公开(公告)号：US07436268B2

公开(公告)日：2008-10-14

申请号：US11217658

申请日：2005-08-31

Applicant: Shin-Shing Jiang ,  Sheng-Yuan Lee

Inventor： Shin-Shing Jiang ,  Sheng-Yuan Lee

IPC: H03H7/38

CPC classification number: H01R12/58 ,  H01R12/7064 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09281 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/09809 ,  H05K2201/10189

Abstract: A signal transmission structure for connecting a coaxial cable connector is provided. The coaxial cable connector has a signal pin. The signal transmission structure includes a reference plane and a conductive layer, and the conductive layer is located on one side of the reference plane. Moreover, the conductive layer includes a signal perforated pad, a first line segment, a second line segment, and a compensation pad. The signal pin is suitable for threading the signal perforated pad. The first line segment is connected to the signal perforated pad, and the compensation pad is connected between the first line segment and the second line segment.

Abstract translation: 提供了用于连接同轴电缆连接器的信号传输结构。 同轴电缆连接器有一个信号引脚。 信号传输结构包括参考平面和导电层，并且导电层位于参考平面的一侧。 此外，导电层包括信号穿孔垫，第一线段，第二线段和补偿垫。 信号针适用于信号穿孔垫的穿线。 第一线段连接到信号穿孔焊盘，补偿焊盘连接在第一线段和第二线段之间。

公开(公告)号：US20080236879A1

公开(公告)日：2008-10-02

申请号：US12058040

申请日：2008-03-28

Applicant: Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

Inventor： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/383 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/564 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/056 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/09727 ,  H05K2201/09772 ,  H05K2201/0989 ,  H05K2203/0307 ,  H05K2203/0361 ,  H05K2203/049 ,  H05K2203/0542 ,  H05K2203/0723 ,  H05K2203/1152 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

Abstract translation: 提供了一种具有增强的抗湿性的电路板和制造该电路板的方法，以及电路装置和该电路装置的制造方法。 本发明的电路板包括：基板; 在基板的主表面上形成的布线; 覆盖除了作为连接器的区域的布线的覆盖层; 形成在基板的底面上的背面电极; 以及形成为穿透基板的通孔电极，从而连接布线和背面电极。 在该电路基板的各配线的表面上，基板周边的凸部的宽度比基板的中央部的凸部的宽度大。 利用这种结构，可以提高热循环负载下的布线与覆盖层之间的粘附可靠性。

公开(公告)号：US07429177B2

公开(公告)日：2008-09-30

申请号：US12005704

申请日：2007-12-27

Applicant: Ning-Jiang Li

Inventor： Ning-Jiang Li

IPC: H01R12/00

CPC classification number: H05K1/118 ,  H05K1/117 ,  H05K3/361 ,  H05K2201/09381 ,  H05K2201/09727 ,  Y10S439/951

Abstract: An exemplary flexible printed circuit board (2) includes a wiring layer (21). The wiring layer includes a number of conductive lines (211). Each of the conductive lines includes a finger (213), a line portion (212) and a junction portion (214) between the finger and the line portion. A width of the finger is greater than a width of the line portion, a width of the junction portion gradually changes from the width of the line portion to the width of the finger. The flexible printed circuit board has high reliability.

公开(公告)号：US20080185170A1

公开(公告)日：2008-08-07

申请号：US11618549

申请日：2006-12-29

Applicant: Michael F. Wilson ,  Joe Wiseman

Inventor： Michael F. Wilson ,  Joe Wiseman

IPC: H05K1/09 ,  H05K3/10

CPC classification number: H05K1/116 ,  H05K1/0268 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09727 ,  Y10T29/49155

Abstract: A method of processing a circuit board including providing a circuit board having disposed thereon a conductive pattern, the pattern comprising a trace terminating at a terminal and depositing conductive material on the terminal and trace to form a land extending away from the terminal on the trace past a projection line. The method also includes applying a soldermask to the circuit board to form a soldermask opening having an opening edge located at and aligned with the projection line, with the opening framing the terminal and a first portion of the land, and to cover a second portion of the land.

