公开(公告)号：US09018531B2

公开(公告)日：2015-04-28

申请号：US13686057

申请日：2012-11-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Li Ding

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K1/0266 ,  H05K3/4611 ,  H05K3/4638 ,  H05K2201/09781 ,  H05K2201/09936 ,  Y10T29/49126

Abstract: A multilayer circuit board is provided, which includes multiple core boards stacked together. The core board includes an insulation layer and at least one conductor layer attached together. The conductor layer includes a circuit. The core board has at least one identification conductor disposed at an edge of at least one conductor layer. The identification conductor forms an identification pattern on a side surface of the core board along a stacking direction of the core boards. The identification patterns of the multiple core boards are different from each other on the side surface of the multilayer circuit board along the stacking direction of the core boards. A manufacturing method of the multilayer circuit board is further provided.

Abstract translation: 提供了多层电路板，其包括堆叠在一起的多个芯板。 芯板包括绝缘层和连接在一起的至少一个导体层。 导体层包括电路。 芯板具有设置在至少一个导体层的边缘处的至少一个识别导体。 识别导体沿芯板的层叠方向在芯板的侧面形成识别图案。 多个核心板的识别图案在多层电路板的侧面上沿芯板的堆叠方向彼此不同。 还提供了多层电路板的制造方法。

公开(公告)号：US08876274B2

公开(公告)日：2014-11-04

申请号：US13429549

申请日：2012-03-26

Applicant: Yuya Haneda ,  Ryoichi Nozawa

Inventor： Yuya Haneda ,  Ryoichi Nozawa

IPC: C09D11/00 ,  C09D11/30 ,  B41J2/14 ,  C09D11/101 ,  H05K1/02 ,  B41M5/00 ,  B41M7/00 ,  B41M3/00

CPC classification number: B41J2/14274 ,  B41M3/008 ,  B41M5/0011 ,  B41M5/0023 ,  B41M5/0041 ,  B41M5/0047 ,  B41M5/007 ,  B41M7/0081 ,  C09D11/101 ,  C09D11/30 ,  H05K1/0266 ,  H05K2201/09936 ,  H05K2203/013

Abstract: A pattern forming method includes: performing a first droplet ejection step by ejecting droplets containing 0.1%-2% polysiloxane by mass onto a substrate; performing a first layer forming step by solidifying the droplets ejected onto the substrate so that a first layer is formed; performing a second droplet ejection step by ejecting more droplets over the first layer; and performing a second layer forming step by solidifying the droplets ejected onto the first layer so that a second layer is formed.

Abstract translation: 图案形成方法包括：通过将含有0.1％-2％聚硅氧烷的液滴喷射到基底上来进行第一液滴喷射步骤; 通过使喷射到基板上的液滴凝固从而形成第一层来进行第一层形成步骤; 通过在所述第一层上喷射更多的液滴来执行第二液滴喷射步骤; 以及通过使喷射到第一层上的液滴固化从而形成第二层来进行第二层形成步骤。

公开(公告)号：US20140261961A1

公开(公告)日：2014-09-18

申请号：US13839444

申请日：2013-03-15

Applicant: ILLINOIS TOOL WORKS INC.

Inventor： John H. Schneider ,  William A. Herring

IPC: H05K3/30 ,  B32B37/00

CPC classification number: H05K3/305 ,  B32B33/00 ,  B32B2037/268 ,  B32B2367/00 ,  H05K1/0269 ,  H05K2201/09927 ,  H05K2201/09936 ,  Y02P70/613 ,  Y10T156/10 ,  Y10T428/24843 ,  Y10T428/24851 ,  Y10T428/2486

Abstract: A transferable film includes a carrier layer and an intermediate film portion. The carrier layer is configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object. The intermediate film portion includes a readable conductive image portion and is configured for application thereto of an adhesive layer. The intermediate film portion is configured to be interposed between the carrier layer and the adhesive layer, and the adhesive layer configured to adhere to the object for the application of the transferable film to the object.

Abstract translation: 可转印膜包括载体层和中间膜部分。 载体层被配置为接收一个或多个附加层并且可从时间上接近可转移膜施加到物体的一个或多个附加层释放。 中间膜部分包括可读导电图像部分，并且被配置为向其施加粘合剂层。 中间膜部被配置为插入在载体层和粘合剂层之间，并且粘合剂层被构造成粘附到物体上以将可转移膜施加到物体。

公开(公告)号：US20130308111A1

公开(公告)日：2013-11-21

申请号：US13883001

申请日：2011-11-04

Applicant: Duk Lee ,  Hidetoshi Tabata

Inventor： Duk Lee ,  Hidetoshi Tabata

IPC: G03F7/20

CPC classification number: G03F7/70208 ,  G03F7/203 ,  G03F7/70191 ,  G03F7/70291 ,  G03F7/7045 ,  G03F7/70541 ,  H05K1/0269 ,  H05K2201/09918 ,  H05K2201/09936

Abstract: An exposure device can exposes a circuit pattern while information data is suitably changed. An exposure device comprises a first light source (20) for irradiating a first light including ultraviolet rays, a projection exposure unit (70) for exposing a circuit pattern drawn on a photomask on a substrate, with the first light, a substrate stage (60) for mounting the substrate, a housing (11) for arranging the substrate stage, a second light source (41) for irradiating a second light including ultraviolet rays, arranged at a position different from the first light source, a spatial light modulation unit (40) for exposing information data formed electrically using the second light on the substrate, and a spatial optical light modulation unit driving means (5) for moving the spatial light modulation unit arranged on the housing (11) in a direction parallel to a moving direction of the substrate stage.

