公开(公告)号：US20020134577A1

公开(公告)日：2002-09-26

申请号：US10101758

申请日：2002-03-21

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Nagahisa Watanabe

IPC: H05K003/34

CPC classification number: H05K3/3442 ,  H05K1/111 ,  H05K3/3421 ,  H05K3/3452 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/09709 ,  H05K2201/099 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A printed circuit board includes a substrate having a mounting surface on which a surface mount device having at least one terminal is to be mounted. On the mounting surface, at least one footprint is arranged and positioned to align with the terminal. The footprint comprises a plurality of patterned parts and a plurality of solder layers formed on the patterned parts, respectively. Each patterned part is so shaped to limit a region in which molten solder flows when the solder layer is melted.

Abstract translation: 印刷电路板包括具有安装表面的基板，具有至少一个端子的表面安装装置将安装在该安装表面上。 在安装表面上，布置和定位至少一个覆盖区以与终端对准。 覆盖区分别包括多个图案化部分和分别形成在图案部分上的多个焊料层。 当焊料层熔化时，每个图案化部分被成形为限制熔融焊料流动的区域。

公开(公告)号：US06448504B1

公开(公告)日：2002-09-10

申请号：US09330939

申请日：1999-06-11

Applicant: Sawori Taguchi

Inventor： Sawori Taguchi

IPC: H05K103

CPC classification number: H05K1/111 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board with a reinforcing pattern. The printed circuit board includes lands formed in a wiring pattern at positions corresponding to formation positions of external connection electrode terminals, a pattern protective film having openings which are opened at the formation positions of the lands; wherein the diameter of each of the openings of the pattern protective film is set to be larger than the outside diameter of each of the lands, and a reinforcing pattern extends outwardly from the outer peripheral edge of each of the lands and the extension end of the reinforcing pattern is covered with the pattern protective film, thereby preventing occurrence of cracks in solder balls formed on the lands and enhancing the shear strength of the solder balls.

Abstract translation: 具有加强图案的印刷电路板。 印刷电路板包括在与外部连接电极端子的形成位置相对应的位置处形成在布线图案中的焊盘，具有在焊盘的形成位置处开口的开口的图案保护膜; 其中图案保护膜的每个开口的直径设定为大于每个焊盘的外径，并且加强图案从每个焊盘的外周边缘向外延伸，并且， 加强图案被图案保护膜覆盖，从而防止在焊盘上形成的焊球中产生裂缝，并提高焊球的剪切强度。

公开(公告)号：US20020112881A1

公开(公告)日：2002-08-22

申请号：US09946902

申请日：2001-09-05

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Chien-Ping Huang ,  Tzong-Da Ho ,  Chen-Hsu Hsiao

IPC: H05K001/03

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3114 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/92147 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K3/284 ,  H05K3/3452 ,  H05K2201/09781 ,  H05K2201/099 ,  Y10S438/976 ,  Y10T29/49174 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A substrate of a semiconductor package is proposed, which is formed with a strip copper layer on a core layer of the substrate, wherein a solder mask is arranged to cover the core layer and two lengthwise sides of the copper layer by a width between 0.1 mm to 1.0 mm, while a surface between the sides of the copper layer is exposed by forming a groove opening to the atmosphere and plated with gold. This makes bulges generated by shrinkage of the solder mask covering the sides of the copper layer extend outwardly in a direction away from the groove opening, allowing clamping force to be sufficiently exerted on the substrate by a mold during an encapsulation process. As such, after completing the encapsulation process, an encapsulating resin remained in the runner can be easily removed without damaging the substrate, and also resin flash can be prevented from occurrence.

