公开(公告)号：US20090246554A1

公开(公告)日：2009-10-01

申请号：US12310219

申请日：2008-05-09

Applicant: Mikio Furukawa ,  Seiji Sejima ,  Yoshiaki Echigo

Inventor： Mikio Furukawa ,  Seiji Sejima ,  Yoshiaki Echigo

IPC: B32B15/088 ,  B32B15/04 ,  B32B37/12 ,  B32B15/01 ,  B32B15/08 ,  B05D5/12 ,  C23C28/02

CPC classification number: H05K3/025 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0264 ,  Y10T428/12 ,  Y10T428/12778 ,  Y10T428/26 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: A metal conductor layer is provided on at least one surface of a heat resistant base. The heat resistant base is peelable from the metal conductor layer. The heat resistant base is preferably a metal foil or a non-thermoplastic polyimide resin film. The metal conductor layer preferably includes a vapor deposition metal layer and/or a plating metal layer. The metal conductor layer preferably includes a metal layer (I) formed in an interface with the heat resistant base by vapor deposition, and at least one metal layer (II) formed on the metal layer (I) by vapor deposition or electroplating. At least one insulative film layer of a non-thermoplastic polyimide resin may be provided on the metal conductor layer.

Abstract translation: 金属导体层设置在耐热基底的至少一个表面上。 耐热基座可从金属导体层剥离。 耐热基材优选为金属箔或非热塑性聚酰亚胺树脂膜。 金属导体层优选包括蒸镀金属层和/或电镀金属层。 金属导体层优选包括通过气相沉积与耐热基底的界面形成的金属层（I），以及通过气相沉积或电镀在金属层（I）上形成的至少一个金属层（II）。 可以在金属导体层上设置至少一层非热塑性聚酰亚胺树脂的绝缘膜层。

公开(公告)号：US20080292979A1

公开(公告)日：2008-11-27

申请号：US11751977

申请日：2007-05-22

Applicant: Zhe Ding ,  James Guiheen ,  Peter Smith ,  HongMin Huang ,  Ben Palmer

Inventor： Zhe Ding ,  James Guiheen ,  Peter Smith ,  HongMin Huang ,  Ben Palmer

IPC: G03G15/00 ,  G03G5/00

CPC classification number: H01B1/02 ,  B82Y10/00 ,  G02F1/13439 ,  H01B1/04 ,  H01B1/22 ,  H01B1/24 ,  H05K1/097 ,  H05K3/0023 ,  H05K3/467 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2201/0317 ,  H05K2201/0329

Abstract: Transparent conductive materials, articles and films are described herein a) that are easily and efficiently produced, b) can be produced prior to application or in situ, c) are easily applied to surfaces and substrates or formed into articles, d) can be produced and used with materials and methods that are generally accepted by the flat panel display (FPD) industry, along with other industries that produce and utilize microelectronics, e) can be tailored to be photoimageable and patternable using accepted photolithography techniques, f) have superior optical properties and have superior film forming properties, including better adhesion to other adjacent layers, the ability to be laid down in very or ultra thin layers and the ability to remain transparent when laid down as thicker layers. Methods of producing and using these transparent conductive materials are also disclosed.

Abstract translation: 透明导电材料，制品和膜在本文中描述a）容易且有效地制备，b）可以在施用之前或原位制备，c）易于施加到表面和基材上或形成制品，d）可以生产 并且与使用平板显示器（FPD）行业普遍接受的材料和方法一起使用，以及生产和利用微电子的其他行业，e）可以使用公认的光刻技术来定制成可光成像和可图案化，f）具有优异的光学 性能并且具有优异的成膜性能，包括对其它相邻层的更好的附着力，在非常或超薄层中放置的能力以及当铺设成更厚的层时保持透明的能力。 还公开了制造和使用这些透明导电材料的方法。

公开(公告)号：US20080246157A1

公开(公告)日：2008-10-09

申请号：US11732543

申请日：2007-04-03

Applicant: Qiang Richard Chen

Inventor： Qiang Richard Chen

IPC: H01L23/482 ,  H01L21/60

CPC classification number: H05K3/3442 ,  H01L27/016 ,  H01L27/13 ,  H05K1/16 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/0317 ,  H05K2201/09954 ,  H05K2201/10045 ,  Y02P70/613

