公开(公告)号：US4905371A

公开(公告)日：1990-03-06

申请号：US237586

申请日：1988-08-26

Applicant: Deepak K. Pai

Inventor： Deepak K. Pai

IPC: H05K1/02 ,  H05K3/26 ,  H05K3/34 ,  H05K3/38

CPC classification number: H05K1/0269 ,  H05K2201/0108 ,  H05K2201/10204 ,  H05K3/26 ,  H05K3/341 ,  H05K3/388 ,  Y10T29/49144

Abstract: An apparatus and method for a cleaning process control is disclosed. The apparatus includes a printed wire circuit board that is made on a Pyrex glass or other transparent substrate. Components are attached to the printed wire circuit board and then the circuit card assembly which is formed is cleaned using a selected cleaning process. The circuit card assembly can then be inspected to determine the effectiveness of a particular cleaning process by flipping over the transparent circuit card, peering through the substrate to inspect for corrosion and solder balls. The circuit card assembly can then be cleaned more extensively and used again to check a different cleaning process.

Abstract translation: 公开了一种用于清洁过程控制的装置和方法。 该装置包括制造在Pyrex玻璃或其它透明基板上的印刷线路板。 组件附接到印刷线路板上，然后使用选择的清洁过程清洁形成的电路卡组件。 然后可以检查电路卡组件，以通过翻转透明电路卡来确定特定清洁过程的有效性，通过基板对准以检查腐蚀和焊球。 然后可以更广泛地清洁电路卡组件，并再次使用以检查不同的清洁过程。

公开(公告)号：US4680627A

公开(公告)日：1987-07-14

申请号：US838713

申请日：1986-03-12

Applicant: Akira Sase ,  Takeo Nagata ,  Masao Fukunaga ,  Yutaka Sakurai ,  Yoshikatsu Satomi, deceased

Inventor： Akira Sase ,  Takeo Nagata ,  Masao Fukunaga ,  Yutaka Sakurai ,  Yoshikatsu Satomi, deceased

IPC: H05K3/00 ,  G01B11/24 ,  G01N21/93 ,  G01N21/956 ,  G06K9/64 ,  G06T3/00 ,  H05K1/02

CPC classification number: H05K1/0269 ,  G01N21/95607 ,  G06K9/6203 ,  H05K2201/09781 ,  H05K2201/10204 ,  H05K2203/163

Abstract: In an apparatus for checking patterns on printed circuit boards by comparing two patterns formed on two printed circuit boards, registration patterns each including orthogonal straight line segments and respectively formed on the two printed circuit boards are imaged by two imagers, and registration images from the imagers are matched by means of a registration unit to accurately match an image of a pattern to be checked on one printed circuit board with an image of a reference pattern on the other printed circuit board.

Abstract translation: 在通过比较在两个印刷电路板上形成的两个图案来检查印刷电路板上的图案的装置中，分别形成在两个印刷电路板上的正交直线段的配准图案由两个成像器成像，并且来自成像器的记录图像 通过注册单元进行匹配，以在一个印刷电路板上精确地匹配要检查的图案的图像与另一个印刷电路板上的参考图案的图像。

公开(公告)号：US4280775A

公开(公告)日：1981-07-28

申请号：US917298

申请日：1978-06-20

Applicant: Ross C. Wood

Inventor： Ross C. Wood

IPC: B23B39/00 ,  B23Q1/36 ,  B23Q1/38 ,  B23Q1/62 ,  B23Q35/02 ,  H05K3/00 ,  B23B39/08

CPC classification number: B23Q35/02 ,  B23B39/003 ,  B23Q1/36 ,  B23Q1/38 ,  B23Q1/621 ,  H05K3/0008 ,  H05K2201/10204 ,  H05K3/0047 ,  H05K3/0097 ,  Y10T408/08 ,  Y10T408/10 ,  Y10T408/15 ,  Y10T408/3833 ,  Y10T408/3839 ,  Y10T408/385 ,  Y10T408/44 ,  Y10T408/52 ,  Y10T409/302352

