公开(公告)号：US20180046315A1

公开(公告)日：2018-02-15

申请号：US15792383

申请日：2017-10-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Soo Kim ,  Keun Sik Lee

IPC: G06F3/041 ,  G06F3/044 ,  H05K1/02

CPC classification number: G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04104 ,  G06F2203/04111 ,  H05K1/028 ,  H05K1/0298 ,  H05K2201/0145 ,  H05K2201/05 ,  H05K2201/10128

Abstract: Disclosed are a touch panel and a method for manufacturing the same. A touch panel can include a substrate, a transparent electrode base on the substrate, a first transparent electrode on the transparent electrode base and extending in a first direction, and a second transparent electrode on the transparent electrode base and extending in a second direction. A method of manufacturing a touch panel can include preparing a substrate and a transparent electrode base, forming a transparent electrode over the transparent electrode base, and forming an electrode material over the transparent electrode base.

公开(公告)号：US20180042116A1

公开(公告)日：2018-02-08

申请号：US15365664

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K3/00 ,  C03C17/34 ,  H01L23/498 ,  H05K1/03 ,  H01L21/683

CPC classification number: H05K3/007 ,  C03C17/30 ,  C03C17/32 ,  C03C17/3405 ,  C03C2218/11 ,  C03C2218/32 ,  C03C2218/355 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/20 ,  C09D179/08 ,  H01L21/6835 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68386 ,  H05K1/0393 ,  H05K3/4682 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0264 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible substrate assembly includes forming a first polyimide layer on a rigid support base, wherein the step of forming the first polyimide layer includes incorporating in a polyamic acid solution, an adhesion promoting agent and a release agent for achieving different adhesion strength at two opposite sides of the first polyimide layer, and forming a flexible second polyimide layer on the first polyimide layer, the second polyimide layer being adhered in contact with the first polyimide layer, and a peeling strength between the first and second polyimide layers being less than a peeling strength between the first polyimide layer and the support base so that the second polyimide layer is peelable from the first polyimide layer while the first polyimide layer remains adhered in contact with the support base.

公开(公告)号：US20180008821A1

公开(公告)日：2018-01-11

申请号：US15265594

申请日：2016-09-14

Applicant: PACESETTER, INC.

Inventor： John R. Gonzalez ,  Jeffrey Urbanski ,  Tommy Cushing

IPC: A61N1/05 ,  H05K1/02 ,  H05K1/09 ,  H05K3/46 ,  H05K1/11 ,  H05K3/28 ,  A61N1/36 ,  H05K3/06 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

CPC classification number: A61N1/0551 ,  A61N1/36071 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/064 ,  H05K3/18 ,  H05K3/28 ,  H05K3/42 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/0338 ,  H05K2201/05

Abstract: Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

公开(公告)号：US20180007797A1

公开(公告)日：2018-01-04

申请号：US15704291

申请日：2017-09-14

Applicant: HARRIS CORPORATION

Inventor： LOUIS JOSEPH RENDEK, JR.

IPC: H05K3/34 ,  H05K1/02 ,  H05K3/16 ,  H05K1/16 ,  H05K3/40 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K3/3452 ,  H01L2224/16225 ,  H05K1/028 ,  H05K1/03 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/167 ,  H05K3/16 ,  H05K3/3436 ,  H05K3/4038 ,  H05K2201/0141 ,  H05K2201/05 ,  Y02P70/613

Abstract: A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.

公开(公告)号：US20170359900A1

公开(公告)日：2017-12-14

申请号：US15610843

申请日：2017-06-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： HIROKI SAKAMOTO

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H01G4/30 ,  H05K1/02 ,  H05K3/12 ,  H05K1/14 ,  H05K1/03 ,  H05K3/40 ,  H05K3/00

CPC classification number: H05K1/189 ,  H01G4/30 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0293 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/115 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K1/148 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/12 ,  H05K3/3442 ,  H05K3/3494 ,  H05K3/363 ,  H05K3/4038 ,  H05K3/4691 ,  H05K2201/049 ,  H05K2201/05 ,  H05K2201/10015 ,  H05K2201/10181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/20

Abstract: An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.