Abstract: A device according to various aspects of the present invention generally includes a surface mount device having a top side, a bottom side, a plurality of sidewalls, and a circuit comprising one or more layers. The device includes a first conductive surface covering a portion of one of the sidewalls for providing an input to the circuit, a second conductive surface covering a portion of one of the sidewalls for providing an output from the circuit, and a third conductive surface covering a portion of one of the sidewalls for providing an electrical ground to the circuit. When the surface mount device is mounted to a provided mounting surface, at least one layer of the circuit is orthogonal to the provided mounting surface.

Abstract translation: 根据本发明的各个方面的装置通常包括具有顶侧，底侧，多个侧壁和包括一个或多个层的电路的表面安装装置。 所述装置包括覆盖所述侧壁之一的一部分以提供所述电路的输入的第一导电表面，覆盖所述侧壁之一的一部分以提供来自所述电路的输出的第二导电表面，以及覆盖所述侧壁的第三导电表面 所述侧壁之一的一部分用于向所述电路提供电接地。 当表面安装装置安装到所提供的安装表面时，电路的至少一层与所提供的安装表面正交。

公开(公告)号：US07417867B1

公开(公告)日：2008-08-26

申请号：US09671436

申请日：2000-09-27

Applicant: Yoshinari Matsuda ,  Yoshio Suzuki ,  Ryota Odake ,  Nobutoshi Asai

Inventor： Yoshinari Matsuda ,  Yoshio Suzuki ,  Ryota Odake ,  Nobutoshi Asai

IPC: H05K7/02

CPC classification number: H05K3/0094 ,  H01L27/3288 ,  H01L51/5243 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/095 ,  H05K1/16 ,  H05K3/048 ,  H05K3/108 ,  H05K3/245 ,  H05K3/388 ,  H05K3/4061 ,  H05K3/427 ,  H05K3/4605 ,  H05K3/467 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/0959 ,  H05K2201/10128 ,  H05K2203/0191 ,  H05K2203/0554

Abstract: A printed wiring board includes a glass substrate provided with through-holes, conductive patterns provided on both surfaces of said glass substrate in such a manner as to be made conductive to each other via said through-holes, and a sealing member composed of a silver paste containing an epoxy resin as a binder provided to fill said through-holes. This printed wiring board is advantageous in that circuit parts can be connected to each other without use of any planar special region and moisture does not reach the circuit parts through the printed wiring board. A display apparatus capable of stably displaying pictures for a long-period of time is provided by using the printed wiring board.

Abstract translation: 印刷布线板包括设置有通孔的玻璃基板，设置在所述玻璃基板的两个表面上的导电图案，以使得经由所述通孔彼此导电，以及由银构成的密封构件 含有环氧树脂作为粘合剂的糊料，以填充所述通孔。 该印刷布线板的优点在于，电路部件可以彼此连接，而不使用任何平面特殊区域，并且水分不会通过印刷线路板到达电路部件。 通过使用印刷电路板提供能够长时间稳定地显示图像的显示装置。

公开(公告)号：US20080182385A1

公开(公告)日：2008-07-31

申请号：US11971346

申请日：2008-01-09

Applicant: Tetsuji KAMINE

Inventor： Tetsuji KAMINE

IPC: H01L21/30

CPC classification number: H05K3/20 ,  G02F1/133351 ,  H01L21/6835 ,  H01L24/97 ,  H01L25/0655 ,  H01L51/003 ,  H01L51/5246 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2251/5338 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K2201/0317 ,  H05K2203/1147 ,  H05K2203/1476

Abstract: A method for producing a semiconductor device includes bonding a transfer layer disposed on a first substrate to a second substrate and detaching the transfer layer from the first substrate. In bonding the transfer layer disposed on the first substrate to the second substrate, the method further includes placing a seal having a frame shape on a surface of the first substrate on which the transfer layer is disposed or a surface of the second substrate facing the first substrate, placing an adhesive in a region inside the seal, and superposing the surface of the first substrate on which the transfer layer is disposed on the second substrate with the seal and the adhesive. The seal and the adhesive are incompatible with each other. The seal and the adhesive are not cured in the period from placing the seal to superposing the surface of the first substrate on which the transfer layer is disposed on the second substrate.