Abstract: A system for controllably positioning printed circuit boards or the like for the automatic drilling of holes therein. A plurality of individual work positions is provided, together with corresponding work carrier plates having individual or groups of circuit boards affixed thereto. Each work position includes a work table, a drilling machine with associated control equipment, a carrier plate for the circuit boards, and means for supporting the carrier plate and circuit boards above the work table with minimal resistance to lateral movement of the carrier plate and boards. The carrier plates are tied to a central drive system controlled by an automatic control unit in a manner which rigidly maintains close tolerances to lateral movement while permitting vertical displacement relative to the work tables. A master table is included for the drilling of a master template and to prevent displacement errors in the holes to be drilled. The drilling machines employed in the system may be independently activated in accordance with the quantity of production and the number of work positions needed in any given hole drilling operation and incorporate various interlocked fail-safe mechanism, some of which are individually adjustable, to simplify the construction and operation of the system while insuring coordinated control of the plurality of drilling machines.

Abstract translation: 一种用于可控地定位用于在其中自动钻孔的印刷电路板等的系统。 提供了多个单独的工作位置，以及具有固定到其上的单独或一组电路板的相应工作承载板。 每个工作位置包括工作台，具有相关联的控制设备的钻孔机，用于电路板的承载板，以及用于在承载板和板的横向运动的最小阻力的情况下将承载板和电路板支撑在工作台上方的装置 。 承载板以与自动控制单元控制的中心驱动系统相连接，该方式能够将横向移动刚性地保持在公差上，同时允许相对于工作台的垂直位移。 包括主表用于钻取主模板，并防止钻孔中的位移误差。 系统中使用的钻孔机可以根据生产量和任何给定的钻孔操作中所需的工件位置的数量独立地启动，并且包括各种互锁的故障安全机构，其中一些可单独调节以简化 同时确保对多台钻机的协调控制。

公开(公告)号：US3369293A

公开(公告)日：1968-02-20

申请号：US31985063

申请日：1963-10-29

Applicant: MC DONNELL DOUGLAS CORP

Inventor： TILLOTSON RAYMOND N

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K3/0002 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0047 ,  H05K3/0082 ,  H05K3/427 ,  H05K2201/09845 ,  H05K2201/10204 ,  H05K2203/0554 ,  H05K2203/056 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T29/49165 ,  Y10T408/03 ,  Y10T408/55

公开(公告)号：US2975661A

公开(公告)日：1961-03-21

申请号：US963960

申请日：1960-02-18

Applicant: COLEMAN MACHINE COMPANY INC

Inventor： JAMES COLEMAN

IPC: B23B35/00 ,  B23Q35/02 ,  H05K3/00

CPC classification number: B23Q35/02 ,  B23B35/005 ,  H05K3/0008 ,  H05K3/0047 ,  H05K2201/10204 ,  Y10T408/17 ,  Y10T408/46 ,  Y10T408/566

公开(公告)号：US20180255650A1

公开(公告)日：2018-09-06

申请号：US15760644

申请日：2016-09-16

Applicant: AT&S (China) Co. Ltd.

Inventor： Annie Tay ,  Nikolaus Bauer-Oeppinger ,  Giordano DiGregorio ,  Philips Dai

IPC: H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K3/4682 ,  H05K1/0271 ,  H05K1/0393 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/022 ,  H05K3/108 ,  H05K3/4638 ,  H05K2201/068 ,  H05K2201/10204 ,  H05K2203/0156 ,  H05K2203/1536

Abstract: A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The component carriers include at least one electrically insulating layer structure, and at least one electrically conductive layer structure. The at least one electrically insulating layer structure relates to a respective one of the component carriers. Located closest to the sacrificial structure are pure or unprocessed electrically insulating layers without electrically conductive material therein.

公开(公告)号：US20180132346A1

公开(公告)日：2018-05-10

申请号：US15798578

申请日：2017-10-31

Applicant: Japan Display Inc.

