EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE
    132.
    发明申请
    EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 有权
    环氧树脂组合物,PREPREG,金属层压板,印刷线路板和半导体器件

    公开(公告)号:US20110083890A1

    公开(公告)日:2011-04-14

    申请号:US12902505

    申请日:2010-10-12

    Abstract: The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 μm or more and 5.0 μm or less.

    Abstract translation: 本发明提供一种均匀地含有大量无机填料,耐热性和阻燃性优异并且对基材具有良好浸渍性的环氧树脂组合物,以及具有良好粘合性的使用该环氧树脂组合物的预浸料,以及 易于处理。 此外,提供一种印刷线路板,其使用能够容易地进行ENEPIG工艺的预浸料坯和/或预浸料或环氧树脂组合物形成的覆金属层压板,以及使用印刷线路板的半导体装置 在演出。 环氧树脂组合物包含固体环氧树脂,平均粒径为1nm以上且100nm以下的二氧化硅纳米粒子和平均粒径大于二氧化硅纳米粒子的二氧化硅粒子的范围, 0.1μm以上且5.0μm以下。

    CONDUCTIVE INKS AND PASTES
    136.
    发明申请
    CONDUCTIVE INKS AND PASTES 审中-公开
    导电油墨和药膏

    公开(公告)号:US20100009153A1

    公开(公告)日:2010-01-14

    申请号:US12483190

    申请日:2009-06-11

    Abstract: A composition comprises at least one silver nanoparticulate material, at least one conductive microparticulate material, and less than about 3% wt of an organic or polymeric resin. The composition provides a low curing temperature and upon cure good film properties. Also provided herein is a method of using an ink or paste, comprising: (i) providing the ink or paste comprising at least one silver nanoparticulate material, at least one conductive microparticulate material, and less than about 3% wt of an organic or polymeric resin; and (ii) curing the ink or paste at a temperature at lower than about 200° C. to decompose the organic resin.

    Abstract translation: 组合物包含至少一种银纳米颗粒材料,至少一种导电微粒材料和小于约3重量%的有机或聚合物树脂。 该组合物提供低固化温度并且在固化时具有良好的膜性能。 本文还提供了使用油墨或糊剂的方法,其包括:(i)提供包含至少一种银纳米颗粒材料,至少一种导电微粒材料和小于约3重量%的有机或聚合物的油墨或糊料 树脂; 和(ii)在低于约200℃的温度下固化油墨或糊状物以分解有机树脂。

    Solder precoating method
    137.
    发明授权
    Solder precoating method 有权
    焊接预涂法

    公开(公告)号:US07569164B2

    公开(公告)日:2009-08-04

    申请号:US11699046

    申请日:2007-01-29

    Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 μm are present 16% or more, and a sum of the particles having a particle size of below 10 μm and particles having a particle size of 10 μm or more and below 20 μm is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

    Abstract translation: 一种焊料组合物,其用于通过在基板上的电极周围形成堤坝来形成焊料凸块的焊料预涂布方法,在由坝围绕的开口部内填充电极上的焊膏组合物,并加热填充的焊膏组合物,使得 焊料粘附到电极的表面。 焊膏组合物含有焊料粉末,其具有粒径分布的焊料粉末,其中粒径小于10μm的颗粒存在16%或更多,并且颗粒尺寸小于10um的颗粒的总和和具有 10μm以上且小于20μm的粒径为90%以上。 由此,能够抑制突起缺陷的发生,通过使用该堤坝的焊料预涂法,能够以高产率形成均匀高度的焊料凸块。

    COPPER CLAD LAMINATE
    138.
    发明申请
    COPPER CLAD LAMINATE 审中-公开
    铜箔层压板

    公开(公告)号:US20090017286A1

    公开(公告)日:2009-01-15

    申请号:US12171545

    申请日:2008-07-11

    Abstract: A copper clad laminate that is suited to use in high-performance flexible printed circuit boards, which meets both dimensional change and heat resistance requisites, has a small percent dimensional change after etching, and has properties that are applicable to AOI, and which further has excellent slickness (slip) and adhesion is provided. A copper clad laminate that uses a polyimide film that primarily uses paraphenylenediamine and 4,4′-diaminodiphenylether as diamine ingredients, and pyromellitic dianhydride and 3,3′,4,4′-biphenyltetracarboxylic dianhydride as acid dianhydride ingredients, which further has slip caused by producing surface protrusions by adding inorganic particles. One copper foil is adhered to one side of the polyimide film using an adhesive; and a second copper layer is directly adhered to the second side of the polyimide film.

    Abstract translation: 适用于满足尺寸变化和耐热要求的高性能柔性印刷电路板的覆铜层压板在蚀刻后具有小的百分比尺寸变化,并且具有适用于AOI的特性,并且还具有 提供优异的光滑(滑动)和附着力。 使用主要使用对苯二胺和4,4'-二氨基二苯基醚作为二胺成分的聚酰亚胺薄膜和均苯四甲酸二酐和3,3',4,4'-联苯四羧酸二酐作为酸二酐成分的覆铜层压板,其进一步具有滑动性 通过添加无机颗粒产生表面突起。 使用粘合剂将一个铜箔粘附到聚酰亚胺膜的一侧; 并且第二铜层直接粘附到聚酰亚胺膜的第二侧。

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