Abstract translation: 一种制造半导体器件的方法包括将设置在第一衬底上的转移层接合到第二衬底上，并将转移层与第一衬底分离。 在将设置在第一基板上的转印层接合到第二基板上时，该方法还包括将具有框架形状的密封件放置在其上设置有转印层的第一基板的表面上或者将第二基板的表面面向第一基板 衬底，将粘合剂放置在密封件内部的区域中，并且用密封件和粘合剂将其上设置有转印层的第一衬底的表面叠置在第二衬底上。 密封和粘合剂彼此不兼容。 密封件和粘合剂在将密封件放置在将第一基板的设置有转印层的表面叠置在第二基板上的期间不固化。

公开(公告)号：US20080134499A1

公开(公告)日：2008-06-12

申请号：US12068272

申请日：2008-02-05

Applicant: Takeshi Shioga ,  Yoshikatsu Ishizuki ,  Kanae Nakagawa ,  Taiji Sakai ,  Masataka Mizukoshi ,  John David Baniecki ,  Kazuaki Kurihara

Inventor： Takeshi Shioga ,  Yoshikatsu Ishizuki ,  Kanae Nakagawa ,  Taiji Sakai ,  Masataka Mizukoshi ,  John David Baniecki ,  Kazuaki Kurihara

IPC: H05K3/46

CPC classification number: H01L23/50 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0023 ,  H05K3/0044 ,  H05K3/20 ,  H05K3/4614 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09763 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0733 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/05599

Abstract: The interposer comprises a base 8 formed of a plurality of resin layers 68, 20, 32, 48; thin-film capacitors 18a, 18b buried between a first resin layer 68 of said plurality of resin layers and a second resin layer 20 of said plurality of resin layers, which include first capacitor electrodes 12a, 12b, second capacitor electrodes 16 opposed to the first capacitor electrode 12a, 12b and the second capacitor electrode 16, and a capacitor dielectric film 14 of a relative dielectric constant of 200 or above formed between the first capacitor electrode 12a, 12b and the second capacitor electrode 16; a first through-electrode 77a formed through the base 8 and electrically connected to the first capacitor electrode 12a, 12b; and a second through-electrode 77b formed through the base 8 and electrically connected to the second capacitor electrode 16.

Abstract translation: 插入件包括由多个树脂层68,20,32,48形成的基座8; 掩埋在所述多个树脂层的第一树脂层68和所述多个树脂层的第二树脂层20之间的薄膜电容器18a，18b，其包括第一电容器电极12a，12b，第二电容器电极16 与第一电容器电极12a，12b和第二电容器电极16相对，以及形成在第一电容器电极12a，12b和第二电容器电极16之间的相对介电常数为200或更大的电容器电介质膜14 ; 通过基座8形成并电连接到第一电容器电极12a，12b的第一贯通电极77a; 以及通过基底8形成并电连接到第二电容器电极16的第二贯通电极77b。

公开(公告)号：US07371471B2

公开(公告)日：2008-05-13

申请号：US11075556

申请日：2005-03-08

Applicant: Shigeyoshi Yoshida ,  Hiroshi Ono ,  Yutaka Shimada ,  Tetsuo Itoh

Inventor： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Yutaka Shimada ,  Tetsuo Itoh

IPC: B32B9/00 ,  B22F3/00

CPC classification number: H05K9/0073 ,  B82Y25/00 ,  H01F10/007 ,  H01F10/14 ,  H05K1/0233 ,  H05K3/244 ,  H05K2201/0317 ,  H05K2201/083 ,  Y10S428/90 ,  Y10T428/249928 ,  Y10T428/249929 ,  Y10T428/249931 ,  Y10T428/256 ,  Y10T428/2993 ,  Y10T428/32

Abstract: An electromagnetic noise suppressing thin film has a structure including an inorganic insulating matrix made of oxie, nitride, fluoride, or a mixture thereof and columnar-structured particles made of a pure metal of Fe, Co, or Ni or an alloy containing at least 20 weight % of Fe, Co, or Ni and buried in an inorganic insulating matrix.

