公开(公告)号：US20050238282A1

公开(公告)日：2005-10-27

申请号：US10523267

申请日：2003-07-31

Applicant: Tohru Ishizuya

Inventor： Tohru Ishizuya

IPC: B81B3/00 ,  B81C1/00 ,  G02B6/35 ,  G02B26/08 ,  G02B6/26 ,  H01L29/22 ,  G02B5/08

CPC classification number: B81B3/0072 ,  B81C2201/0108 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/3572 ,  G02B6/3584 ,  G02B6/3596 ,  Y10S438/926

Abstract: A three-dimensional structure element having a plurality of three-dimensional structural bodies and capable of being uniformly formed without producing a dispersion in shape of the three-dimensional structural bodies, comprising a substrate (11) and the three-dimensional structural bodies (1) disposed in a predetermined effective area (20) on the substrate (11), the three-dimensional structural bodies (1) further comprising space parts formed in the clearances thereof from the substrate (11) by removing sacrificing layers, the substrate (11) further comprising a dummy area (21) having dummy structural bodies (33) so as to surround the effective area (20), the dummy structural body (33) further comprising space parts formed in the clearances thereof from the substrate (11) by removing the sacrificing layers, whereby since the dummy area (21) is heated merely to approx. the same temperature as the effective area (20) in an ashing process for removing the sacrificing layers to prevent a temperature distribution from occurring in the effective area (20).

Abstract translation: 一种具有多个三维结构体并能够均匀形成而不产生三维结构体形状分散的三维结构元件，包括基底（11）和三维结构体（1） ），所述三维结构体（1）还包括通过去除牺牲层从所述基板（11）形成在其间隙中的空间部分，所述基板（11）被布置在所述基板（11）上的预定有效区域（20） ）还包括具有虚拟结构体（33）以围绕所述有效区域（20）的虚拟区域（21），所述虚拟结构体（33）还包括通过所述基板（11）从所述基板（11）的间隙形成的空间部分， 去除牺牲层，由此由于虚拟区域（21）被加热到约 在用于去除牺牲层的灰化过程中与有效区域（20）相同的温度以防止在有效区域（20）中发生温度分布。

公开(公告)号：US06905613B2

公开(公告)日：2005-06-14

申请号：US09902116

申请日：2001-07-10

Applicant: David Gutierrez ,  Vincent K. Luciani ,  Mary C. Burgess

Inventor： David Gutierrez ,  Vincent K. Luciani ,  Mary C. Burgess

IPC: B81B3/00 ,  B44C1/22 ,  C23F1/00

CPC classification number: B81C1/00476 ,  B81C2201/0108

Abstract: A method for using an organic dielectric as a sacrificial layer for forming suspended or otherwise spaced structures. The use of an organic dielectric has a number of advantages, including allowing use of an organic solvent or etch to remove the sacrificial layer. Organic solvents only remove organic materials, and thus do not affect or otherwise damage non-organic layers such as metal layers. This may reduce or eliminate the need for the rinsing and drying steps often associated with the use of acidic etchants such as Hydrofluoric Acid.

Abstract translation: 一种使用有机电介质作为牺牲层的方法，用于形成悬浮或其他间隔结构。 有机电介质的使用具有许多优点，包括允许使用有机溶剂或蚀刻去除牺牲层。 有机溶剂仅除去有机物质，因此不会影响或以其他方式损坏金属层等非有机层。 这可以减少或消除通常与使用酸性蚀刻剂如氢氟酸相关的漂洗和干燥步骤的需要。

公开(公告)号：US20050118813A1

公开(公告)日：2005-06-02

申请号：US10782355

申请日：2004-02-19

Applicant: Michael Korzenski ,  Thomas Baum ,  Chongying Xu ,  Eliodor Ghenciu

Inventor： Michael Korzenski ,  Thomas Baum ,  Chongying Xu ,  Eliodor Ghenciu

IPC: B08B7/00 ,  B81B3/00 ,  H01L21/306 ,  H01L21/00 ,  H01L21/302 ,  H01L21/461

CPC classification number: B81C1/00936 ,  B08B7/0021 ,  B81C2201/0108 ,  B81C2201/117 ,  H01L21/02063

Abstract: A method and composition for removing silicon-containing sacrificial layers from Micro Electro Mechanical System (MEMS) and other semiconductor substrates having such sacrificial layers is described. The etching compositions include a supercritical fluid (SCF), an etchant species, a co-solvent, and optionally a surfactant. Such etching compositions overcome the intrinsic deficiency of SCFs as cleaning reagents, viz., the non-polar character of SCFs and their associated inability to solubilize polar species that must be removed from the semiconductor substrate. The resultant etched substrates experience lower incidents of stiction relative to substrates etched using conventional wet etching techniques.