Inventor： Atsuhiro Yamano ,  Shinichi Nukumizu

IPC: H05K1/02 ,  H05K1/18 ,  H01G4/12 ,  H05B33/08 ,  H01G4/30

CPC classification number: H05K1/0271 ,  H01G4/12 ,  H01G4/30 ,  H05B33/0821 ,  H05K1/18 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/2045

Abstract: According to one embodiment, an electronic device includes a circuit board and a circuit component on an upper surface or a lower surface of the circuit board. The circuit component includes a first ceramic capacitor and a second ceramic capacitor. Vibration characteristics of the first ceramic capacitor and a second ceramic capacitor are opposed to each other. The first ceramic capacitor is near the second ceramic capacitor to cause vibrations of the first and second ceramic capacitors to cancel each other.

公开(公告)号：US20180020555A1

公开(公告)日：2018-01-18

申请号：US15714188

申请日：2017-09-25

Applicant: Sivantos Pte. Ltd.

Inventor： Stefanie BEYFUSS ,  Holger KRAL ,  Bjoern FREELS ,  Johannes KUHN

IPC: H05K3/34 ,  H04R25/00 ,  H05K3/00

CPC classification number: H05K3/341 ,  H04R25/00 ,  H04R25/60 ,  H05K3/0076 ,  H05K3/284 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/10204 ,  H05K2201/1028 ,  H05K2203/0228 ,  H05K2203/0557 ,  H05K2203/107

Abstract: A method for manufacturing a circuit, in particular of a hearing aid, in which method a printed circuit board is made available with a first region and with a second region which are separated by means of a boundary. A component is mounted on the printed circuit board, wherein the component is positioned on the boundary. The first region is covered by means of a mask which has an edge, wherein the edge is positioned on the component, and the printed circuit board is provided with a coating. The coating is cut away in the region of the component and the mask is removed.

公开(公告)号：US09699916B2

公开(公告)日：2017-07-04

申请号：US14707295

申请日：2015-05-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takahiro Hayashi

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/28 ,  H05K1/02 ,  H05K3/46 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40

CPC classification number: H05K3/28 ,  H05K1/0284 ,  H05K3/188 ,  H05K3/243 ,  H05K3/244 ,  H05K3/282 ,  H05K3/381 ,  H05K3/383 ,  H05K3/4007 ,  H05K3/46 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09409 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0307 ,  H05K2203/0574 ,  H05K2203/058 ,  H05K2203/0597 ,  H05K2203/0766 ,  Y10T29/49156

Abstract: A method of manufacturing a wiring substrate according to the present invention includes a step of forming a wiring layer including connection terminals on a first insulating layer; a step of forming a second insulating layer on the wiring layer and on the first insulating layer; a step of forming electrically insulative dummy portions separated from the wiring layer on the first insulating layer through patterning of the second insulating layer; a step of forming a third insulating layer on the wiring layer, on the dummy portions, and on the first insulating layer; and a step of forming openings in the third insulating layer for exposing the connection terminals in such a manner that upper end portions of the connection terminals protrude from the third insulating layer, and lower end portions of the connection terminals are embedded in the third insulating layer.

公开(公告)号：US20170084976A1

公开(公告)日：2017-03-23

申请号：US15364899

申请日：2016-11-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuo IKEMOTO ,  Yuki WAKABAYASHI ,  Shigeru TAGO

IPC: H01P3/08 ,  H05K1/11 ,  H01R12/62 ,  H05K3/46 ,  H01P11/00 ,  H05K1/02 ,  H05K3/36

CPC classification number: H01P3/082 ,  H01P3/08 ,  H01P11/003 ,  H01R12/62 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/115 ,  H05K1/118 ,  H05K1/147 ,  H05K3/0052 ,  H05K3/363 ,  H05K3/4623 ,  H05K3/4632 ,  H05K2201/07 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/097 ,  H05K2201/09845 ,  H05K2201/10037 ,  H05K2201/10204 ,  Y10T29/49016

Abstract: In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.