公开(公告)号：US20150060115A1

公开(公告)日：2015-03-05

申请号：US14079236

申请日：2013-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sa Yong Lee ,  Jin Seok Moon ,  Keun Yong Lee

IPC: H05K1/03 ,  H05K3/20 ,  H05K1/09 ,  H05K1/05

CPC classification number: H05K1/036 ,  B32B15/14 ,  B32B15/20 ,  B32B2250/40 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/308 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0358 ,  H05K2201/068 ,  H05K2203/0271 ,  Y10T156/10 ,  Y10T428/249921

Abstract: Disclosed herein are a copper clad laminate for a printed circuit board, in which a composite having a glass fibers formed on both sides of a prepreg is disposed between a resin layer of a first resin-coated copper foil (RCC) and a resin layer of a second resin-coated copper foil and having a structure in which the resin layers are symmetric or asymmetric based on the composite, and a manufacturing method thereof. A thickness of the copper clad laminate may be manufactured at the desired thickness or the thickness may be uniformly maintained, such that stabilization of thickness quality may be implemented, the adhesion between the copper foil and the resin may be improved, and warpage may be adjusted when laminating substrates having different upper and lower thermal expansion coefficients.

Abstract translation: 本发明公开了一种用于印刷电路板的覆铜层压板，其中在预浸料坯的两面上形成有玻璃纤维的复合体设置在第一树脂涂覆铜箔（RCC）的树脂层和树脂层 第二种树脂被覆铜箔，其结构是基于该复合物而使树脂层对称或不对称的结构及其制造方法。 覆铜层压板的厚度可以制造成所需的厚度，或者可以均匀地保持厚度，从而可以实现厚度质量的稳定化，可以提高铜箔和树脂之间的粘附性，并且可以调节翘曲 当层压具有不同上和下热膨胀系数的基板时。

公开(公告)号：US08935851B2

公开(公告)日：2015-01-20

申请号：US13519144

申请日：2011-01-12

Applicant: Sohei Samejima ,  Hajime Takeya ,  Hiroyuki Osuga

Inventor： Sohei Samejima ,  Hajime Takeya ,  Hiroyuki Osuga

IPC: H01K3/10 ,  B32B15/08 ,  B32B15/20 ,  B32B25/14 ,  B32B27/04 ,  H05K3/02 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B25/14 ,  B32B27/04 ,  B32B2305/076 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4632 ,  H05K2201/0187 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0358 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an insulating layer on both surfaces of the core material and in the first through hole; forming a second through hole in the insulating layer in the first through hole; forming a second conductive film on an inner wall of the second through hole; and forming, on surfaces of the insulating layers formed on the both surfaces of the core material, a signal circuit layer electrically connected to the second conductive film.

Abstract translation: 制造电路板的方法包括：在芯材中形成第一通孔; 在所述第一通孔的内壁上形成第一导电膜; 在芯材的两个表面和第一通孔中形成绝缘层; 在第一通孔中的绝缘层中形成第二通孔; 在所述第二通孔的内壁上形成第二导电膜; 以及在形成在所述芯材的两个表面上的所述绝缘层的表面上形成与所述第二导电膜电连接的信号电路层。

公开(公告)号：US20140343232A1

公开(公告)日：2014-11-20

申请号：US14068655

申请日：2013-10-31

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski

IPC: H05K1/03 ,  C08L71/12 ,  C08L71/00

CPC classification number: H05K1/0353 ,  B32B17/02 ,  B32B17/064 ,  C03C25/323 ,  C08G65/485 ,  C08L71/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2205/02 ,  C08L2205/05 ,  H05K1/0326 ,  H05K1/0366 ,  H05K3/025 ,  H05K2201/0358 ,  Y10T428/31678 ,  Y10T442/2992

Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

Abstract translation: 用于印刷电路板（PCB）层压板的增强型预浸料包括基材和施加到基材上的树脂。 该树脂包括可固化聚合物和具有主链的聚合引发剂聚合物，所述主链具有自由基引发剂形成段，其经受热而分裂以产生多种不挥发性起始物质。 在制备PCB层压板的所有加工步骤期间，该树脂组合物消除了自由基引发剂可能的挥发性损失。 该树脂可另外包括交联剂，阻燃剂和粘度调节剂。 在一个实施方案中，用树脂浸渍玻璃纤维片，随后干燥或固化。 玻璃布基材可以包括将树脂偶联到基材上的硅烷偶联剂。 在另一个实施方案中，通过将树脂施加到铜上并随后固化树脂来制备树脂涂覆的铜（RCC）。

公开(公告)号：US08715780B2

公开(公告)日：2014-05-06

申请号：US13054565

申请日：2010-02-19

Applicant: Alex Bruderer ,  Jurgen Herbert ,  Max Hunziker ,  Michel Probst

Inventor： Alex Bruderer ,  Jurgen Herbert ,  Max Hunziker ,  Michel Probst

IPC: B05D1/26 ,  B05D3/00 ,  B05C19/04

CPC classification number: B05C19/04 ,  B05C9/12 ,  B05C9/14 ,  B05C19/02 ,  B05C19/06 ,  B05D1/30 ,  B05D3/007 ,  B05D3/0254 ,  B05D2401/32 ,  H05K3/022 ,  H05K2201/0358 ,  H05K2203/1355 ,  H05K2203/1545

Abstract: Method for producing a plastic layer having a layer thickness of less than 200 μm on an upper side of a substrate includes the following steps: applying plastic powder to the substrate upper side by means of a powder scattering device, then cleaning the substrate underside, then melting the applied plastic powder in a furnace, as a result of which the plastic layer is formed on the substrate, and cooling the substrate, wherein the substrate is transported continuously from method step to method step.

Abstract translation: 在基板的上侧制造层厚度小于200μm的塑料层的方法包括以下步骤：通过粉末散射装置将塑料粉末施加到基板上侧，然后清洁基板下侧，然后 在炉中熔化所施加的塑料粉末，由此在衬底上形成塑料层，并冷却衬底，其中衬底从方法步骤连续输送到方法步骤。

公开(公告)号：US20130258251A1

公开(公告)日：2013-10-03

申请号：US13627681

申请日：2012-09-26

Applicant: LG DISPLAY CO., LTD.

Inventor： Sang Dae Lee ,  Kyeong Kun Jang ,  Min Su Cho ,  Young Mee Kim

IPC: G02F1/1335 ,  F21V13/12 ,  F21V8/00

CPC classification number: H05K1/0209 ,  G02B6/0055 ,  G02B6/0085 ,  G02B6/0088 ,  G02B6/009 ,  G02F1/1336 ,  G02F1/133603 ,  G02F2001/133612 ,  H05K1/0284 ,  H05K1/056 ,  H05K2201/0358 ,  H05K2201/10409

Abstract: A backlight assembly is disclosed that is capable of enabling easy narrow bezel design and easily radiating heat generated from a light source, and a liquid crystal display device using the same. The backlight assembly includes a bottom cover, a light guide plate placed on the bottom cover, a printed circuit board having an L-shaped form and attached to a bottom surface and inner lateral surface of the bottom cover, and a plurality of Light Emitting Diode (LED) packages being mounted to the printed circuit board, wherein the printed circuit board includes a single metal layer having the L-shaped form and attached to the bottom surface and the inner lateral surface of the bottom cover; and a Resin Coated Copper (RCC) film attached to an inner lateral surface of the single metal layer.