Abstract translation: 描述了用于从微机电系统（MEMS）和其它具有这种牺牲层的半导体衬底去除含硅牺牲层的方法和组合物。 蚀刻组合物包括超临界流体（SCF），蚀刻剂物质，共溶剂和任选的表面活性剂。 这样的蚀刻组合物克服了作为清洗剂的SCF的固有缺陷，即SCF的非极性特征以及它们不溶于必须从半导体衬底去除的极性物质。 所得到的蚀刻的衬底相对于使用常规湿蚀刻技术蚀刻的衬底的沉降事件较少。

公开(公告)号：US20030183916A1

公开(公告)日：2003-10-02

申请号：US10107624

申请日：2002-03-27

Inventor： John Heck ,  Michele J. Berry ,  Daniel Wong ,  Valluri Rao

IPC: H01L023/06

CPC classification number: B81C1/00293 ,  B81C1/00936 ,  B81C2201/0108 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A packaged microelectromechanical system may be formed in a hermetic cavity by forming the system on a semiconductor structure and covering the system with a thermally decomposing film. That film may then be covered by a sealing cover. Subsequently, the thermally decomposing material may be decomposed, forming a cavity, which can then be sealed to hermetically enclose the system.

Abstract translation: 封装的微机电系统可以通过在半导体结构上形成系统并用热分解膜覆盖系统而形成在密封腔中。 然后该膜可以被密封盖覆盖。 随后，热分解材料可能被分解，形成空腔，然后将其密封以气密地封闭该系统。

公开(公告)号：US20030117257A1

公开(公告)日：2003-06-26

申请号：US10290807

申请日：2002-11-08

Applicant: Coventor, Inc.

Inventor： Shawn Jay Cunningham

IPC: H01C010/50

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch having a movable microcomponent is provided and includes a substrate having a stationary contact. The switch can also include a structural layer having a movable contact positioned for contacting the stationary contact when the structural layer moves toward the substrate. An electrothermal latch attached to the structural layer and having electrical communication with the movable contact to provide current flow between the electrothermal latch and the stationary contact when the movable contact contacts the stationary contact for maintaining the movable contact in contact with the stationary contact.

Abstract translation: 电热自锁式MEMS开关及方法。 根据一个实施例，提供具有可移动微组件的微型开关，并且包括具有固定触点的基板。 该开关还可以包括具有可移动触点的结构层，该结构层定位成当结构层向衬底移动时与固定触点接触。 一个电热锁定件，其连接到结构层并且当可动触点接触固定触点以便使可动触点与固定触点接触时，与可动触头电连通以提供电热闩和固定触点之间的电流。

公开(公告)号：US06455227B1

公开(公告)日：2002-09-24

申请号：US09473655

申请日：1999-12-29

Applicant: Masaki Hara

Inventor： Masaki Hara

IPC: G03F726

CPC classification number: G03F7/2022 ,  B81C1/00126 ,  B81C2201/0108 ,  B81C2201/0152 ,  B81C2201/0197 ,  G03F7/095 ,  G03F7/11

Abstract: A multilayer resist structure is irradiated more than one time with ultraviolet rays through a photomask. Each time the structure is irradiated, ultraviolet rays of a little greater quantity of light than those used in the last irradiation are used. Also, with each exposure, a photomask which has a larger lightproof section than that used in the last irradiation is used. Next, the multilayer resist structure is developed, and the exposed area of each photoresist is removed with a developing solution. Also, in amorphous silicon layers, the areas under the removed photoresist are easily removed with the developing solution. A resist structure having desired steps is thus completed. Using the resist structure, a three-dimensional microstructure can be formed.