Abstract translation: 一种处理电路板的方法，包括提供其上布置有导电图案的电路板，所述图案包括终端于端子处的迹线，并且在端子上沉积导电材料并且迹线以形成远离轨迹上的端子的平台 投影线。 该方法还包括将焊接掩模施加到电路板上以形成具有位于并与突出线对准的开口边缘的焊接掩模开口，其中开口构成端子和焊盘的第一部分，并且覆盖第二部分 那片土地。

公开(公告)号：US20080156437A1

公开(公告)日：2008-07-03

申请号：US11816124

申请日：2006-03-07

Applicant: Kohichiro Kawate ,  Yoshiaki Sato ,  Yuji Hirasawa

Inventor： Kohichiro Kawate ,  Yoshiaki Sato ,  Yuji Hirasawa

IPC: C09J163/00

CPC classification number: H01R12/61 ,  H01R12/62 ,  H05K1/111 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09727 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: A method for connecting FPC to a second circuit board, comprising the steps of (i) preparing a flexible printed circuit board (FPC) and a second circuit board, (ii) disposing the connection parts of the FPC to face the connection parts of the second circuit board such that a thermosetting adhesive film is present between the connection parts of the FPC and the connection parts of the second circuit board, and (iii) applying heat and pressure sufficiently high to thoroughly push away the adhesive film for establishing electrical contact and allow for curing of the adhesive, wherein the ratio of conductor width (L)/conductor-to-conductor distance (S) in the conductor wiring end parts constituting the connection parts of FPC is 0.5 or less and the thermosetting adhesive film is adjusted to have a viscosity of 500 to 20,000 Pa·s at 200° C.

Abstract translation: 一种用于将FPC连接到第二电路板的方法，包括以下步骤：（i）制备柔性印刷电路板（FPC）和第二电路板，（ii）将FPC的连接部分设置为面对 第二电路板，使得在FPC的连接部分和第二电路板的连接部分之间存在热固性粘合膜，并且（iii）施加足够高的热和压力以彻底地推开粘合膜以建立电接触， 允许粘合剂固化，其中构成FPC连接部分的导体布线端部中的导体宽度（L）/导体与导体之间的距离（S）的比率为0.5以下，将热固性粘合膜调整为 在200℃下的粘度为500至20,000Pa.s

公开(公告)号：US20080121421A1

公开(公告)日：2008-05-29

申请号：US11944813

申请日：2007-11-26

Applicant: Kazuhiro Kashiwakura

Inventor： Kazuhiro Kashiwakura

IPC: H05K1/02 ,  H01R12/04 ,  H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/0245 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/09727

Abstract: Printed circuit board in which deterioration of signal transmission characteristics otherwise caused by a stub parasitically formed in a through-hole is suppressed to provide optimum high-speed signal transmission characteristics. A printed circuit board 10 includes a power supply/ground layer 11 and a signal line 12b in a dielectric layer 13, and a through-hole 12 connected to the signal line 12b. A clearance 14 which becomes an anti-pad is provided in an area between the through-hole 12 and the power supply/ground layer 11. The signal line 12b is extended from the through-hole 12 through the clearance 14 to an area below the power supply/ground layer 11. The portion of the signal line 12b arranged in the vicinity of the power supply/ground layer 11 in the clearance 14 has an area of impedance gradient 17 whose characteristic impedance becomes progressively lower in a direction away from the through-hole 12.

Abstract translation: 印刷电路板，其中抑制了由在通孔中寄生的短截线导致的信号传输特性的劣化，以提供最佳的高速信号传输特性。 印刷电路板10包括电介质层13中的电源/接地层11和信号线12b以及连接到信号线12b的通孔12。 在通孔12和电源/接地层11之间的区域中设置成为防焊盘的间隙14。 信号线12b从通孔12通过间隙14延伸到电源/接地层11下方的区域。 布置在间隙14中的电源/接地层11附近的信号线12b的部分具有阻抗梯度17的区域，其阻抗梯度17的特征阻抗在远离通孔12的方向上逐渐降低。

公开(公告)号：US20080112131A1

公开(公告)日：2008-05-15

申请号：US12014198

申请日：2008-01-15

Applicant: Paul Artman ,  Sandor Farkas

Inventor： Paul Artman ,  Sandor Farkas

IPC: H05K7/20 ,  H05K1/00

CPC classification number: H05K1/0201 ,  G06F1/206 ,  H05K2201/09727 ,  H05K2201/10151 ,  H05K2203/1115 ,  Y02D10/16

Abstract: An information handling system including a system fan control is disclosed. The information handling system can include a power trace operable to produce a temperature differential in response to a current change within the reduced trace width region. A thermistor may be provided in close proximity to the reduced trace width region and can be operable to detect the temperature differential provided in response to the current change. A printed circuit board for use in an information handling system and a method of using the information handling system are also disclosed.