Abstract translation: 公开了能够实现容易的窄边框设计和容易地辐射由光源产生的热的背光组件以及使用其的液晶显示装置。 背光组件包括底盖，放置在底盖上的导光板，具有L形形状并附着于底盖的底表面和内侧表面的印刷电路板，以及多个发光二极管 （LED）封装安装在印刷电路板上，其中印刷电路板包括具有L形形状并附着到底盖的底表面和内侧表面的单个金属层; 以及附着在单个金属层的内侧表面上的树脂涂覆铜（RCC）膜。

公开(公告)号：US08501279B2

公开(公告)日：2013-08-06

申请号：US12091519

申请日：2006-10-19

Applicant: Masahiko Suzuki ,  Kazuhito Obata ,  Katsuyuki Masuda ,  Kenichi Tomioka ,  Masaki Takeuchi ,  Sumio Yoshida ,  Hirokazu Suzuki ,  Yoshitsugu Matsuura

Inventor： Masahiko Suzuki ,  Kazuhito Obata ,  Katsuyuki Masuda ,  Kenichi Tomioka ,  Masaki Takeuchi ,  Sumio Yoshida ,  Hirokazu Suzuki ,  Yoshitsugu Matsuura

IPC: B32B3/10 ,  B32B15/09 ,  B05D3/02 ,  B05D3/10

CPC classification number: H05K1/0346 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/087 ,  H05K2203/1157 ,  H05K2203/163 ,  Y10T428/24917 ,  Y10T428/261 ,  Y10T428/27

Abstract: A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.

Abstract translation: 一种制造具有一个或多个层叠体的柔性层叠片的方法，每个层叠体均设置有形成在树脂膜的一侧上的金属箔，该方法包括涂布步骤，其中将包含聚酰胺酸和溶剂的清漆涂覆到 金属箔以形成涂膜，保持在金属箔上形成的涂膜的保持步骤，其中除去清漆中的至少一部分溶剂以形成由树脂构成的层的干燥步骤 组合物和树脂膜形成步骤，其中由树脂组合物组成的层被加热以形成含有聚酰亚胺树脂的树脂膜。 基于树脂膜中的金属元素含量的目标，调整从涂布步骤到树脂成膜步骤的每个步骤的条件。

公开(公告)号：US20130056439A1

公开(公告)日：2013-03-07

申请号：US13696890

申请日：2011-04-06

Applicant: Taiki Nishi ,  Takeshi Miyakawa ,  Katsunori Yashima ,  Kensuke Okoshi ,  Hidenori Ishikura

Inventor： Taiki Nishi ,  Takeshi Miyakawa ,  Katsunori Yashima ,  Kensuke Okoshi ,  Hidenori Ishikura

IPC: H05K3/20

CPC classification number: H05K1/056 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2203/1545 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1062

Abstract: A method of manufacturing a metal-base substrate having an insulative adhesive layer and a conductor layer on a metal-based material is provided. The method includes the steps of dispersing a disperse phase in an insulative adhesive-dispersing medium that contains a wetting dispersant and constitutes the insulative adhesive layer; laminating step of laminating the insulative adhesive on the conductor foil as feeding the roll-shaped conductor foil; curing the insulative adhesive on the conductor foil under heat into a B stage state and thus forming a composite of the conductor foil and the insulative adhesive layer in the B stage state; laminating the metal-based material on the insulative adhesive layer in the B stage state to give a laminate; and then curing the insulative adhesive layer in the B stage state into a C stage state by heat pressurization of the laminate.

Abstract translation: 提供一种在金属基材料上制造具有绝缘粘合剂层和导体层的金属基底基板的方法。 该方法包括将分散相分散在含有润湿分散剂并构成绝缘粘合剂层的绝缘粘合剂分散介质中的步骤; 将导体箔上的绝缘性粘合剂层叠的方法，是将该辊状导体箔进行输送; 将导体箔上的绝缘粘合剂加热固化成B阶段状态，从而在B阶段形成导体箔和绝缘粘合剂层的复合物; 在B阶段的状态下将金属基材料层叠在绝缘性粘合剂层上，得到层叠体; 然后通过层叠体的热加压将B阶状态的绝缘性粘合层固化成C阶段状态。