Abstract translation: 提出了一种半导体封装的衬底，其在衬底的芯层上形成带状铜层，其中布置了焊料掩模以将铜层的芯层和两个纵向侧面覆盖0.1mm的宽度 到1.0mm，同时铜层的两侧之间的表面通过向大气形成开槽并镀金而暴露。 这使得覆盖铜层的焊料的收缩产生的凸起沿远离槽开口的方向向外延伸，从而允许通过模具在封装过程中使夹持力充分地施加在基板上。 因此，在完成封装工艺之后，可以容易地去除留在流道中的封装树脂而不损坏基板，并且可以防止发生树脂闪光。

公开(公告)号：US20020098621A1

公开(公告)日：2002-07-25

申请号：US09560031

申请日：2000-04-27

Inventor： Jui Yu Chuang ,  Chi-Chuan Wu

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: H05K3/305 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/1216 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/0126 ,  H05K2203/0588 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method is proposed for mounting a passive component, such as a resistor or a capacitor, over an IC package substrate, such as a BGA (Ball Grid Array) substrate. Conventionally, the mounting of a passive component over a substrate would result in the undesired existence of a gap between the passive component and the substrate, which could lead to such problems as bridged short-circuit, popcorn effect, and dismounting of the passive component during subsequent processes. As a solution to these problems, the proposed method utilizes an electrically-insulative material, such as epoxy resin, to fill up the gap between the passive component and the substrate. Various techniques can be employed to fill the electrically-insulative material into the gap, including dispensing and stencil printing. Due to the fact that the proposed method allows no gap to be left between the passive component and the substrate, it can help eliminate the drawbacks of the prior art, thus allowing the manufactured IC package to be more assured in quality and more reliable to use.

Abstract translation: 提出了一种将诸如电阻器或电容器的无源部件安装在诸如BGA（球栅阵列）基板的IC封装基板上的方法。 通常，将无源部件安装在衬底上将导致无源部件和衬底之间的间隙的不期望的存在，这可能导致诸如桥接短路，爆米花效应和被动部件的拆卸之类的问题 后续流程。 作为这些问题的解决方案，所提出的方法利用诸如环氧树脂之类的电绝缘材料填充无源部件和基板之间的间隙。 可以采用各种技术来将电绝缘材料填充到间隙中，包括分配和模版印刷。 由于所提出的方法不会在无源部件和基板之间留下间隙，因此可以有助于消除现有技术的缺陷，从而允许制造的IC封装在质量上更加可靠并且更可靠地使用 。

公开(公告)号：US06420207B1

公开(公告)日：2002-07-16

申请号：US09477350

申请日：2000-01-04

Applicant: Eduard Raymond Leuenberger ,  Dennis Lau Cheuk-Ping

Inventor： Eduard Raymond Leuenberger ,  Dennis Lau Cheuk-Ping

IPC: H01L2144

CPC classification number: H01L23/498 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/48228 ,  H05K3/064 ,  H05K3/243 ,  H05K3/28 ,  H05K3/427 ,  H05K2201/0352 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2203/0353 ,  Y10T29/49128 ,  Y10T29/49144

Abstract: A high density, non-bussed semiconductor package and a full body gold (FBG) method for manufacturing semiconductor packages are provided to improve electrical and mechanical connections with semiconductors and other electronic components and devices. The semiconductor package is fabricated by developing circuitry on the wire bond side of the semiconductor package prior to developing the ball attach side. The copper circuitry on the wire bond side is fully covered and protected from the environment. Solder masks are applied directly to the semiconductor substrate or copper layer to avoid contact with gold. The ball attach area is covered and protected by metallic layers, such as nickel and gold, or an organic solderable material to eliminate weak solder mask-gold connections.

Abstract translation: 提供用于制造半导体封装的高密度，非总体半导体封装和全体金（FBG）方法，以改善与半导体和其他电子元件和器件的电气和机械连接。 在显影球附着侧之前，通过在半导体封装的引线接合侧上显影电路来制造半导体封装。 导线接合侧的铜电路被完全覆盖并保护环境。 焊接掩模直接施加到半导体衬底或铜层以避免与金接触。 球附着区域被诸如镍和金的金属层或有机可焊接材料覆盖和保护，以消除弱焊接掩模 - 金连接。