Abstract translation: 电磁噪声抑制薄膜具有包括由氧，氮化物，氟化物或其混合物制成的无机绝缘基体和由纯Fe，Co或Ni制成的柱状结构的颗粒或含有至少20 Fe，Co或Ni的重量％，并埋入无机绝缘基体中。

公开(公告)号：US20080053686A1

公开(公告)日：2008-03-06

申请号：US11892052

申请日：2007-08-20

Applicant: Jun Ishii ,  Yasunari Ooyabu

Inventor： Jun Ishii ,  Yasunari Ooyabu

IPC: H01S4/00 ,  H05K1/03

CPC classification number: H05K1/056 ,  G11B5/484 ,  G11B5/486 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0317 ,  H05K2201/0338 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.

Abstract translation: 布线电路板具有金属支撑板，金属箔形成在金属支撑板上以具有小于2.0μm的厚度，形成在金属支撑板上以覆盖金属箔的第一绝缘层和形成的导电图案 在第一绝缘层上。

公开(公告)号：US07309657B2

公开(公告)日：2007-12-18

申请号：US10929492

申请日：2004-08-31

Applicant: Masato Kamiichi ,  Keiichi Sasaki

Inventor： Masato Kamiichi ,  Keiichi Sasaki

IPC: H01L21/302

CPC classification number: B41J2/1642 ,  B41J2/1412 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1646 ,  H05K1/167 ,  H05K3/06 ,  H05K2201/0317 ,  H05K2203/1453 ,  Y10T428/24917

Abstract: Provided is a method for manufacturing a circuit board including an electrode wiring formed above a surface portion of a substrate, and a plurality of electrothermal converting elements which have a heating resistor film for generating thermal energy formed above the electrode wiring. The method includes: forming an electrode wiring layer for forming the electrode wiring, forming the heating resistor film; and collectively etching the electrode wiring layer and the heating resistor film to thereby form the electrode wiring. With the method according to the present invention, the circuit board can be manufactured with a higher density, higher endurance, and lower power consumption recording head to provide high resolution images.

Abstract translation: 提供一种制造电路板的方法，该电路板包括形成在基板的表面部分上方的电极布线，以及多个电热转换元件，其具有用于产生形成在电极布线上方的热能的加热电阻膜。 该方法包括：形成用于形成电极布线的电极布线层，形成加热电阻膜; 并且共同地蚀刻电极布线层和加热电阻膜，从而形成电极布线。 利用根据本发明的方法，可以制造具有更高密度，更高耐久性和更低功耗记录头的电路板，以提供高分辨率图像。

公开(公告)号：US20070218695A1

公开(公告)日：2007-09-20

申请号：US11686834

申请日：2007-03-15

Applicant: Shinya Momose ,  Kazushige Hakeda

Inventor： Shinya Momose ,  Kazushige Hakeda

IPC: H01L21/302 ,  H01L21/461

CPC classification number: H05K3/06 ,  H01L21/76885 ,  H05K3/061 ,  H05K3/067 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2203/0392 ,  H05K2203/1476

Abstract: A method of forming a metal pattern comprising forming a metal film having a lower layer made of a metal and an upper layer made of a metal different from the metal of the lower layer, forming a resist film having a predetermined pattern on the upper layer, and patterning the metal film by etching the metal film using the resist film as a mask. Here, patterning the metal film comprises etching the upper layer, immersing the resist film and the upper layer in a pretreatment liquid containing a nonionic surfactant after the first etching process, and etching the lower layer after the immersing process.

Abstract translation: 一种形成金属图案的方法，包括形成具有由金属制成的下层的金属膜和由与下层金属不同的金属制成的上层的金属膜，在上层形成具有预定图案的抗蚀剂膜， 并通过使用抗蚀剂膜作为掩模蚀刻金属膜来图案化金属膜。 这里，图案化金属膜包括蚀刻上层，在第一蚀刻工艺之后将抗蚀剂膜和上层浸入含有非离子表面活性剂的预处理液中，并在浸渍处理之后蚀刻下层。