Abstract translation: 通过光掩模用紫外线照射多层抗蚀剂结构多次。 每次照射结构时，使用比上次照射中使用的光量稍大的紫外线。 此外，对于每次曝光，使用具有比在最后照射中使用的遮光部分更大的遮光部分的光掩模。 接下来，显影多层抗蚀剂结构体，用显影液去除各光致抗蚀剂的露出面积。 此外，在非晶硅层中，去除的光致抗蚀剂下的区域容易用显影液除去。 因此完成了具有所需步骤的抗蚀剂结构。 使用抗蚀剂结构，可以形成三维微结构。

公开(公告)号：US20020064957A1

公开(公告)日：2002-05-30

申请号：US09995956

申请日：2001-11-29

Inventor： Yong-seop Yoon

IPC: H01L021/311

CPC classification number: B81C1/00142 ,  B81B2201/042 ,  B81C2201/0108

Abstract: A method of manufacturing a micromirror actuator includes forming a trench on a substrate by etching, laminating a film-type organic layer on the substrate to cover but not fill the trench so that the trench is maintained hollow, and depositing and patterning a metal layer on the film-type organic layer and removing the film-type organic layer. According to the method of manufacturing a micromirror actuator, a micromirror can be easily planarized by laminating the film-type organic layer on the substrate including the trench, which reduces the cost of manufacturing the micromirror actuator and increases a reflectivity of the micromirror actuator by increasing the flatness level of the micromirror so as to enhance an optical transmission efficiency.

Abstract translation: 微镜致动器的制造方法包括通过蚀刻在衬底上形成沟槽，在衬底上层叠薄膜型有机层以覆盖但不填充沟槽，使得沟槽保持中空，并且将金属层沉积和图案化 膜型有机层，去除膜型有机层。 根据制造微反射镜致动器的方法，通过在包括沟槽的基板上层叠膜型有机层，可以容易地对微镜进行平面化，这降低了制造微镜驱动器的成本，并且通过增加微镜致动器的反射率 微镜的平坦度水平，以提高光传输效率。

公开(公告)号：US06362083B1

公开(公告)日：2002-03-26

申请号：US09449369

申请日：1999-11-24

Applicant: Roland Mueller-Fiedler ,  Juergen Graf ,  Stefan Kessel ,  Joerg Rehder

Inventor： Roland Mueller-Fiedler ,  Juergen Graf ,  Stefan Kessel ,  Joerg Rehder

IPC: H01L2128

CPC classification number: B81B3/007 ,  B81B2201/042 ,  B81C2201/0108 ,  G02B26/0866 ,  Y10S438/975

Abstract: A method for fabricating a locally reinforced metallic microfeature on a substrate provided preferably with an electrical contacting or a driving circuit, and on an organic, patterned sacrificial layer, which is removed after the metallic microfeature is applied, is described. In fabricating the local reinforcement of the microfeature, at least one further organic layer, formed as a mask, is deposited, which is likewise removed following pattern delineation of the metallic layer.

Abstract translation: 描述了一种用于在衬底上制造局部增强的金属微特征的方法，其优选地具有电接触或驱动电路，以及在施加金属微特征之后被去除的有机图案化牺牲层上。 在制造微特征的局部加强时，沉积形成为掩模的至少一个另外的有机层，其在金属层的图案描绘之后同样被去除。

公开(公告)号：US12128401B2

公开(公告)日：2024-10-29

申请号：US17947207

申请日：2022-09-19

Applicant: UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)

Inventor： Taesung Kim ,  Juyeol Bae

IPC: B29C33/38 ,  B01L3/00 ,  B29C33/52 ,  B81C1/00 ,  B29K83/00

CPC classification number: B01L3/502707 ,  B29C33/3842 ,  B29C33/52 ,  B81C1/00119 ,  B01L2300/0874 ,  B29K2083/00 ,  B81C2201/0108

Abstract: Provided is a microfluidic film including a first microfluidic film including a first base film, a first microchannel, which is formed on the first base film and through which a fluid flows, and a first through passage, which is configured to pass through the first base film, and a second microfluidic film including a second base film being stacked on the first base film and a second through passage, which is configured to pass through the second base film and communicates with the first through passage.

公开(公告)号：US12070307B2

公开(公告)日：2024-08-27

申请号：US17132165

申请日：2020-12-23

Applicant: International Business Machines Corporation

Inventor： Neil Ebejer ,  Ute Drechsler ,  Patrick Ruch

IPC: A61B5/145 ,  A61B5/00 ,  A61B5/1473 ,  H05K3/00 ,  A61B10/00

CPC classification number: A61B5/14514 ,  A61B5/1473 ,  A61B5/685 ,  H05K3/0014 ,  A61B2010/008 ,  A61B2562/125 ,  B81C2201/0101 ,  B81C2201/0108 ,  B81C2201/013 ,  B81C2201/0147 ,  B81C2201/056

Abstract: A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.