公开(公告)号：US06395993B1

公开(公告)日：2002-05-28

申请号：US09671260

申请日：2000-09-28

Applicant: Masayuki Nakamura ,  Mitsuhiro Fukuda

Inventor： Masayuki Nakamura ,  Mitsuhiro Fukuda

IPC: H05K100

CPC classification number: H05K3/4635 ,  H01L2224/16237 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/099

Abstract: The present invention aims to manufacture a reliable multilayer flexible wiring board at high yield. Flexible wiring board 10 used for multilayer flexible wiring board 40 of the present invention has metal coating 14 on the surface of metal wiring film 19, and metal coating 14 is exposed within the contact region. A wall member rising above the surface of metal coating 14 is provided around the exposed metal coating 14. The wall member is formed of wall face 23 of opening 17 in resin film 15 at the top of metal wiring film 19, for example. When bump 34 having low-melting metal coating 36 is contacted with metal coating 14 in said contact region and heated above the melting point of the solder metal under pressure, low-melting metal coating 36 melts. The molten low-melting metal is stopped by wall face 23 from overflowing outside the contact region so that any bridge cannot be formed by the solder metal between metal wiring film 19.

Abstract translation: 本发明旨在以高产量制造可靠的多层柔性布线板。用于本发明的多层柔性布线板40的柔性布线板10在金属布线膜19的表面上具有金属涂层14，金属涂层14暴露 在接触区域内。 在露出的金属涂层14周围设置有在金属涂层14的上方上升的壁部件。壁部件例如由金属布线膜19的顶部的树脂膜15的开口17的壁面23形成。 当具有低熔点金属涂层36的凸块34与所述接触区域中的金属涂层14接触并在压力下加热到焊料金属的熔点以上时，低熔点金属涂层36熔化。 熔融的低熔点金属被壁面23阻止在接触区域外部溢出，使得任何桥接件不能由金属布线膜19之间的焊料金属形成。

公开(公告)号：US06299058B1

公开(公告)日：2001-10-09

申请号：US09302695

申请日：1999-04-30

Applicant: John H. Lau ,  Scott Lin ,  Ming-Lun Szu

Inventor： John H. Lau ,  Scott Lin ,  Ming-Lun Szu

IPC: B23K3102

CPC classification number: B23K3/0623 ,  B23K2101/38 ,  H01L21/4853 ,  H05K3/3426 ,  H05K3/3452 ,  H05K3/3478 ,  H05K2201/099 ,  H05K2201/10189 ,  H05K2201/10909 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

Abstract: A method for positioning a solder ball onto a contact tail of an electrical connector comprises several steps. Firstly, arrange the contact tail into a center region and a peripheral region surrounding the center region. Secondly, attach solder paste onto the center region of the contact tail via a first mesh painting procedure. Thirdly, attach solder resist onto the peripheral region of the contact tail via a second mesh painting procedure. Fourthly, position a solder ball on the center region of the contact tail via a screen board. Fifthly, apply a reflow soldering procedure on the solder ball so that the solder ball can be soldered on the solder paste attached to the center region of the contact tail.

Abstract translation: 将焊球定位到电连接器的接触尾部上的方法包括几个步骤。 首先，将接触尾部布置在中心区域和围绕中心区域的周边区域。 其次，通过第一网眼喷涂程序将焊膏附着到接触尾部的中心区域。 第三，通过第二次网眼喷涂程序将阻焊剂附着在接触尾部的周边区域上。 第四，通过屏幕板将焊球定位在接触尾部的中心区域。 第五，在焊锡球上应用回流焊接工艺，使焊锡球焊接在附着在接触尾部中心区域的焊锡膏上。

公开(公告)号：US06274474B1

公开(公告)日：2001-08-14

申请号：US09426578

申请日：1999-10-25

Applicant: David V. Caletka ,  Eric A. Johnson

Inventor： David V. Caletka ,  Eric A. Johnson

IPC: H01L2144

CPC classification number: H01L24/81 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/094 ,  H05K2201/0989 ,  H05K2201/099 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method of forming BGA interconnections having improved fatigue life is disclosed. In particular, a combination of mask-defined and pad-defined solder joints are selectively positioned within the BGA package. The mask-defined solder joints possess a high equilibrium height, which forces the pad-defined solder joints to elongate, thereby making the pad-defined solder joints more compliant. Further, the pad-defined solder joints posses a slightly longer fatigue life because the stress concentrations found in the mask-defined solder joints are not present in the pad-defined solder joints. Therefore, the fatigue life of BGA packages is increased by implementing a majority of mask-defined solder joints to maintain a high equilibrium height, and selectively placing pad-defined solder joints in high stress areas of the BGA package.

