-
公开(公告)号：US20180027337A1
公开(公告)日：2018-01-25
申请号：US15246561
申请日：2016-08-25
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Chang-Sheng Hsu , Weng-Yi Chen , En-Chan Chen , Shih-Wei Li , Guo-Chih Wei
CPC classification number: H04R17/025 , B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , B81C1/00158 , B81C2201/013 , H04R1/06 , H04R7/04 , H04R7/20 , H04R17/02 , H04R19/005 , H04R31/003 , H04R31/006 , H04R2201/003
Abstract: A piezoresistive microphone includes a substrate, an insulating layer, and a polysilicon layer. A first pattern is disposed within the polysilicon layer. The first pattern includes numerous first opening. A second pattern is disposed within the polysilicon layer. The second pattern includes numerous second openings. The first pattern surrounds the second pattern. Each first opening and each second opening are staggered. A first resistor is disposed in the polysilicon and between the first pattern and the second pattern. The first resistor is composed of numerous first heavily doped regions and numerous first lightly doped regions. The first heavily doped regions and the first lightly doped regions are disposed in series. The first heavily doped region and the first lightly doped region are disposed alternately. A cavity is disposed in the insulating layer and the substrate.
-
公开(公告)号：US20180014124A1
公开(公告)日：2018-01-11
申请号：US15643506
申请日：2017-07-07
Applicant: Infineon Technologies AG
Inventor： Dietmar Straeussnigg , Elmar Bach , Alessandro Caspani , Andreas Wiesbauer
CPC classification number: H04R3/04 , H03G3/3005 , H03G5/005 , H03G5/16 , H04R1/1083 , H04R3/00 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2410/00 , H04R2460/01
Abstract: In various embodiments, a circuit arrangement is provided. The circuit arrangement includes a sensor set up to provide an analogue signal, an analogue/digital converter set up to receive the analogue signal and to provide a first signal, and a first filter set up to receive a signal based on the first signal and to provide a second signal. The first filter is set up in such a manner that the second signal is allowed through without amplification or substantially without amplification in a frequency range of approximately 20 Hz to approximately 10 kHz, and the second signal has a gain of greater than 0 dB at least above a predefined frequency which is greater than approximately 20 kHz.
-
公开(公告)号：US09866939B2
公开(公告)日：2018-01-09
申请号：US15050972
申请日：2016-02-23
Applicant: Infineon Technologies AG
Inventor： Francesco Polo , Richard Gaggl
CPC classification number: H04R1/04 , H03F1/14 , H03F3/45179 , H03F3/505 , H03F2200/03 , H03F2200/151 , H03F2200/153 , H03F2203/45116 , H03F2203/5033 , H04R2201/003
Abstract: An embodiment amplifier circuit includes a pair of subcircuits that includes a first subcircuit and a second subcircuit, each of which includes a buffer amplifier and a feedback circuit that includes a feedback capacitor. The amplifier circuit also includes a pair of output terminals. The first subcircuit and the second subcircuit each generate a different output signal of a pair of output signals that includes a first output signal and a second output signal. The amplifier circuit is configured for receiving a positive differential input signal at the first subcircuit, receiving a negative differential input signal at the second subcircuit, and receiving the pair of output signals at the pair of output terminals. The amplifier circuit is also configured for transmitting the first output signal to the feedback circuit of the first subcircuit, and transmitting the second output signal to the feedback circuit of the second subcircuit.
-
公开(公告)号：US09866938B2
公开(公告)日：2018-01-09
申请号：US15015973
申请日：2016-02-04
Applicant: Knowles Electronics, LLC
Inventor： Robert Popper , Dibyendu Nandy , Ramanujapuram Raghuvir , Sarmad Qutub , Oddy Khamharn
CPC classification number: H04R1/04 , B81B7/008 , B81B2201/0257 , H04R3/005 , H04R19/005 , H04R2201/003 , H04R2420/07
Abstract: A microphone system includes a first transducer deployed at a first microphone; a second transducer deployed at a second microphone, the first microphone being physically distinct from the second microphone; a decimator deployed at the second microphone that receives first pulse density modulation (PDM) data from the first transducer and second PDM data from the second transducer and decimates and combines the first PDM data and the second PDM data into combined pulse code modulation (PCM) data; and an interpolator deployed at the second microphone for converting the combined PCM data to combined PDM data, and transmits the combined PDM data to an external processing device.
-
公开(公告)号：US20180007474A1
公开(公告)日：2018-01-04
申请号：US15636121
申请日：2017-06-28
Inventor： Scott Lyall CARGILL , Colin Robert JENKINS , Euan James BOYD
CPC classification number: H04R19/04 , B81B3/0072 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81C1/00666 , H04R7/04 , H04R7/18 , H04R17/02 , H04R19/005 , H04R2201/003
Abstract: A MEMS transducer structure comprises a substrate comprising a cavity. A membrane layer is supported relative to the substrate to provide a flexible membrane. A peripheral edge of the cavity defines at least one perimeter region that is convex with reference to the center of the cavity. The peripheral edge of the cavity may further define at least one perimeter region that is concave with reference to the center of the cavity.
