公开(公告)号：US20170280564A1

公开(公告)日：2017-09-28

申请号：US15464516

申请日：2017-03-21

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H05K3/30 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/181 ,  H01G2/06 ,  H05K1/0353 ,  H05K1/111 ,  H05K1/113 ,  H05K1/186 ,  H05K3/0044 ,  H05K3/205 ,  H05K3/301 ,  H05K3/303 ,  H05K3/4007 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10174 ,  H05K2201/10378 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component includes a first functional element including a pair of first connecting electrode portions formed on a first mounting surface, a pair of pillar electrodes connected to the corresponding first connecting electrode portions, a second functional element that includes a pair of second connecting electrode portions formed on a second mounting surface and that is arranged in a space defined by the first mounting surface of the first functional element and the pair of pillar electrodes, a pair of pad electrodes connected to the corresponding second connecting electrode portions, and a sealing resin that seals the pair of pillar electrodes, the pair of pad electrodes and the second functional element so as to expose the first lower surfaces of the pair of pillar electrodes and the second lower surfaces of the pair of pad electrodes.

公开(公告)号：US20170278638A1

公开(公告)日：2017-09-28

申请号：US15460265

申请日：2017-03-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Shinichiro KUROIWA

IPC: H01G4/40 ,  H01C1/012 ,  H01G4/005 ,  H01G4/248 ,  H01G4/232 ,  H01G4/30 ,  H01C1/14

CPC classification number: H01G4/40 ,  H01C1/012 ,  H01C1/14 ,  H01G2/06 ,  H01G4/005 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/611

Abstract: A composite electronic component includes a capacitor device and a resistor device disposed on one another in a heightwise direction. The capacitor device includes a capacitor body, a first external electrode, and a second external electrode. The resistor device includes a base portion, a resistor body, a first upper surface conductor, a second upper surface conductor, a first lower surface conductor, a second lower surface conductor, a first end surface connection conductor, and a second end surface connection conductor. An upper surface of the base portion of the resistor device faces a lower surface of the capacitor body of the capacitor device, the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.

公开(公告)号：US09775267B2

公开(公告)日：2017-09-26

申请号：US15213414

申请日：2016-07-19

Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.

Inventor： Min-Yuan Yang ,  Chien-Hsiang Huang ,  Hsin-Hong Wu ,  Lien-Cheng Tsai

IPC: H05K9/00 ,  G06F1/18 ,  H05K1/02 ,  H05K7/14 ,  H05K1/18 ,  H05K3/30 ,  H05K1/14

CPC classification number: H05K9/0024 ,  G06F1/185 ,  H05K1/0216 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/18 ,  H05K3/30 ,  H05K7/142 ,  H05K9/0039 ,  H05K2201/10015 ,  H05K2201/1031

Abstract: A structure for reducing electromagnetic interference is provided, which includes a circuit board, an expansion slot and an electrical conductor. The circuit board has an upper surface and a ground circuit. The expansion slot is disposed on the upper surface of the circuit board, and has at least one metal pin electrically connected to the circuit board. The electrical conductor is located above the upper surface of the circuit board, and a gap is maintained between the electrical conductor and the metal pin of the expansion slot to produce a capacitor. A method for reducing electromagnetic interference is further provided, for accomplishing the above-mentioned structure.

公开(公告)号：US09769925B2

公开(公告)日：2017-09-19

申请号：US14941327

申请日：2015-11-13

Applicant: ALCATEL-LUCENT CANADA INC.

Inventor： Alex L. Chan ,  Paul J. Brown

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/114 ,  H05K1/116 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A relieved component pad for 0201 component use between vias on a tight-pitch Ball Grid Array is disclosed herein. The relieved component pad for 0201 component use between vias provides substantially rectangular component pads having a relieved section at a point of closest approach to a via pad. The relieved component pad for 0201 component use is particularly useful for overcoming the problem of 0201 component placement on tight-pitch arrays known in the art.

公开(公告)号：US09763331B2

公开(公告)日：2017-09-12

申请号：US15066244

申请日：2016-03-10

Applicant: FUJITSU LIMITED

Inventor： Yoshiyuki Hiroshima ,  Naoki Nakamura ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukoyama ,  Tetsuro Yamada ,  Kohei Choraku

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0216 ,  H05K1/115 ,  H05K1/162 ,  H05K3/306 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10295

Abstract: A printed circuit board includes: a first electrode made of a tubular electric conductor formed on an inner wall of a first hole formed in the printed circuit board; a dielectric body disposed inside the first electrode; and a second electrode made of a tubular electric conductor formed on an inner wall of a second hole extending through the dielectric body, the second electrode having a center axis concentric with the first electrode.

公开(公告)号：US09743534B2

公开(公告)日：2017-08-22

申请号：US14878072

申请日：2015-10-08

Applicant: IBIDEN CO., LTD.

