公开(公告)号：US20140211427A1

公开(公告)日：2014-07-31

申请号：US14171667

申请日：2014-02-03

Applicant: PULSE ELECTRONICS, INC.

Inventor： Michael T. Gilmartin ,  Fredrick J. Kiko ,  Alan H. Benjamin

IPC: H01F27/29 ,  H05K1/18

CPC classification number: H01F27/29 ,  H01F3/08 ,  H01F17/043 ,  H01F27/027 ,  H01F27/292 ,  H01F27/306 ,  H01F41/02 ,  H01F2027/065 ,  H05K1/18 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/1003 ,  Y10T29/4913 ,  Y10T29/49147

Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.

Abstract translation: 改进的无形电子设备及其制造方法。 在一个示例性实施例中，该装置包括形状芯感应装置，其具有形成并保持在装置内的接合线圈，而不需要绕线管或其它形式（呃）。 不存在筒管简化了设备的制造，降低了成本，并且允许其变得更紧凑（或者替代地附加在其中设置的功能）。 一种变型使用端接头来与PCB或其他组件配合，而另一种则完全避免了通过直接与PCB配合来使用插头。 还公开了多核变体和制造方法。

公开(公告)号：US08764493B2

公开(公告)日：2014-07-01

申请号：US13437856

申请日：2012-04-02

Applicant: Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

Inventor： Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

IPC: H01R13/66

CPC classification number: H01R13/66 ,  H01R12/70 ,  H01R13/6658 ,  H01R13/719 ,  H01R13/7193 ,  H01R24/64 ,  H05K1/0233 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10568 ,  H05K2201/2036

Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.

Abstract translation: 可安装在印刷电路板上的电连接器。 在一个实施例中，电连接器包括绝缘壳体，该绝缘壳体包括一个或多个电子部件，与电子部件信号通信的多个电导体，并且适于与插头和多个终端进行信号通信，该多个终端与一个或多个 电子元器件。 在一个方面，多个端子适于与印刷电路板上的一个或多个外部安装的电子部件接合，从而过滤在电导体和印刷电路板之间通过的信号，其中外部安装的电子部件安装在 电连接器。 还公开了上述电连接器的制造方法和业务方法。

公开(公告)号：US08749992B2

公开(公告)日：2014-06-10

申请号：US12999772

申请日：2009-06-16

Applicant: Oliver Konz

Inventor： Oliver Konz

IPC: H05K7/02 ,  H05K7/04 ,  H05K13/04 ,  H01H50/12 ,  H05K3/30

CPC classification number: H05K13/0408 ,  H01H50/12 ,  H05K3/301 ,  H05K3/303 ,  H05K13/0409 ,  H05K2201/1003 ,  H05K2201/10568 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  Y10S439/94

Abstract: For automatic attachment of electronic components onto circuit boards, it is proposed that the electronic component be provided with a holding element that comprises a gripping point for a suction gripper. The holding element is designed as a clip that can be connected to the electronic component. The connecting occurs preferably by a snap-on action, wherein a form fit or positive fit is achieved by the shape of the clip, which is made of plastic. Preferably, the clip comprises a rib on the inside thereof facing the electronic component, said rib extending over at least half the periphery and engaging in a gap in the surface of the electronic component. If the electronic component is a coil, the rib, which is directed inward, can run along a helical line.

Abstract translation: 为了将电子部件自动附接到电路板上，建议电子部件设置有保持元件，该保持元件包括用于吸引夹持器的夹紧点。 保持元件设计为可连接到电子元件的夹子。 连接优选地通过卡扣动作发生，其中通过由塑料制成的夹子的形状实现形状配合或正配合。 优选地，夹子包括在其面向电子部件的内侧上的肋，所述肋在至少一半的周边上延伸并且接合在电子部件的表面中的间隙中。 如果电子部件是线圈，则向内指向的肋可以沿着螺旋线行进。

公开(公告)号：US08749990B2

公开(公告)日：2014-06-10

申请号：US11564675

申请日：2006-11-29

Applicant: Sun-Wen Cyrus Cheng ,  Carl Milton Wildrick ,  Jeffrey John Boylan

Inventor： Sun-Wen Cyrus Cheng ,  Carl Milton Wildrick ,  Jeffrey John Boylan

IPC: H05K1/11 ,  H02B1/00

CPC classification number: H05K7/1092 ,  H02M3/00 ,  H05K1/144 ,  H05K1/182 ,  H05K2201/042 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10318

Abstract: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.

