公开(公告)号：US20120094090A1

公开(公告)日：2012-04-19

申请号：US13379815

申请日：2010-06-29

Applicant: Yoshikazu Yamazaki ,  Satoshi Hayakawa ,  Masashi Miyamoto

Inventor： Yoshikazu Yamazaki ,  Satoshi Hayakawa ,  Masashi Miyamoto

IPC: B32B3/00 ,  B32B38/08 ,  B32B38/10 ,  B32B37/14 ,  B82Y40/00

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K3/046 ,  H05K2201/0108 ,  H05K2201/10128

Abstract: Provided is a low-cost method for easily forming a transparent conductive pattern that has a low electrical resistance and high transparency, and that is highly invisible to the eye. The method for forming a transparent conductive layer pattern includes the steps of (1) detachably forming a transparent conductive layer on a substrate; (2) then forming, on a support, a negative-patterned heat-sensitive adhesive image; (3) bonding the substrate to the support so that the transparent conductive layer and the heat-sensitive adhesive layer are in close contact with each other; (4) forming a pattern of the transparent conductive layer on the substrate by detaching the support from the substrate to transfer a portion of the transparent conductive layer, the portion being in close contact with the heat-sensitive adhesive layer, to the heat-sensitive adhesive layer; and (5) fixing the transparent conductive layer on the substrate by applying a coating material for a protective layer onto a front surface of the substrate on which the pattern of the transparent conductive layer is formed and impregnating the transparent conductive layer with the coating material.

Abstract translation: 提供了一种用于容易地形成具有低电阻和高透明度并且对眼睛高度不可见的透明导电图案的低成本方法。 形成透明导电层图案的方法包括以下步骤：（1）在基板上可拆卸地形成透明导电层; （2）然后在载体上形成负图案的热敏粘合剂图像; （3）将基板粘合到支撑体上，使得透明导电层和热敏粘合剂层彼此紧密接触; （4）通过从衬底上分离支撑体来将衬底上的透明导电层的图案形成，以将部分与热敏粘合剂层紧密接触的透明导电层的一部分转移到热敏感层 粘合层; 和（5）通过在其上形成有透明导电层的图案的基板的前表面上涂覆用于保护层的涂料将该透明导电层固定在基板上，并用该涂料浸渍透明导电层。

公开(公告)号：US08098003B2

公开(公告)日：2012-01-17

申请号：US12790395

申请日：2010-05-28

Applicant: Kazuto Morikawa ,  Masahiro Izumi ,  Kiyoshi Nishimura ,  Tomohiro Sanpei ,  Erika Takenaka ,  Shuhei Matsuda

Inventor： Kazuto Morikawa ,  Masahiro Izumi ,  Kiyoshi Nishimura ,  Tomohiro Sanpei ,  Erika Takenaka ,  Shuhei Matsuda

IPC: H01J5/16

CPC classification number: H05K1/0274 ,  F21K9/23 ,  F21K9/232 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%.

Abstract translation: 根据一个实施例，发光模块包括模块衬底，反射层，导电层，发光元件和密封构件。 在模块基板的绝缘层的表面上设置反射层，并且在反射层附近设置导电层。 此外，发光元件设置在反射层上。 此外，半透明密封构件具有半透明性并且掩埋反射层，导电层和发光元件。 反射层和导电层占据密封部件密封的密封区域的面积的比例等于或大于80％。

公开(公告)号：US20110297642A1

公开(公告)日：2011-12-08

申请号：US13211205

申请日：2011-08-16

Applicant: Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid ,  Jeffrey Wolk

Inventor： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid ,  Jeffrey Wolk

IPC: H01B13/00 ,  C23F1/16 ,  C23F1/02 ,  B82Y40/00

CPC classification number: H01L31/022466 ,  B82Y10/00 ,  G02F1/13439 ,  H01B1/22 ,  H01L31/1884 ,  H01L51/0021 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5253 ,  H01L2251/5369 ,  H05K1/095 ,  H05K3/06 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/026 ,  Y02E10/50

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子显示面板等的视觉显示装置中的透明电极。

公开(公告)号：US08062734B2

公开(公告)日：2011-11-22

申请号：US10425005

申请日：2003-04-28

Applicant: Cheryl J. Kaminsky ,  Robert P. Bourdelais ,  Debasis Majumdar

Inventor： Cheryl J. Kaminsky ,  Robert P. Bourdelais ,  Debasis Majumdar

IPC: B32B3/20 ,  H01B13/00 ,  H02G3/04

CPC classification number: H05K3/107 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/0329 ,  H05K2201/09036 ,  H05K2203/161 ,  Y10T428/24355 ,  Y10T428/24744

Abstract: Disclosed is an article comprising a layer of nonconductive polymeric material comprising a plurality of integral polymer conduit channels containing a substantially transparent conductive material.

