公开(公告)号：US07639503B2

公开(公告)日：2009-12-29

申请号：US12042182

申请日：2008-03-04

Applicant: Makoto Tanaka

Inventor： Makoto Tanaka

IPC: H05K7/20

CPC classification number: H05K1/0271 ,  G06F1/203 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/0058 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/2009 ,  H01L2924/00

Abstract: According to one embodiment, a printed circuit board comprises a printed wiring board, circuit component, reinforcing plate and first and second fixing portion. The printed wiring board includes first and second areas. The first fixing portion is provided on a border line that defines the first and second areas. The first fixing portion can fix the reinforcing plate to both the first and second areas. The second fixing portion comprises a pair of elements arranged symmetrical with respect to the border line.

Abstract translation: 根据一个实施例，印刷电路板包括印刷线路板，电路部件，加强板以及第一和第二固定部分。 印刷电路板包括第一和第二区域。 第一固定部分设置在限定第一和第二区域的边界线上。 第一固定部分可以将加强板固定到第一和第二区域。 第二固定部分包括相对于边界线对称布置的一对元件。

公开(公告)号：US20090296360A1

公开(公告)日：2009-12-03

申请号：US12131410

申请日：2008-06-02

Applicant: Drew G. Doblar ,  Prabhansu Chakrabarti ,  Michael J. Bushue

Inventor： Drew G. Doblar ,  Prabhansu Chakrabarti ,  Michael J. Bushue

IPC: H05K7/10 ,  H05K7/00 ,  H05K3/34

CPC classification number: H05K7/1061 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/0262 ,  H05K1/141 ,  H05K3/301 ,  H05K3/3436 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/10545 ,  H05K2201/10598 ,  H05K2201/10734 ,  Y10T29/49144

Abstract: A voltage regulator. The voltage regulator includes an interposer having, on a first side, a plurality of electrical connections suitable for coupling to a printed circuit board (PCB). The interposer also includes at least one power plane and at least one ground plane, wherein each of the power and ground planes is coupled to one or more of the electrical connections. The voltage regulator further includes a DC-DC converter that is electro-mechanically attachable to and detachable from the interposer. The interposer includes a socket, on a second side, that is suitable to receive two or more electro-mechanical connecting members of the DC-DC converter. When the DC-DC converter is attached to the interposer, at least one of the electromechanical connecting members is electrically coupled to a power plane of the interposer, while at least one other one of the electromechanical connecting members is electrically coupled to the ground plane.

Abstract translation: 电压调节器。 电压调节器包括插入器，其在第一侧具有适于耦合到印刷电路板（PCB）的多个电连接。 插入器还包括至少一个电源平面和至少一个接地平面，其中功率和接地平面中的每一个耦合到一个或多个电连接。 该电压调节器还包括一个DC-DC转换器，该DC-DC转换器可以机械地机械地连接到插入件上并从插入件上拆下。 插入器包括在第二侧上的适于接收DC-DC转换器的两个或更多个机电连接构件的插座。 当DC-DC转换器附接到插入器时，机电连接构件中的至少一个电耦合到插入器的功率平面，而机电连接构件中的至少一个电耦合到接地平面。

公开(公告)号：US20090213552A1

公开(公告)日：2009-08-27

申请号：US11659297

申请日：2005-07-14

Applicant: Anton Mauder ,  Wolfgang Scholz

Inventor： Anton Mauder ,  Wolfgang Scholz

IPC: H05K7/20

CPC classification number: G02B6/4494 ,  G02B6/441 ,  H01L2924/0002 ,  H05K3/325 ,  H05K2201/10409 ,  H05K2201/10689 ,  H05K2201/2036 ,  H01L2924/00

Abstract: The invention relates to a component arrangement comprising: an electronics module (10); a heat sink (20) contacted by the electronics module (10); a printed circuit board (30), and; a fastening means (40) for fastening the electronics module (10) to the printed circuit board (30) and to the heat sink (20). The electronics module (10) has at least one elastic connecting limb (11) for the solder-free contacting of the electronics module (10) with the printed circuit board (30) and has a location (14) for the fastening means (40). The electronics module (10) additionally comprises a decoupling means (12) for decoupling the force of pressure between the connecting limb (11) and the printed circuit board (30) from the contact force between the heat sink (20) and the electronics module (10). Another aspect of the invention concerns an electronics module (10) that can be used in the aforementioned component arrangement.

