公开(公告)号：US20240251499A1

公开(公告)日：2024-07-25

申请号：US18158085

申请日：2023-01-23

Applicant: Meta Platforms Technologies, LLC

Inventor： Qiuming Li ,  Colden Niles Eldridge ,  Ming Lei ,  Yibo Liu ,  Md Rashidul Islam ,  Sung Hoon Oh

IPC: H05K1/02

CPC classification number: H05K1/0215 ,  H05K1/0237 ,  H05K1/0271 ,  H05K2201/10098 ,  H05K2201/10401 ,  H05K2201/10409

Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20180263537A1

公开(公告)日：2018-09-20

申请号：US15728597

申请日：2017-10-10

Applicant: Abbott Diabetes Care Inc.

Inventor： Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel M. Curry

IPC: A61B5/1486 ,  A61B5/1473 ,  A61B5/1468 ,  A61B5/145

CPC classification number: A61B5/1486 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/4839 ,  A61B5/6848 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

公开(公告)号：US09782112B2

公开(公告)日：2017-10-10

申请号：US15047476

申请日：2016-02-18

Applicant: Abbott Diabetes Care Inc.

Inventor： Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel M. Curry

IPC: H05K5/00 ,  A61B5/1486 ,  A61B5/00 ,  A61B5/145 ,  A61B5/1468 ,  A61B5/1473 ,  H05K3/32 ,  H01L23/00 ,  H05K3/36

CPC classification number: A61B5/1486 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/4839 ,  A61B5/6848 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

公开(公告)号：US09541273B2

公开(公告)日：2017-01-10

申请号：US14284599

申请日：2014-05-22

Applicant: Wen-Sung Hu

Inventor： Wen-Sung Hu

IPC: F21V29/50 ,  F21V19/00 ,  F21V29/74 ,  H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  F21Y101/00

CPC classification number: F21V29/50 ,  F21K9/23 ,  F21V19/005 ,  F21V19/0055 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/0061 ,  H05K2201/042 ,  H05K2201/10106 ,  H05K2201/10401 ,  H05K2201/10409

Abstract: A heat dissipation structure of an SMD LED includes a substrate, an SMD LED and at least one engaging member. A plurality of conductive copper foils is covered on an upper end face of the substrate. Two electrodes are provided on a lower surface of the SMD LED and are respectively connected to two copper foils on the upper end face. An engaging hole extends through one of the copper foils adjacent the SMD LED and through the substrate. The engaging member is made of high thermal conductive metal and is engaged in the engaging hole to combine the copper foil and the substrate. Accordingly, heat generated by the SMD LED can be directly transferred to an exposed lower end face of the substrate through the engaging member for more heat dissipation and less luminance decrease of the SMD LED.

Abstract translation: SMD LED的散热结构包括衬底，SMD LED和至少一个接合构件。 多个导电铜箔被覆盖在基板的上端面上。 两个电极设置在SMD LED的下表面上，分别连接在上端面上的两个铜箔上。 接合孔延伸穿过与SMD LED相邻的铜箔中的一个并穿过衬底。 接合构件由高导热金属制成，并且接合在接合孔中以组合铜箔和基底。 因此，SMD LED产生的热量可以通过接合部件直接传递到基板的露出的下端面，从而更加散热，并且SMD LED的亮度降低。

公开(公告)号：US09007781B2

公开(公告)日：2015-04-14

申请号：US13526136

申请日：2012-06-18

Applicant: Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel M. Curry

Inventor： Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel M. Curry

IPC: H05K5/00 ,  H05K3/32 ,  A61B5/00 ,  A61B5/145 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/1486 ,  H01L23/00 ,  H05K3/36

CPC classification number: A61B5/1486 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/4839 ,  A61B5/6848 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

Abstract translation: 提供将分析物传感器（例如分析物传感器的导电构件）连接到诸如传感器电子单元（例如传感器控制单元）的其它设备的分析物传感器连接器。 还提供了包括分析物传感器，分析物传感器连接器和分析物传感器电子单元的系统，以及建立和维持分析物传感器和分析物传感器电子单元之间的连接的方法以及分析物监测/检测的方法。 还提供了使分析物传感器连接器和包括分析物传感器连接器的系统的方法。

公开(公告)号：US20130248584A1

公开(公告)日：2013-09-26

申请号：US13989818

申请日：2012-08-30

Applicant: Xiaofeng Bi

Inventor： Xiaofeng Bi

IPC: B23K31/02

CPC classification number: B23K31/02 ,  H01L33/64 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10416

Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.