Abstract translation: 公开了一种包括系统风扇控制的信息处理系统。 信息处理系统可以包括可操作以响应于减小的迹线宽度区域内的电流变化产生温度差的电力跟踪。 可以将热敏电阻设置在靠近减小的迹线宽度区域并且可操作以检测响应于当前变化而提供的温度差。 还公开了一种用于信息处理系统的印刷电路板和使用信息处理系统的方法。

公开(公告)号：US20080090406A1

公开(公告)日：2008-04-17

申请号：US11948748

申请日：2007-11-30

Applicant: Erik Jensen

Inventor： Erik Jensen

IPC: H01L21/4763

CPC classification number: H05K1/0231 ,  H05K1/113 ,  H05K1/114 ,  H05K1/115 ,  H05K2201/09309 ,  H05K2201/09381 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: Various embodiments include a method of forming an interconnect comprising forming at least two vias in a substrate, forming a conductive pad on a surface of the substrate, forming at least one tapered conductive segment on the surface of the substrate coupled to the conductive pad, wherein only a first via of the at least two vias is formed substantially beneath the conductive pad and is coupled to the conductive pad, a second via of the at least two vias is coupled to the conductive pad by a first one of the at least one tapered conductive segments, the first one of the tapered conductive segments having a first end having a first width and a second end having a second width, the first end being connected to the second via and the second end being connected to the conductive pad, the first width being less than the second width.

Abstract translation: 各种实施例包括形成互连的方法，包括在衬底中形成至少两个通孔，在衬底的表面上形成导电焊盘，在耦合到导电焊盘的衬底的表面上形成至少一个锥形导电段，其中 只有至少两个通孔的第一通孔形成在导电焊盘的基本下方，并且耦合到导电焊盘，所述至少两个通孔的第二通孔通过所述至少一个锥形 导电段，第一个锥形导电段具有第一端和第二端，第一端具有第一宽度，第二端具有第二宽度，第一端连接到第二通孔，第二端连接到导电垫， 宽度小于第二宽度。

公开(公告)号：US20080066955A1

公开(公告)日：2008-03-20

申请号：US11901078

申请日：2007-09-13

Applicant: Takamasa Nodo ,  Haruo Takagi

Inventor： Takamasa Nodo ,  Haruo Takagi

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/09254 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09727 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mounting structure for a surface mounting electronic component comprises an electronic component a land, a wiring, and an electrical connection pattern. The electronic component has electrodes at opposite ends thereof. The land is connected to each electrode through a solder. The wiring is connected to the land and has a width which is smaller than a width of the electronic component in a width direction thereof. The wiring is connected to the electrical connection pattern. The electrical connection pattern has on a side on which the wiring is connected to the electrical connection pattern a width which is larger than the width of the electronic component in the width direction thereof.

Abstract translation: 用于表面安装电子部件的表面安装结构包括电子部件，焊盘，布线和电连接图案。 电子部件在其相对端具有电极。 焊盘通过焊料连接到每个电极。 布线连接到台面，其宽度小于电子部件的宽度方向的宽度。 接线连接到电气连接图案。 电连接图案具有在电连接图案的与电子部件的宽度方向的宽度大的宽度上连接的一侧。

公开(公告)号：US20080057746A1

公开(公告)日：2008-03-06

申请号：US11927747

申请日：2007-10-30

Applicant: Se YOO

Inventor： Se YOO

IPC: H01R12/08

CPC classification number: C25D5/02 ,  G02F1/13452 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/09727 ,  Y10T29/49121

Abstract: A tap tape of a tape carrier package prevents connection parts from being eroded. The tap tape includes a base film having a device hole formed to mount a driver chip for driving a panel of a flat panel display, input patterns positioned on the base film and having a plurality of electrode pads connected to a side of the device hole, output patterns positioned on the base film and having a plurality of electrode pads connected to the other side of the device hole; and connection parts positioned at the ends of the input patterns or the output patterns and having electrode pads of widths different from widths of the electrode pads.