Abstract translation: 曝光装置可以在适当改变信息数据的同时曝光电路图案。 曝光装置包括用于照射包括紫外线的第一光的第一光源（20），用于暴露在基板上的光掩模上绘制的电路图案的投影曝光单元（70），第一光，基板台 ），用于布置基板台的壳体（11），用于照射布置在与第一光源不同的位置的包括紫外线的第二光的第二光源（41），空间光调制单元（ 40），用于使用所述基板上的所述第二光电气地形成的信息数据;以及空间光调制单元驱动装置（5），用于沿平行于移动方向的方向移动布置在所述壳体（11）上的所述空间光调制单元 的基底阶段。

公开(公告)号：US20120249664A1

公开(公告)日：2012-10-04

申请号：US13429549

申请日：2012-03-26

Applicant: Yuya HANEDA ,  Ryoichi NOZAWA

Inventor： Yuya HANEDA ,  Ryoichi NOZAWA

IPC: B41J2/015

CPC classification number: B41J2/14274 ,  B41M3/008 ,  B41M5/0011 ,  B41M5/0023 ,  B41M5/0041 ,  B41M5/0047 ,  B41M5/007 ,  B41M7/0081 ,  C09D11/101 ,  C09D11/30 ,  H05K1/0266 ,  H05K2201/09936 ,  H05K2203/013

Abstract: A pattern forming method includes: performing a first droplet ejection step by ejecting droplets containing 0.1%-2% polysiloxane by mass onto a substrate; performing a first layer forming step by solidifying the droplets ejected onto the substrate so that a first layer is formed; performing a second droplet ejection step by ejecting more droplets over the first layer; and performing a second layer forming step by solidifying the droplets ejected onto the first layer so that a second layer is formed.

Abstract translation: 图案形成方法包括：通过将含有0.1％-2％聚硅氧烷的液滴喷射到基底上来进行第一液滴喷射步骤; 通过使喷射到基板上的液滴凝固从而形成第一层来进行第一层形成步骤; 通过在所述第一层上喷射更多的液滴来执行第二液滴喷射步骤; 以及通过使喷射到第一层上的液滴固化从而形成第二层来进行第二层形成步骤。

公开(公告)号：US20120160543A1

公开(公告)日：2012-06-28

申请号：US13332925

申请日：2011-12-21

Applicant: Masaya NAKANISHI ,  Yasuhito TANABE ,  Hidemitsu WATANABE

Inventor： Masaya NAKANISHI ,  Yasuhito TANABE ,  Hidemitsu WATANABE

IPC: H05K1/02

CPC classification number: H05K3/0064 ,  H05K3/28 ,  H05K2201/09063 ,  H05K2201/09909 ,  H05K2201/09936

Abstract: A circuit board to be attached to a support such as a case body is provided. The circuit board has formed therein a mounting hole which is so designed as to permit a thermally deformable stud to protrude through the mounting hole and also to be thermoplastically staked to mount the board to the support. A layer is printed on the board by means of silk screen printing at a distance from the mounting hole. In a case where a moisture-proof and insulating material is applied over a surface of the board, the printed layer servers to block a flow of the moisture-proof and insulating material into the mounting hole. This avoids a reduction in strength of fastening the board to the support. The printed layer may also be used in visually inspecting a failure in thermoplastic staking to mount the board to the support.

Abstract translation: 提供要附接到诸如壳体的支撑件的电路板。 电路板上形成有安装孔，该安装孔被设计成允许可热变形的螺柱突出穿过安装孔，并且还被热塑性地固定以将板安装到支撑件上。 通过与安装孔距离一段距离的丝网印刷，印刷在印版上的层。 在将防潮绝缘材料施加在板的表面上的情况下，印刷层服务器阻止防潮绝缘材料流入安装孔。 这避免了将板紧固到支撑件上的强度的降低。 印刷层也可用于目视检查热塑性塑料的破坏以将板安装到支撑体上。

公开(公告)号：US20120092844A1

公开(公告)日：2012-04-19

申请号：US12738167

申请日：2008-10-17

Applicant: Kate Stone

Inventor： Kate Stone

IPC: H05K7/06 ,  B31B1/88 ,  B23P19/00 ,  B65D85/00 ,  B32B3/10 ,  B31B1/14 ,  B31B3/00

CPC classification number: F21V21/14 ,  H05K1/0266 ,  H05K1/028 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/113 ,  H05K3/12 ,  H05K3/32 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09936 ,  H05K2201/10674 ,  H05K2203/1545 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T428/24273