公开(公告)号：US09839125B1

公开(公告)日：2017-12-05

申请号：US14266723

申请日：2014-04-30

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/02 ,  H01R43/02 ,  H01R43/00

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes multiple electronic components coupled to a fabric. Each of the multiple electronic components includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. One of the electrically conductive wire braids interconnects two electronic components, thereby providing an electrical connection between the two electronic components. The electrically conductive wire braid can be attached to the fabric by an adhesive, a stitched thread, which can be either electrically insulated or electrically conductive, or both adhesive and stitched thread. The fabric can be a wearable fabric, such as a shirt or pants, or other form to be worn by a user, such as an armband, waistband, hat or shoes.

公开(公告)号：US09839122B2

公开(公告)日：2017-12-05

申请号：US14437824

申请日：2015-01-12

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Hongrui Cao ,  Xiaoping Tan

IPC: G02F1/1345 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K1/14

CPC classification number: H05K1/0296 ,  G02F1/13452 ,  G02F1/13458 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/028 ,  H05K1/09 ,  H05K1/117 ,  H05K1/147 ,  H05K2201/05 ,  H05K2201/10136

Abstract: The disclosure is related to a flexible printed circuit board. The flexible printed circuit board comprises a connecting area and a plurality of gold fingers disposed inside the connecting area, wherein the distances of the gold fingers are different. The disclosure is further related to a liquid crystal display. By the above manner, the disclosure is able to change the distances between the adjacent gold fingers to increase the number of the gold fingers without changing the size of the flexible printed circuit board so as to solve the impedance matching problem of the gold fingers of the flexible printed circuit board, and in the meanwhile to increase the assembling yield rate of the flexible printed circuit board.

公开(公告)号：US20170332492A1

公开(公告)日：2017-11-16

申请号：US15152218

申请日：2016-05-11

Applicant: Flextronics Automotive GmbH & Co. KG

Inventor： Peter Lutz ,  Kevin Buermann

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/189 ,  H05K3/288 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/05 ,  H05K2201/0929 ,  H05K2201/10037 ,  H05K2201/10227 ,  H05K2201/1031 ,  H05K2201/10931 ,  H05K2203/0278 ,  H05K2203/04 ,  H05K2203/16

Abstract: The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

公开(公告)号：US09812800B2

公开(公告)日：2017-11-07

申请号：US14883478

申请日：2015-10-14

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Cheong Hun Lee ,  Seung-Won Kuk ,  Chung Hui Lee ,  Sang Hyuk Kim ,  Yong Nam Shin ,  Seon Jeong Yun

IPC: H05K1/00 ,  H01R12/77 ,  H05K5/00 ,  G02F1/1345 ,  H05K1/02 ,  H05K1/11 ,  H01L23/495 ,  H05K1/14 ,  H05K3/46 ,  H05K1/18

CPC classification number: H01R12/771 ,  G02F1/13452 ,  G02F1/13458 ,  H01L23/49572 ,  H01L2224/50 ,  H01L2225/107 ,  H05K1/0277 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/05 ,  H05K2201/10681

Abstract: An exemplary embodiment provides a conductive connecting member, and a display device including the same, that includes a flexible elongated body and terminals formed at opposite ends of the body to be electrically connected to the body, wherein the body may include terminal areas in which the terminals are formed and a central area disposed between the terminal areas, and wherein two or more recess portions may be formed in edges of the body within the central area of the body.

公开(公告)号：US09746647B2

公开(公告)日：2017-08-29

申请号：US15194198

申请日：2016-06-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Soo Kim

IPC: H04N3/14 ,  G02B13/00 ,  H04N5/225 ,  G02B7/09 ,  G02B5/20 ,  G03B3/10 ,  H04N5/232 ,  H05K1/18 ,  G02B3/14

CPC classification number: G02B13/0075 ,  G02B3/14 ,  G02B5/208 ,  G02B7/09 ,  G03B3/10 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/23264 ,  H05K1/181 ,  H05K2201/05 ,  H05K2201/10121

Abstract: An exemplary embodiment of the present disclosure includes a PCB mounted with an image sensor, a base installed at an upper surface of the PCB to centrally form an optical path, a lens holder coupled to an upper surface of the base to form an optical path by being mounted with at least one or more sheets of lenses, a variable lens arranged on the optical path centrally formed at the base to control a refractive index of passing light, and an infrared cut-off coating layer provided on a surface of the variable lens to filter an infrared component from the optical path-passing light.