,  Shogo Hirai

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4697 ,  H05K1/183 ,  H05K1/189 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/09972 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/061 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.

Abstract translation: 通过粘接具有不同形状的上下印刷电路板并且在其表面上形成布线来制造实心印刷电路板。 接合层由含有分散在其中的热固性树脂和无机填料的绝缘材料制成，并且具有填充在接合层的预定位置穿孔的通孔的由导电膏制成的通孔导体。 该电路板提供了实现小尺寸和厚度的三维安装，适用于高性能和多引脚结构半导体的封装结构。

公开(公告)号：US20100147568A1

公开(公告)日：2010-06-17

申请号：US12713199

申请日：2010-02-26

Applicant: Masato NOMIYA

Inventor： Masato NOMIYA

IPC: H05K1/09 ,  H05K1/03

CPC classification number: H05K3/403 ,  H01L23/15 ,  H01L23/49805 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09845 ,  H01L2924/00

Abstract: A ceramic multilayer substrate in which cracks resulting from the difference in shrinkage caused by heat or thermal shrinkage caused by firing can be prevented effectively between an end surface electrode and a substrate main body. The substrate main body includes alternately stacked first and second ceramic layers, and including first recesses provided in end surfaces of at least two adjacent ceramic layers so as to communicate with each other, and an electroconductive end surface electrode is disposed in the first recesses in the substrate main body. The first and the second ceramic layer each have a sintering start temperature and a sintering end temperature, and at least one of the sintering start temperature and the sintering end temperature is different between the first and the second ceramic layer. The substrate main body has a second recess in at least one of the ceramic layers having the first recesses so as to communicate with the first recess and lie between other ceramic layers. In the second recess, an electroconductive protrusion connected to the end surface electrode is disposed.

Abstract translation: 能够有效地防止由端面电极和基板主体之间有效地防止由烧成引起的热或热收缩引起的收缩差产生的龟裂的陶瓷多层基板。 基板主体包括交替堆叠的第一和第二陶瓷层，并且包括设置在至少两个相邻陶瓷层的端表面中的第一凹部，以便彼此连通，并且导电端面电极设置在第一凹部中 基板主体。 第一陶瓷层和第二陶瓷层各自具有烧结开始温度和烧结结束温度，第一陶瓷层和第二陶瓷层的烧结开始温度和烧结结束温度中的至少一个不同。 所述基板主体在至少一个所述陶瓷层中具有第二凹部，所述第二凹部具有所述第一凹部，以便与所述第一凹部连通并位于其它陶瓷层之间。 在第二凹部中设置与端面电极连接的导电性突起。

公开(公告)号：US20100103651A1

公开(公告)日：2010-04-29

申请号：US12532105

申请日：2008-03-18

Applicant: Jun Seok Park

Inventor： Jun Seok Park

IPC: G09F13/04 ,  H05K1/11 ,  H05K7/20

CPC classification number: H05K1/142 ,  G02F1/133603 ,  G02F2001/133612 ,  H05K3/403 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/10106

Abstract: The LED module comprises a first and a second printed circuit boards comprising one surface formed with at least one of concave and convex parts so that the first and the second printed circuit boards are coupled to each other, and an LED on at least one of the first and the second printed circuit boards, in which a concave part is formed at a portion of a coupling surface of the second printed circuit board corresponding to a convex part formed at a portion of a coupling surface of the first printed circuit board, and an insulating layer is formed at a portion of the coupling surface of the second printed circuit board so as to support a convex part of the first printed circuit board.

Abstract translation: LED模块包括第一和第二印刷电路板，其包括形成有凹部和凸部中的至少一个的一个表面，使得第一和第二印刷电路板彼此耦合，并且在至少一个 第一印刷电路板和第二印刷电路板，其中在与形成在第一印刷电路板的耦合表面的一部分处的凸部对应的第二印刷电路板的耦合表面的一部分处形成有凹部， 绝缘层形成在第二印刷电路板的耦合表面的一部分处以支撑第一印刷电路板的凸部。