Abstract translation: 公开了一种形成具有改善的疲劳寿命的BGA互连的方法。 特别地，掩模限定和限定焊点的组合被选择性地定位在BGA封装内。 掩模定义的焊点具有高的平衡高度，这迫使焊盘限定的焊点伸长，从而使焊盘限定的焊点更顺应。 此外，焊盘限定的焊接接头具有稍长的疲劳寿命，因为在焊盘限定的焊点中不存在在掩模限定的焊点中发现的应力集中。 因此，通过实施大多数掩模定义的焊点以保持高平衡高度，并且将焊盘限定的焊点选择性地放置在BGA封装的高应力区域中，从而增加了BGA封装的疲劳寿命。

公开(公告)号：US20010005241A1

公开(公告)日：2001-06-28

申请号：US09739337

申请日：2000-12-19

Applicant: Hitachi, Ltd.

Inventor： Hiroshi Yamate ,  Yoshiyuki Tsujita

IPC: G02F001/1333 ,  G02F001/1345

CPC classification number: G02F1/13452 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A liquid crystal display device has a liquid crystal display panel including a pair of opposing substrates and a liquid crystal layer sandwiched between the substrates, at least one driver circuit disposed at a periphery of one of the substrates for applying a drive voltage to the liquid crystal layer, a circuit board mounting thereon a display control circuit for controlling and driving the at least one driver circuit. The circuit board includes a chip component having a pair of electrodes disposed at respective ends thereof, the electrodes are soldered to a pair of land areas disposed on the circuit board, respectively. A portion of a respective one of the land areas is covered with a protrusion of a solder resist layer protruding from a center of a side of the respective one of the pair of land areas opposite from mutually facing sides of the pair of land areas toward a center of the respective one of the pair of land areas. A distance L between the protrusions of the solder resist layer satisfies an following inequality, LnullEL, where EL is a distance between outer ends of the pair of electrodes of the chip component.

Abstract translation: 液晶显示装置具有包括一对相对基板和夹在基板之间的液晶层的液晶显示面板，至少一个驱动电路设置在一个基板的外围，用于向液晶施加驱动电压 层，其上安装有用于控制和驱动所述至少一个驱动器电路的显示控制电路的电路板。 电路板包括具有设置在其两端的一对电极的芯片部件，电极分别焊接到布置在电路板上的一对焊盘区域。 相应一个区域中的一部分的一部分覆盖有阻焊层的突起，该阻焊层从一对区域中的相应一个区域的一侧的中心突出，该对面区域与该对区域的相互面对的侧面朝向 中心的一对地区的相应一个。 阻焊层的突起之间的距离L满足以下不等式：L> = EL，其中EL是芯片部件的一对电极的外端之间的距离。

公开(公告)号：US06249434B1

公开(公告)日：2001-06-19

申请号：US09597535

申请日：2000-06-20

Applicant: Christopher J. Scafidi

Inventor： Christopher J. Scafidi

IPC: H05K720

CPC classification number: H05K7/20445 ,  H01L2224/73204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/09909

Abstract: A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.

Abstract translation: 公开了一种用于从安装在电路板上的电气装置传导热量的系统和方法。 提供了一种用于传导热量的散热器，其包括一对基本上平行的竖直腿部和联接在所述一对基本上平行的竖直腿部之间以形成“U”形状的水平部件。 水平构件包括具有一层热界面材料层的外表面和内表面。 散热器可表面安装到印刷电路板表面上的散热片安装垫。 散热器安装垫与电子设备的传热垫相邻并热耦合。 散热器热耦合到电子设备。