Abstract translation: 公开了一种包含非导电聚合材料层的制品，其包含多个包含基本上透明的导电材料的整体聚合物导管通道。

公开(公告)号：US08049117B2

公开(公告)日：2011-11-01

申请号：US12466841

申请日：2009-05-15

Applicant: Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

Inventor： Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H01G4/33 ,  H01G13/00 ,  H01L21/4857 ,  H01L23/50 ,  H01L2924/0002 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/016 ,  H05K2203/107 ,  Y10T29/43 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

Abstract translation: 一种制造其中嵌有电容器的印刷电路板的方法，其中具有使用激光剥离的电介质膜，以及由此制造的电容器。 在该方法中，在透明基板上形成电介质膜并进行热处理。 在热处理电介质膜上形成第一导电层。 将激光束照射到从透明基板的下方形成的堆叠上，以将透明基板与堆叠分离。 在将透明基板与堆叠体分离之后，在电介质膜上形成具有预定图案的第二导电层。 此外，绝缘层和第三导电层形成在第一和第二导电层上，以预定数量相互交替。

公开(公告)号：US07947516B2

公开(公告)日：2011-05-24

申请号：US12843194

申请日：2010-07-26

Applicant: Jeffrey Bisberg

Inventor： Jeffrey Bisberg

IPC: H01L21/00

CPC classification number: H01L33/62 ,  H01L24/32 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/12041 ,  H05K1/0269 ,  H05K1/141 ,  H05K1/145 ,  H05K3/284 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2201/2036 ,  H05K2201/2054 ,  H05K2203/166 ,  H01L2924/00

Abstract: A method of packaging a light-emitting diode (LED) chip includes coupling the LED chip to a printed circuit board (PCB) and forming a conductor on a cover plate. Conductive epoxy is applied to at least one of the LED chip and the conductor. The cover plate is coupled to the PCB such that the conductive epoxy forms a circuit connection between the LED chip and the conductor. An LED-based lighting product includes a PCB with one or more LED chips mounted directly thereon. A cover plate has conductors that couple at least to the one or more LED chips and to the PCB, such that the conductors form electrical connections between the one or more LED chips and the PCB.

Abstract translation: 封装发光二极管（LED）芯片的方法包括将LED芯片耦合到印刷电路板（PCB）并在盖板上形成导体。 导电环氧树脂被施加到LED芯片和导体中的至少一个。 盖板耦合到PCB，使得导电环氧树脂在LED芯片和导体之间形成电路连接。 基于LED的照明产品包括具有直接安装在其上的一个或多个LED芯片的PCB。 盖板具有至少耦合到一个或多个LED芯片和PCB的导体，使得导体在一个或多个LED芯片和PCB之间形成电连接。

公开(公告)号：US07935622B2

公开(公告)日：2011-05-03

申请号：US10565259

申请日：2005-05-17

Applicant: Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Herman Vilsmeier

Inventor： Michael Bauer ,  Thomas Bemmerl ,  Edward Fuergut ,  Simon Jerebic ,  Herman Vilsmeier

IPC: H01L21/44

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49805 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K2201/0108 ,  H05K2203/0338 ,  H05K2203/041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball contacts and a method for loading substrates with ball contacts. The support has a layer of adhesive applied on one side, the layer of adhesive losing its adhesive force to the greatest extent when irradiated. The support has solder ball elements, which are arranged closely packed in rows and columns on the layer of adhesive in a prescribed pitch for a semiconductor chip or a semiconductor component.