Abstract: A method of fabricating packaging for a product comprises forming a plurality of conductive tracks on a sheet of material and forming a physical barrier, such as a hole, for impeding fluid flow between adjacent conductive tracks. The method may further comprise depositing first and second regions conductive fluid onto adjacent first and second conductive tracks either side of the physical barrier and mounting an electronic device having first and second terminals such that the electronic device forms a bridge over the physical barrier and the first ands second terminals contact the first and second conductive adjacent tracks.

Abstract translation: 一种制造产品包装的方法包括在一片材料上形成多个导电轨迹并形成物理屏障，例如孔，用于阻止相邻导电轨道之间的流体流动。 该方法还可以包括将第一和第二区域导电流体沉积到物理屏障两侧的相邻第一和第二导电轨道上，并且安装具有第一和第二端子的电子设备，使得电子设备在物理屏障上形成桥， 并且第二端子接触第一和第二导电相邻轨道。

公开(公告)号：US08072777B2

公开(公告)日：2011-12-06

申请号：US12409527

申请日：2009-03-24

Applicant: Lei Liu ,  Zheng-Heng Sun

Inventor： Lei Liu ,  Zheng-Heng Sun

IPC: H05K7/00

CPC classification number: G09F3/0297 ,  G09F3/12 ,  H05K1/0266 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10204 ,  H05K2201/10598 ,  Y10T428/24008

Abstract: A label assembly includes a support and a label body. The label body is configured to allow a label to be attached thereto. The support includes an upright post, and a fixing portion formed at a distal end of the post opposite to the label body. The fixing portion is configured to removably attach the label assembly to a circuit board. A circuit board supporting the label assembly is further provided.

Abstract translation: 标签组件包括支撑件和标签主体。 标签主体被配置为允许附加标签。 支撑件包括立柱，和形成在与标签体相对的柱的远端处的固定部。 固定部分构造成将标签组件可移除地附接到电路板。 还提供了支撑标签组件的电路板。

公开(公告)号：US08035033B2

公开(公告)日：2011-10-11

申请号：US12372158

申请日：2009-02-17

Applicant: Kazutaka Kobayashi

Inventor： Kazutaka Kobayashi

IPC: H05K1/00

CPC classification number: H05K1/0266 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/114 ,  H05K3/244 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2201/09609 ,  H05K2201/09936 ,  Y10T29/49155 ,  H01L2924/00

Abstract: In a wiring substrate in which plural wiring layers and insulating layers are alternately stacked and the adjacent wiring layers are electrically connected through a via hole formed in the insulating layer, plural holes constructing substrate management information recognizable as a character, a symbol, etc. are formed in the outside insulating layer of the insulating layers.

Abstract translation: 在多个布线层和绝缘层交替层叠并且相邻布线层通过形成在绝缘层中的通孔电连接的布线基板中，构成可识别为字符，符号等的基板管理信息的多个孔是 形成在绝缘层的外部绝缘层中。

公开(公告)号：US20110208343A1

公开(公告)日：2011-08-25

申请号：US11719390

申请日：2005-11-14

Applicant: Michael Tyler ,  Robert W. Colby ,  Jeffrey W. Leonard ,  Lindsey M. Dotson ,  David A. Watt ,  Cris E. Hill ,  Laura H. Campbell

Inventor： Michael Tyler ,  Robert W. Colby ,  Jeffrey W. Leonard ,  Lindsey M. Dotson ,  David A. Watt ,  Cris E. Hill ,  Laura H. Campbell

IPC: G06F19/00

CPC classification number: H05K3/0026 ,  B23K26/02 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K31/12 ,  B23K2101/42 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/225 ,  H05K2201/09936 ,  H05K2203/163

Abstract: A method and system increase processed specimen yield in the laser processing of target material that includes multiple specimens formed on a common substrate. Preferred embodiments implement a feature that enables storage in the laser processing system a list of defective specimens that have somehow been subject to error during laser processing. Once the common substrate has been completely processed, the system alerts an operator to the number of improperly processed specimens and gives the operator an opportunity to run a software routine, which in a preferred embodiment uses a laser to scribe a mark on the top surface of each improperly processed specimen.

Abstract translation: 一种方法和系统在目标材料的激光加工中增加了加工样品产量，其包括在公共基底上形成的多个样品。 优选实施例实现能够在激光处理系统中存储在激光处理期间以某种方式遭受错误的缺陷样本的列表的特征。 一旦共同的基板被完全处理，系统就会向操作人员提供不正确处理的标本的数量，并给予操作者运行一个软件程序的机会，在一个优选的实施例中，该程序使用激光来刻划在 每个不正确加工的样品。