Inventor： Mitsuhiro Tomikawa ,  Kota Noda ,  Nobuhisa Kuroda ,  Haruhiko Morita

IPC: H05K1/03 ,  H05K3/46 ,  H05K1/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K3/4697 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/141 ,  H05K1/185 ,  H05K3/0038 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/10015 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2224/32225 ,  H01L2924/00012

Abstract: A wiring board with a built-in electronic component includes a substrate having cavity, an insulating layer formed on the substrate such that the insulating layer is covering the cavity, a conductor layer formed on the insulating layer, and an electronic component accommodated in the cavity and including a rectangular cuboid body and terminal electrodes such that each electrode has a metal film form formed on outer surface of the body, and via conductors formed in the insulating layer such that the via conductors are connecting the conductor layer and electrodes. The electrodes are arrayed in a matrix having rows and columns such that adjacent electrodes in row and column directions have the opposite polarities, and the conductor layer includes a line pattern shunting first group of the electrodes in one polarity and a solid pattern shunting second group of the electrodes in the other polarity.

公开(公告)号：US09728334B2

公开(公告)日：2017-08-08

申请号：US14801679

申请日：2015-07-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyo Kwang Lee ,  Jin Kim ,  Young Ghyu Ahn ,  Byoung Hwa Lee

IPC: H01G4/12 ,  H01G4/30 ,  H05K1/18 ,  H01G4/248 ,  H05K1/11 ,  H01G4/012 ,  H01G4/232

CPC classification number: H01G4/12 ,  H01G4/012 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/306 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  Y02P70/611

Abstract: A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body so as to be spaced apart from each other. When a height of at least one portion of the external electrode formed on one side surface of the ceramic body in a width direction is defined as d, and a thickness of the ceramic body is defined as T, a ratio of d/T satisfies 0.10≦d/T.

公开(公告)号：US20170221659A1

公开(公告)日：2017-08-03

申请号：US15328727

申请日：2015-09-18

Applicant: SCHNEIDER ELECTRIC INDUSTRIES SAS

Inventor： Hans SCHELLEKENS ,  Jean-Pierre GAUTHIER ,  Olivier CARDOLETTI ,  Maxime DURAND

IPC: H01H33/668 ,  G01R31/25 ,  H05K1/18

CPC classification number: H01H33/668 ,  G01R31/25 ,  H02B11/12 ,  H05K1/18 ,  H05K2201/10015

Abstract: A device for monitoring vacuum quality of a vacuum circuit breaker, the device including at least one rigid assembly including a first stationary conductive surface that is separated by an insulating layer from a second stationary conductive surface that is grounded. The assembly forms a first capacitor having a fixed value, the first stationary conductive surface being arranged opposite an electrically active portion of the vacuum circuit breaker to form, together with the portion, a second capacitor, and an electronic circuit for measuring a variation in voltage of the first capacitor that is representative of a change in state of the vacuum of the circuit breaker.

公开(公告)号：US20170221611A1

公开(公告)日：2017-08-03

申请号：US15490333

申请日：2017-04-18

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Hiroki YAMAMOTO ,  Katsuya MATSUURA ,  Yasuhiro KONDO

IPC: H01C1/14 ,  H01C10/16 ,  H01C17/00 ,  H01G5/40 ,  H01L33/62 ,  H05K1/18 ,  H05K3/34 ,  H01F29/08 ,  H01F41/04 ,  H01L27/15 ,  H01G5/011 ,  H01G5/38

CPC classification number: H01C1/14 ,  H01C10/16 ,  H01C10/50 ,  H01C17/006 ,  H01C17/23 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/40 ,  H01F29/00 ,  H01F29/08 ,  H01F41/041 ,  H01G2/16 ,  H01G4/33 ,  H01G4/38 ,  H01G4/40 ,  H01G5/011 ,  H01G5/38 ,  H01G5/40 ,  H01L24/32 ,  H01L25/105 ,  H01L25/13 ,  H01L27/0802 ,  H01L27/15 ,  H01L33/62 ,  H01L2221/68304 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2933/0066 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/3478 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10212 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00

Abstract: A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

公开(公告)号：US20170208710A1

公开(公告)日：2017-07-20

申请号：US15409260

申请日：2017-01-18

Applicant: Apple Inc.

Inventor： Albert Wang ,  Paul A. Martinez

IPC: H05K9/00 ,  H05K3/30 ,  G06F1/16 ,  G06F1/26 ,  H05K1/18

CPC classification number: G06F1/1613 ,  G06F1/1656 ,  G06F1/1658 ,  G06F1/182 ,  G06F1/183 ,  H01R43/205 ,  H05K2201/0715 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10636 ,  Y02P70/611

Abstract: The present disclosure relates to shield frames that reduce electromagnetic interference in electrical devices. The shield frames may be formed by coupling a shield frame lid to a ground connection of the circuit board through terminations in electrical components. The terminations in these electrical components thus may act both as a ground termination for the component as well as a ground connection for the shield frame. The components may be disposed in the perimeter of the circuit board to establish, with or without additional conductive posts, sections of the shield frame wall.