Abstract translation: 制作大功率LED散热结构的工艺包括：（1）提供PCB板，导热板和散热板; （2）提供穿过PCB板的第一定位孔和第一固定孔，并将铜板焊接到PCB板的一侧; 同时将电极焊接脚焊接到PCB板的另一侧; （3）提供穿过导热板的第二定位孔和第二固定孔; （4）使用固定柱穿过用于将PCB板和导热板连接在一起的两个固定孔; （5）使用导热柱刺穿两个定位孔; （6）将导热板和PCB板的一体放置在压制设备上以调节导热柱的高度。

公开(公告)号：US08254141B2

公开(公告)日：2012-08-28

申请号：US12656798

申请日：2010-02-17

Applicant: Tsan-Chi Chen

Inventor： Tsan-Chi Chen

IPC: H01R9/00

CPC classification number: H05K3/202 ,  H05K1/0263 ,  H05K3/306 ,  H05K2201/10401 ,  H05K2203/167

Abstract: The present invention is to provide a circuit board capable of loading high electrical current, which comprises an insulation plate and a plurality of conductive plates each positioned on the insulation plate by riveting. A plurality of first insertion holes of the insulation plate are aligned with a plurality of second insertion holes of the conductive plates, respectively, so that the aligned first and second insertion holes of the circuit board can be welded with a plurality of electric components (such as resistors, capacitors, fuses, etc.). Therefore, the insulation plate and each of the conductive plates can be easily combined with each other by riveting to form a finished product of the circuit board without some complicated steps including exposure, development and etching, so that the manufacturing process of the circuit board capable of loading high electrical current can be efficiently simplified.

Abstract translation: 本发明提供一种能够承受高电流的电路板，其包括绝缘板和多个导电板，每个导电板通过铆接定位在绝缘板上。 绝缘板的多个第一插入孔分别与导电板的多个第二插入孔对准，使得电路板的排列的第一和第二插入孔可以焊接有多个电气部件（例如 作为电阻器，电容器，保险丝等）。 因此，通过铆接可以容易地将绝缘板和每个导电板彼此组合以形成电路板的成品，而不需要包括曝光，显影和蚀刻的一些复杂的步骤，使得电路板的制造过程能够 可以有效地简化装载高电流的装置。

公开(公告)号：US08251711B2

公开(公告)日：2012-08-28

申请号：US13328214

申请日：2011-12-16

Applicant: Fredrik Ohlsson

Inventor： Fredrik Ohlsson

IPC: H01R12/00

CPC classification number: H05K9/0039 ,  H05K1/142 ,  H05K3/0061 ,  H05K9/002 ,  H05K2201/10401

Abstract: A method and device for electromagnetic shielding is disclosed. An example arrangement includes a first and a second printed circuit board arranged adjacently and having an electromagnetic shield cover. An electrically conductive plug electrically provides an interconnection of the electromagnetic shielding.

Abstract translation: 公开了一种用于电磁屏蔽的方法和装置。 示例性布置包括相邻布置且具有电磁屏蔽罩的第一和第二印刷电路板。 导电插头电气地提供电磁屏蔽的互连。

公开(公告)号：US20120127681A1

公开(公告)日：2012-05-24

申请号：US13010709

申请日：2011-01-20

Applicant: Ji Man RYU ,  Kwan Ho LEE ,  Kyu Bum HAN ,  Seog Moon CHOI ,  Jin Su KIM

Inventor： Ji Man RYU ,  Kwan Ho LEE ,  Kyu Bum HAN ,  Seog Moon CHOI ,  Jin Su KIM

IPC: H01R9/00 ,  H05K3/00 ,  H01B5/00

CPC classification number: H05K3/306 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13017 ,  H01L2224/1601 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/1607 ,  H01L2224/16235 ,  H01L2224/16501 ,  H01L2224/811 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81899 ,  H01L2224/81906 ,  H01L2224/8192 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/351 ,  H05K3/3447 ,  H05K2201/10166 ,  H05K2201/10401 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein are a soldering connecting pin, a semiconductor package substrate and a method of mounting a semiconductor chip using the same. A semiconductor chip is mounted on the printed circuit board using the soldering connecting pin inserted into a through-hole of the printed circuit board, thereby preventing deformation of the semiconductor package substrate and fatigue failure due to external shocks.

Abstract translation: 这里公开了一种焊接连接引脚，半导体封装基板和使用该半导体封装基板的半导体芯片的安装方法。 使用插入印刷电路板的通孔中的焊接连接销将半导体芯片安装在印刷电路板上，从而防止半导体封装基板的变形和由于外部冲击引起的疲劳失效。

公开(公告)号：US07985929B2

公开(公告)日：2011-07-26

申请号：US11896204

申请日：2007-08-30

Applicant: Yasuto Watanabe ,  Hiroyuki Fujita ,  Kunio Watanabe

Inventor： Yasuto Watanabe ,  Hiroyuki Fujita ,  Kunio Watanabe

IPC: H05K1/11

CPC classification number: H05K3/4046 ,  H05K3/0047 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/09845 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10962 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A circuit board and a method of manufacturing the same are provided. The circuit board includes: a multilayer board in which a plurality of conductive layers with desired patterns formed therein, and a plurality of insulating layers are stacked; a plurality of through holes penetrating the multilayer board; cylindrical recesses each formed around a through hole corresponding thereto, having a diameter larger than that of the through hole, having a depth from an outermost surface of the insulating layer to a surface of the conductive layer for electrical connection, and partially exposing the surface of the predetermined conductive layer; and a plurality of conductive terminals fitted into the through holes.

Abstract translation: 提供一种电路板及其制造方法。 电路板包括：多层板，其中形成有所需图案的多个导电层，并且堆叠多个绝缘层; 贯穿多层基板的多个通孔; 圆柱形凹部各自围绕与其对应的通孔形成，其直径大于通孔的直径，具有从绝缘层的最外表面到用于电连接的导电层的表面的深度，并且部分地暴露 所述预定导电层; 以及配置在通孔中的多个导电端子。