公开(公告)号：US20130043067A1

公开(公告)日：2013-02-21

申请号：US13350487

申请日：2012-01-13

Applicant: Katsura HAYASHI

Inventor： Katsura HAYASHI

IPC: H05K1/00 ,  B32B5/16 ,  B82Y99/00

CPC classification number: B82Y40/00 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B5/28 ,  B32B7/02 ,  B32B15/043 ,  B32B15/14 ,  B32B15/20 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/101 ,  B32B2262/103 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/3065 ,  B32B2307/536 ,  B32B2307/54 ,  B32B2457/08 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0358 ,  Y10T428/25

Abstract: [PROBLEM] To provide a circuit board improved in electrical reliability.[SOLUTION] A circuit board 3 comprises a plurality of first inorganic insulating particles 13a which are connected to each other via first neck structures 17a and have a particle size of 3 nm or more and 110 nm or less and a resin (third filling portions 19c) arranged in first gaps G1 among the plurality of first inorganic insulating particles 13a.

Abstract translation: [问题]提供改善电气可靠性的电路板。 电路板3包括通过第一颈部结构17a彼此连接并具有3nm以上且110nm以下的粒径的多个第一无机绝缘粒子13a和树脂（第三填充部19c ）布置在多个第一无机绝缘颗粒13a中的第一间隙G1中。

公开(公告)号：US20120315438A1

公开(公告)日：2012-12-13

申请号：US13524132

申请日：2012-06-15

Applicant: Kenji TANAKA ,  Kazumasa TAKEUCHI ,  Nobuyuki OGAWA ,  Katsuyuki MASUDA

Inventor： Kenji TANAKA ,  Kazumasa TAKEUCHI ,  Nobuyuki OGAWA ,  Katsuyuki MASUDA

IPC: C09D163/02 ,  C09D179/08 ,  H01B13/00 ,  B32B33/00 ,  B32B15/08

CPC classification number: B32B27/36 ,  B32B7/04 ,  B32B15/08 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/281 ,  B32B27/322 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/748 ,  B32B2457/00 ,  C08G73/14 ,  H05K3/386 ,  H05K2201/0358 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A resin primer which can stick an insulator layer to a conductor foil, whose surface is not much roughened, with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing the same. The resin primer includes a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin includes a conductor foil and the aforesaid resin primer. The laminated sheet includes the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer including the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate including the aforesaid conductor foil with resin, and a prepreg laminated on this resin.

Abstract translation: 能够将绝缘体层粘附到具有足够的粘合力的表面不变得粗糙的导体箔的树脂底漆，具有树脂的导体箔，层压片及其制造方法。 树脂底漆包括具有成膜能力和断裂能为0.15J以上的树脂。 具有树脂的导体箔包括导体箔和上述树脂底漆。 层压片包括导体箔，与导体箔相对设置的绝缘层，以及设置在导体箔和绝缘层之间的与上述树脂底漆相对应的树脂层的树脂层。 可以通过用树脂对包含上述导体箔的层压体进行加热加压和层压在该树脂上的预浸料来制造该层压片。

公开(公告)号：US20120279765A1

公开(公告)日：2012-11-08

申请号：US13519144

申请日：2011-01-12

Applicant: Sohei Samejima ,  Hajime Takeya ,  Hiroyuki Osuga

Inventor： Sohei Samejima ,  Hajime Takeya ,  Hiroyuki Osuga

IPC: H05K1/05 ,  H05K3/02

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B25/14 ,  B32B27/04 ,  B32B2305/076 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4632 ,  H05K2201/0187 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0358 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an insulating layer on both surfaces of the core material and in the first through hole; forming a second through hole in the insulating layer in the first through hole; forming a second conductive film on an inner wall of the second through hole; and forming, on surfaces of the insulating layers formed on the both surfaces of the core material, a signal circuit layer electrically connected to the second conductive film.

Abstract translation: 制造电路板的方法包括：在芯材中形成第一通孔; 在所述第一通孔的内壁上形成第一导电膜; 在芯材的两个表面和第一通孔中形成绝缘层; 在第一通孔中的绝缘层中形成第二通孔; 在所述第二通孔的内壁上形成第二导电膜; 以及在形成在所述芯材的两个表面上的所述绝缘层的表面上形成与所述第二导电膜电连接的信号电路层。