Abstract translation: 本发明涉及一种组件装置，包括：电子模块（10）; 由所述电子模块（10）接触的散热器（20）; 印刷电路板（30），和 用于将电子模块（10）紧固到印刷电路板（30）和散热器（20）的紧固装置（40）。 电子模块（10）具有用于电子模块（10）与印刷电路板（30）的无焊料接触的至少一个弹性连接臂（11），并且具有用于紧固装置（40）的位置（14） ）。 电子模块（10）还包括用于将连接臂（11）和印刷电路板（30）之间的压力与散热器（20）和电子模块（20）之间的接触力分离的解耦装置（12） （10）。 本发明的另一方面涉及一种可用于上述组件布置的电子模块（10）。

公开(公告)号：US07538420B2

公开(公告)日：2009-05-26

申请号：US11832978

申请日：2007-08-02

Applicant: Yoshihiro Morita

Inventor： Yoshihiro Morita

IPC: H01L23/02

CPC classification number: H05K1/0271 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/0058 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2224/0401

Abstract: A package mounted module wherein a package board on the topside surface of which a semiconductor chip such as an LSI is mounted is further mounted on the topside surface of the motherboard of a large-scale computing machine such as a large-sized computer, and a stiffener is provided on the underside surface of the motherboard. In order to improve the reliability of solder bonding, a stiffener is fixed to the motherboard with screws at plural locations on the periphery of the stiffener and is also fixed to the motherboard with a screw in the central part of the stiffener.

Abstract translation: 一种封装安装模块，其中安装有诸如LSI的半导体芯片的顶表面上的封装板进一步安装在大型计算机例如大型计算机的主板的顶侧表面上，并且 加强件设置在母板的下表面上。 为了提高焊接的可靠性，在加强件的周围的多个位置处用螺钉将加强件固定在母板上，并且还在加强件的中心部分用螺钉固定在母板上。

公开(公告)号：US20090121342A1

公开(公告)日：2009-05-14

申请号：US12136117

申请日：2008-06-10

Applicant: Atsushi MINAKAWA ,  Mamoru SEKIYA ,  Norio UMEZU

Inventor： Atsushi MINAKAWA ,  Mamoru SEKIYA ,  Norio UMEZU

IPC: H01L23/36 ,  H01L21/58

CPC classification number: H01L23/4006 ,  H01L25/112 ,  H01L2023/4056 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/14 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.

Abstract translation: 根据本发明的优选实施例的半导体器件是包括主衬底和一个或多个子衬底的半导体器件，并且半导体器件包括安装在子衬底上的第一发热器件，安装到第一衬底的子衬底散热器 发热装置和安装在主基板上的主基板散热器，其中，辅助基板散热器和主基板散热器彼此固定，使得在子基板和主基板之间存在预定的位置关系 。

公开(公告)号：US20090052146A1

公开(公告)日：2009-02-26

申请号：US11992729

申请日：2006-07-05

Applicant: Georg Busch ,  Volker Detering ,  Ludger Hinken ,  Ralf Lorenz

Inventor： Georg Busch ,  Volker Detering ,  Ludger Hinken ,  Ralf Lorenz

IPC: H05K1/18

CPC classification number: H05K1/0204 ,  H05K1/0206 ,  H05K1/024 ,  H05K1/0243 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10416

Abstract: The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled. In order to prevent short-circuits and allow power connections, an additional layer is arranged on the printed board above the inlay and simultaneously below the component to be cooled and comprises thermic provisions between a component to be cooled and the inlay for ensuring a good to excellent heat conduction from the heating zone of a component to be cooled to the inlay.

Abstract translation: 本发明涉及一种印刷电路板，其包括镶嵌，并且其一面设置有电气部件，并且其另一面上安装有用于冷却部件的至少一个单个冷却元件。 待冷却的部件，嵌体和冷却元件彼此对准。 这些部件是例如具有高达10至15瓦特的热发射的大功率输出级电路的SMD部件。 为了冷却结构，将要冷却的部件的销之间的加热区域产生的热量被引导到嵌体，该嵌体的尺寸使得其比待冷却部件的销的下方延伸得更远。 为了防止短路并允许电源连接，在印刷板上布置了另外的层，并且同时在待冷却部件的下面，并且包括待冷却部件与嵌入部件之间的热定形，以确保良好的 从要冷却的部件的加热区到嵌体的良好的热传导。

公开(公告)号：US07458844B2

公开(公告)日：2008-12-02

申请号：US11309403

申请日：2006-08-04

Applicant: Chun-Hung Chen

Inventor： Chun-Hung Chen

IPC: H01R31/08

CPC classification number: H05K1/0216 ,  H05K1/0215 ,  H05K3/222 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/10409

Abstract: A grounding device for reducing electromagnetic interference (EMI) on a printed circuit board (PCB) includes a grounded portion formed on the PCB, a threaded hole defined in the PCB, and a connecting member. The grounded portion is a part of a grounding layer of the PCB and with high impedance. The threaded hole is grounded and with low impedance. The connecting member includes a first connecting tab and a second connecting tab separately formed at opposite ends thereof. The first connecting tab is electrically connected with the threaded hole via a screw. The second connecting end resiliently abuts against the grounded portion of the PCB.