-
Patent Agency Ranking
公开(公告)号：US20170350916A1
公开(公告)日：2017-12-07
申请号：US15611411
申请日：2017-06-01
Applicant: Sonion Nederland B.V.
Inventor： Eddy Dubbeldeman , Raymond Mögelin
CPC classification number: G01P15/0802 , G01H3/06 , G01H11/00 , G01P2015/0882 , G10K11/002 , G10K11/16 , H04R7/04 , H04R7/26 , H04R17/02 , H04R17/10 , H04R19/005 , H04R19/016 , H04R2201/003
Abstract: A vibration sensor having a moveable mass being suspended in a suspension member and being adapted to move in response to vibrations or accelerations. The moveable mass and the suspension member are rigidly connected across one or more gaps formed by respective opposing surfaces of the moveable mass and the suspension member. The vibration sensor includes a damping arrangement having a damping substance. The moveable mass is arranged to interact directly or indirectly with the damping substance in order to reduce a mechanical resonance peak of the vibration sensor.
-
公开(公告)号：US09832573B2
公开(公告)日：2017-11-28
申请号：US15182233
申请日：2016-06-14
Applicant: Silicon Audio Directional, LLC
Inventor： Neal A. Hall , Caesar T. Garcia , Bradley D. Avenson , Abidin Guclu Onaran
CPC classification number: H04R17/02 , H04R1/04 , H04R1/342 , H04R19/016 , H04R19/04 , H04R23/006 , H04R2201/003 , H04R2499/11
Abstract: In some embodiments, a microphone system may include a deformable element that may be made of a material that is subject to deformation in response to external phenomenon. Sensing ports may be in contact with a respective region of the deformable element and may be configured to sense a deformation of a region of the deformable element and generate a signal in response thereto. The plurality of signals may be useable to determine spatial dependencies of the external phenomenon. The external phenomenon may be pressure and the signals may be useable to determine spatial dependencies of the pressure.
-
138.发明申请公开(公告)号：US20170339494A1
公开(公告)日：2017-11-23
申请号：US15365590
申请日：2016-11-30
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Matteo PERLETTI , Igor VARISCO , Luca LAMAGNA , Silvia ADORNO , Gabriele GATTERE , Carlo VALZASINA , Sebastiano CONTI
CPC classification number: H04R19/005 , B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81B2203/0136 , B81B2203/0315 , B81B2203/04 , B81B2203/053 , B81C1/00158 , B81C2201/0109 , B81C2201/0111 , B81C2201/0133 , G01H11/06 , H04R31/00 , H04R2201/003 , H04R2201/023
Abstract: A MEMS acoustic transducer provided with: a substrate of semiconductor material, having a back surface and a front surface opposite with respect to a vertical direction; a first cavity formed within the substrate, which extends from the back surface to the front surface; a membrane which is arranged at the upper surface, suspended above the first cavity and anchored along a perimeter thereof to the substrate; and a combfingered electrode arrangement including a number of mobile electrodes coupled to the membrane and a number of fixed electrodes coupled to the substrate and facing respective mobile electrodes for forming a sensing capacitor, wherein a deformation of the membrane as a result of incident acoustic pressure waves causes a capacitive variation of the sensing capacitor. In particular, the combfingered electrode arrangement lies vertically with respect to the membrane and extends parallel thereto.
-
公开(公告)号：US20170339477A1
公开(公告)日：2017-11-23
申请号：US15416744
申请日：2017-01-26
Applicant: Kai Wang , Hu Chen , Guojun Liu
Inventor： Kai Wang , Hu Chen , Guojun Liu
CPC classification number: H04R1/04 , B81B7/0087 , B81B2201/0257 , B81B2207/012 , H04R19/005 , H04R19/04 , H04R29/004 , H04R2201/003
Abstract: A MEMS microphone is disclosed. The MEMS microphone includes an encapsulation structure provided with an accommodation space; a MEMS chip for detecting sound signal accommodated in the accommodation space; an ASIC chip received in the accommodation space. The ASIC chip includes a signal processing module connected to MEMS chip for processing the sound signal detected by the MEMS chip and outputting the processed sound signal. The MEMS microphone further includes a temperature detection module for detecting temperature signal and outputting the temperature signal.
-
140.发明申请公开(公告)号：US20170325030A1
公开(公告)日：2017-11-09
申请号：US15448846
申请日：2017-03-03
Inventor： Fabian STOPPEL , Bernhard WAGNER
CPC classification number: H04R17/00 , H01L41/0946 , H04R3/002 , H04R29/001 , H04R2201/003
Abstract: A MEMS includes a diaphragm, a stroke structure coupled to the diaphragm, and at least two piezoelectric actuators coupled to a plurality of mutually spaced-apart contact points of the stroke structure via a plurality of mutually spaced-apart connecting elements, the at least two piezoelectric actuators being configured to cause a stroke movement of the stroke structure so as to deflect the diaphragm.
-
-
-
-
-
-
-
-
-
Search Results
1952
records
(took 0.034 seconds)