Abstract translation: 公开了一种用于装载具有球接触件的衬底的焊球元件的支撑件。 一个实施例提供了一种用于装载具有球接触件的衬底的系统以及用于装载具有球接触件的衬底的方法。 支撑体具有一侧施加的粘合剂层，当照射时粘合剂层最大程度地失去粘合力。 支撑体具有焊料球元件，它们以规定的间距紧密地排列在粘合剂层上的行和列中，用于半导体芯片或半导体部件。

公开(公告)号：US07931841B2

公开(公告)日：2011-04-26

申请号：US11369372

申请日：2006-03-06

Applicant: John S. Huizinga ,  Vincent W. King ,  John T. Strand ,  James N. Dobbs ,  Thomas B. Hunter ,  Samuel W. Hunter ,  Thelma E. Hunter, legal representative ,  William V. Dower ,  Daniel H. Carlson ,  Serge Wetzels ,  Gregory F. King

Inventor： John S. Huizinga ,  Vincent W. King ,  John T. Strand ,  James N. Dobbs ,  Thomas B. Hunter ,  Samuel W. Hunter ,  William V. Dower ,  Daniel H. Carlson ,  Serge Wetzels ,  Gregory F. King

IPC: B32B3/30 ,  B32B27/06 ,  G02B5/00

CPC classification number: B29C35/0894 ,  B29C35/0888 ,  B29C35/10 ,  B29C59/046 ,  B29C2035/0827 ,  B29C2043/463 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0079 ,  H05K3/101 ,  H05K2201/0108 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: A microreplicated article is disclosed. The article includes an opaque web having first and second opposed surfaces. The first surface includes a first microreplicated structure having a plurality of first features. The second surface includes a second microreplicated structure having a plurality of second features. The first microreplicated structure and the second microreplicated structure retain registration within 100 micrometers.

Abstract translation: 公开了微复制品。 该制品包括具有第一和第二相对表面的不透明纤维网。 第一表面包括具有多个第一特征的第一微复制结构。 第二表面包括具有多个第二特征的第二微复制结构。 第一微复制结构和第二微复制结构保持配准在100微米内。

公开(公告)号：US20110091168A1

公开(公告)日：2011-04-21

申请号：US12581364

申请日：2009-10-19

Applicant: Odd Robert Steijer ,  Hans Magnus Emil Andersson ,  Maria Elisabeth Kãllén

Inventor： Odd Robert Steijer ,  Hans Magnus Emil Andersson ,  Maria Elisabeth Kãllén

IPC: G02B6/36

CPC classification number: H05K1/148 ,  G02B6/4201 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H05K1/0274 ,  H05K1/141 ,  H05K1/147 ,  H05K1/182 ,  H05K2201/0108 ,  H05K2201/10121

Abstract: There is provided an opto-electrical assembly. The assembly comprises an optical carrier and one or more optical elements and possibly also electrical elements, such as optical flip-chip die, attached to the optical carrier, and configured for electrical and optical communication with the optical carrier. The assembly further comprises a flexible electrical and optical connectors attached to the optical carrier, and configured to provide electrical and optical communication between the one or more optical and electrical elements and further circuitry. Wherein the flexible connectors are configured to allow for relative movement of the optical carrier and further circuitry during use of the assembly.

Abstract translation: 提供了一个光电组件。 组件包括光载体和一个或多个光学元件，并且还可能包括附接到光学载体的电学元件，例如光学倒装芯片裸片，并被配置用于与光学载体的电和光通信。 组件还包括附接到光学载体的柔​​性电气和光学连接器，并且被配置为在一个或多个光学元件和电气元件之间提供电气和光学通信以及另外的电路。 其中柔性连接器被配置为允许在使用组件期间光学载体和其它电路的相对移动。

公开(公告)号：US07906374B2

公开(公告)日：2011-03-15

申请号：US12057387

申请日：2008-03-28

Applicant: Chiu-Shun Lin ,  Pai-Sheng Cheng

Inventor： Chiu-Shun Lin ,  Pai-Sheng Cheng

IPC: H01L21/00

CPC classification number: H01L23/4985 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16225 ,  H05K1/0209 ,  H05K1/189 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/10681 ,  H05K2203/166 ,  Y02P70/613

Abstract: A COF packaging structure includes a substrate, a first conductive foil, and a second conductive foil. The substrate has a first surface and a second surface opposite to the first surface. The first conductive foil is disposed on the first surface of the substrate and has a first designated pattern for bump bonding. The second conductive foil is disposed on the second surface of the substrate and has a second designated pattern, wherein the area of the second designated pattern is not smaller than the area of the first designated pattern.

Abstract translation: COF包装结构包括基板，第一导电箔和第二导电箔。 基板具有与第一表面相对的第一表面和第二表面。 第一导电箔设置在基板的第一表面上，并且具有用于凸起接合的第一指定图案。 第二导电箔设置在基板的第二表面上，并具有第二指定图案，其中第二指定图案的面积不小于第一指定图案的面积。