Abstract translation: 本发明提供一种DC-DC电力转换器，其包括彼此并联并且不封装的两个或更多个印刷布线板（PWB）。 电子元件可以安装在每个电路板的两侧。 PWB的开放设计和平行方向允许安装在PWB上的组件的气流。 PWB优选由具有铜箔的FR-4制成，一个较厚的板由更多的铜层组成，其它板由较少的铜层组成。 在优选实施例中，功率处理元件容纳在较厚的PWB中，而较薄的板容纳控制电路。

公开(公告)号：US08723374B2

公开(公告)日：2014-05-13

申请号：US13194383

申请日：2011-07-29

Applicant: Takeshi Kurihara ,  Keiichi Ichikawa

Inventor： Takeshi Kurihara ,  Keiichi Ichikawa

IPC: G05F3/06

CPC classification number: H02J50/10 ,  H01F38/14 ,  H02J5/005 ,  H02J7/025 ,  H02J50/12 ,  H02J50/70 ,  H05K1/0216 ,  H05K1/0265 ,  H05K1/115 ,  H05K2201/0792 ,  H05K2201/09627 ,  H05K2201/097 ,  H05K2201/0979 ,  H05K2201/1003 ,  H05K2201/10166

Abstract: The disclosure provides a non-contact power receiving apparatus including a conductive pattern in a second region of a substrate not covered by a magnetic sheet. The conductive pattern includes first and second electrodes provided in a first plane parallel to a surface of the substrate and arranged in a length direction of the conductive pattern. A third electrode is formed on a second plane parallel with the first plane. A first via hole connects superposed portions of the first and third electrodes to each other, and a second via hole connects superposed portions of the second and third electrodes to each other. As a result, loops of eddy currents generated in the conductive pattern can be made to be small, whereby eddy current loss can be reduced.

Abstract translation: 本公开提供一种非接触式电力接收装置，其包括在未被磁性片覆盖的基板的第二区域中的导电图案。 导电图案包括设置在与基板的表面平行的第一平面中并沿导电图案的长度方向布置的第一和第二电极。 第三电极形成在与第一平面平行的第二平面上。 第一通孔将第一和第三电极的叠置部彼此连接，第二通孔将第二电极和第三电极的叠置部彼此连接。 结果，可以使在导电图案中产生的涡流的回路小，从而可以减小涡流损耗。

公开(公告)号：US20140071636A1

公开(公告)日：2014-03-13

申请号：US13609391

申请日：2012-09-11

Applicant: Noah Andrew Sturcken

Inventor： Noah Andrew Sturcken

IPC: H05K1/18 ,  H01F5/00

CPC classification number: H05K1/181 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/02 ,  H01F41/041 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/0929 ,  H05K2201/1003 ,  Y02P70/611 ,  Y10T29/4913

Abstract: An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented.

Abstract translation: 电感器被集成到半导体集成电路的多电平布线网络中。 电感器包括平面磁芯和导电绕组。 导电绕组在平面磁芯的外侧以大致螺旋方式转动。 导电绕组由线段和VIA分段构成。 线段涉及至少两个布线平面，并且VIA将至少两个布线平面互连。 还提出了这种集成的方法和用于制造层压平面磁芯的方法。

公开(公告)号：US20140068932A1

公开(公告)日：2014-03-13

申请号：US13613011

申请日：2012-09-13

Applicant: Noah Andrew Sturcken

Inventor： Noah Andrew Sturcken

IPC: H05K3/30

CPC classification number: H05K1/181 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/02 ,  H01F41/041 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/0929 ,  H05K2201/1003 ,  Y02P70/611 ,  Y10T29/4913

Abstract: An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented.

公开(公告)号：US20130242519A1

公开(公告)日：2013-09-19

申请号：US13454027

申请日：2012-04-23

Applicant: FU-LI GAO ,  KUO-PIN LIN

Inventor： FU-LI GAO ,  KUO-PIN LIN

IPC: H05K7/06 ,  H05K1/09 ,  H05K1/16

CPC classification number: H05K1/0225 ,  H05K1/0233 ,  H05K2201/1003 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A printed circuit board includes an insulating layer and a conductive metal layer attached on the insulating layer. The conductive metal layer is grounded and is configured for providing a ground path for electronic components mounted on the printed circuit board. The insulating layer includes an exposed portion free of the conductive metal layer thereon, and two pads are formed on the exposed portion of the insulating layer and are insulated from each other. An inductor is mounted on the exposed portion and is electrically connected to the two pads.