Abstract translation: 用于降低印刷电路板（PCB）上的电磁干扰（EMI）的接地装置包括形成在PCB上的接地部分，在PCB中限定的螺纹孔和连接部件。 接地部分是PCB的接地层的一部分，具有高阻抗。 螺纹孔接地，阻抗低。 连接构件包括分别形成在其相对端部处的第一连接翼片和第二连接翼片。 第一连接片通过螺丝与螺纹孔电连接。 第二连接端弹性地邻接PCB的接地部分。

公开(公告)号：US20080250435A1

公开(公告)日：2008-10-09

申请号：US12073713

申请日：2008-03-07

Applicant: Pyo Kim ,  Young-Sun Yoo ,  Dong-Woo Rhee ,  Sang-Kyu Lee

Inventor： Pyo Kim ,  Young-Sun Yoo ,  Dong-Woo Rhee ,  Sang-Kyu Lee

IPC: G11B17/03

CPC classification number: G11B33/12 ,  G11B33/123 ,  H05K1/0215 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/3442 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/10151 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2203/167

Abstract: An optical disk apparatus is disclosed which includes a first printed circuit board, on which a first circuit pattern is formed; a rotor, on which an optical disk may be placed, and which is electrically connected with the first circuit pattern; a second printed circuit board, which is stacked adjacent to the rotor on a surface of the first printed circuit board, and on which a second circuit pattern is formed; a sensor unit, which is mounted on the second printed circuit board in electrical connection with the second circuit pattern, and which is configured to sense a rotation of the optical disk; and a support plate, which supports the first printed circuit board and the rotor. In this optical disk apparatus, a separate printed circuit board can be utilized to support the sensor unit, whereby manufacturing costs can be reduced and working efficiency can be improved.

Abstract translation: 公开了一种光盘装置，其包括形成有第一电路图案的第一印刷电路板; 转子，其上可以放置光盘，并且与第一电路图案电连接; 第二印刷电路板，其在所述第一印刷电路板的表面上与所述转子相邻地堆叠，并且其上形成有第二电路图案; 传感器单元，其安装在与第二电路图案电连接的第二印刷电路板上，并且被配置为感测光盘的旋转; 以及支撑第一印刷电路板和转子的支撑板。 在该光盘装置中，可以使用单独的印刷电路板来支撑传感器单元，由此可以降低制造成本并且可以提高工作效率。

公开(公告)号：US20080174944A1

公开(公告)日：2008-07-24

申请号：US11958485

申请日：2007-12-18

Applicant: JAEYOUNG YEO

Inventor： JAEYOUNG YEO

IPC: G06F1/16

CPC classification number: H05K1/142 ,  H05K1/148 ,  H05K1/18 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/10409

Abstract: A plasma display device including: a plasma display panel; at least one driving board to drive the plasma display panel; a chassis base located between the plasma display panel and the driving board, to support the plasma display panel, and disposed in direct contact with the driving board; and an electronic element mounted on a rear surface the driving board.

Abstract translation: 一种等离子体显示装置，包括：等离子体显示面板; 至少一个驱动板驱动等离子体显示面板; 位于等离子体显示面板和驱动板之间的底座，用于支撑等离子体显示面板，并设置成与驱动板直接接触; 以及安装在驱动板的后表面上的电子元件。

公开(公告)号：US20070153427A1

公开(公告)日：2007-07-05

申请号：US11698035

申请日：2007-01-26

Applicant: Mitsuhiro Izumi ,  Mitsuaki Yoshida ,  Hisashi Kaneko ,  Tsuneyori Ino ,  Yukihiro Komura ,  Shinji Fujimoto ,  Kei Funabashi

Inventor： Mitsuhiro Izumi ,  Mitsuaki Yoshida ,  Hisashi Kaneko ,  Tsuneyori Ino ,  Yukihiro Komura ,  Shinji Fujimoto ,  Kei Funabashi

IPC: G11B5/55

CPC classification number: G11B33/121 ,  G11B5/4846 ,  G11B33/08 ,  G11B33/122 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/363 ,  H05K2201/0133 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/09918 ,  H05K2201/10386 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2045 ,  H05K2203/0191 ,  H05K2203/166 ,  H05K2203/167

Abstract: A fixing member is spaced from a head actuator by a predetermined distance. A flexible printed circuit board extends at least from the head actuator to the fixing member. The flexible printed circuit board is superposed on the surface of the fixing member. A viscoelastic layer and a protecting layer are overlaid on the surface of the flexible printed circuit board. A clip clips all the fixing member, the flexible printed circuit board, the viscoelastic layer and the protecting layer together. When a head slider is positioned, the head actuator changes its attitude relative to a recording disk. The inertial force based on the rotation causes the first flexible printed circuit board to vibrate when the actuator block stops rotating. The viscoelastic layer serves to absorb this residual vibration of the first flexible printed circuit board. Vibration of the flexible printed circuit board can be suppressed.

Abstract translation: 固定构件与头致动器间隔预定距离。 柔性印刷电路板至少从头致动器延伸到固定构件。 柔性印刷电路板叠置在固定部件的表面上。 粘弹性层和保护层覆盖在柔性印刷电路板的表面上。 A夹将所有固定构件，柔性印刷电路板，粘弹性层和保护层夹在一起。 当头部滑块定位时，头部致动器相对于记录盘改变其姿态。 当致动器块停止转动时，基于旋转的惯性力使第一柔性印刷电路板振动。 粘弹性层用于吸收第一柔性印刷电路板的残余振动。 可以抑制柔性印刷电路板的振动。