Abstract translation: 印刷电路板包括绝缘层和连接在绝缘层上的导电金属层。 导电金属层接地，并且被配置为提供安装在印刷电路板上的电子部件的接地路径。 绝缘层包括其上没有导电金属层的暴露部分，并且在绝缘层的暴露部分上形成两个焊盘并彼此绝缘。 电感器安装在暴露部分上并与两个焊盘电连接。

公开(公告)号：US20130200977A1

公开(公告)日：2013-08-08

申请号：US13642469

申请日：2011-05-11

Applicant: Masashi Miyazaki ,  Yuichi Sugiyama ,  Yoshiki Hamada ,  Yutaka Hata ,  Hideki Yokota

Inventor： Masashi Miyazaki ,  Yuichi Sugiyama ,  Yoshiki Hamada ,  Yutaka Hata ,  Hideki Yokota

IPC: H01F27/32 ,  H01F27/29

CPC classification number: H01F27/327 ,  H01F17/0013 ,  H01F27/29 ,  H01F2017/0066 ,  H01L21/568 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4608 ,  H05K2201/0355 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0156 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electronic component to be embedded in a substrate is configured so that planar coils protected by insulators are sandwiched be a pair of magnetic layers. Ports, or openings or absent parts are provided at predetermined positions of one or both of the magnetic layers, and the predetermined positions correspond to the positions opposite to terminal electrodes of the planar coils. Accordingly, a contribution to reduction of the size and weight of electronic equipment can be made.

Abstract translation: 嵌入在基板中的电子部件被配置为使得由绝缘体保护的平面线圈被夹在一对磁性层之间。 在一个或两个磁性层的预定位置处提供端口或开口或不存在的部分，并且预定位置对应于与平面线圈的端子电极相对的位置。 因此，可以对电子设备的尺寸和重量的减小做出贡献。

公开(公告)号：US08498124B1

公开(公告)日：2013-07-30

申请号：US12634852

申请日：2009-12-10

Applicant: Donald Folker ,  Mark Bauer ,  Travis Berry ,  Mike LeBlanc

Inventor： Donald Folker ,  Mark Bauer ,  Travis Berry ,  Mike LeBlanc

IPC: H05K1/14

CPC classification number: H05K1/145 ,  H01F27/06 ,  H01F27/325 ,  H01F2027/065 ,  H05K1/0233 ,  H05K1/144 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/1003

Abstract: A magnetic component provides both electrical interconnectivity and mechanical support between stacked circuit boards. The magnetic component includes a bobbin structure and a magnetically permeable core. The bobbin structure includes an upper bobbin pin rail and a lower bobbin pin rail. The upper bobbin pin rail includes one or more upper bobbin pins extending from the upper bobbin pin rail. Each upper bobbin pin may be adapted for soldering onto a first circuit board. At least one lower bobbin pin extends from the lower bobbin pin rail. Each lower bobbin pin may also be adapted for soldering onto a second circuit board, forming a circuit board assembly. Each soldered connection between a bobbin pin and a circuit board may provide an electrical connection between the circuit board and the magnetic component. Each soldered connection may also provide a mechanical attachment between a printed circuit board and the magnetic component. A conductive coil is positioned on the bobbin structure and may be connected to an upper or lower bobbin pin. The core is positioned near the conductive coil for providing an electrical connection between the circuit boards through magnetic coupling.

Abstract translation: 磁性部件提供堆叠电路板之间的电互连和机械支撑。 磁性部件包括线轴结构和磁导芯。 线轴结构包括上梭芯导轨和下梭芯导轨。 上梭销导轨包括从上筒管销导轨延伸的一个或多个上筒管销。 每个上筒管可以适于焊接到第一电路板上。 至少一个下梭骨销从下梭芯导轨延伸。 每个下筒管也可以适于焊接到第二电路板上，形成电路板组件。 梭芯和电路板之间的每个焊接连接可以在电路板和磁性部件之间提供电连接。 每个焊接连接也可以在印刷电路板和磁性部件之间提供机械连接。 导线圈位于线轴结构上，并可连接到上或下梭芯。 芯线位于导电线圈附近，用于通过磁耦合在电路板之间提供电连接。