公开(公告)号：US20120244275A1

公开(公告)日：2012-09-27

申请号：US13431633

申请日：2012-03-27

Applicant: Masahiko SUZUKI ,  Kazuhito OBATA ,  Katsuyuki MASUDA ,  Kenichi TOMIOKA ,  Masaki TAKEUCHI ,  Sumio YOSHIDA ,  Hirokazu SUZUKI ,  Yoshitsugu MATSUURA

Inventor： Masahiko SUZUKI ,  Kazuhito OBATA ,  Katsuyuki MASUDA ,  Kenichi TOMIOKA ,  Masaki TAKEUCHI ,  Sumio YOSHIDA ,  Hirokazu SUZUKI ,  Yoshitsugu MATSUURA

IPC: B05D5/12

CPC classification number: H05K1/0346 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/087 ,  H05K2203/1157 ,  H05K2203/163 ,  Y10T428/24917 ,  Y10T428/261 ,  Y10T428/27

Abstract: A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film. The process includes coating a varnish containing a polyamic acid and a solvent onto the metal foil, holding the coated film, drying in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and forming the resin in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating up to the resin film-forming are adjusted based on a target for the content of metal elements in the resin film.

Abstract translation: 一种具有一个或多个层叠体的柔性层压片的制造方法，每个层叠体在树脂膜的一面上形成有金属箔。 该方法包括将含有聚酰胺酸和溶剂的清漆涂覆到金属箔上，保持涂膜，干燥，除去清漆中的至少一部分溶剂以形成由树脂组合物组成的层，并形成 加热由树脂组合物构成的层的树脂，形成含有聚酰亚胺树脂的树脂膜。 基于树脂膜中的金属元素含量的目标调整从涂覆到树脂成膜的各步骤的条件。

公开(公告)号：US20120141809A1

公开(公告)日：2012-06-07

申请号：US13382360

申请日：2010-06-03

Applicant: Kazuki Kanmuri

Inventor： Kazuki Kanmuri

IPC: B32B15/08

CPC classification number: H05K9/0084 ,  B32B7/02 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B2307/212 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/70 ,  B32B2457/08 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/31678

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein elongation after fracture of the copper foil is 5% or more, and wherein (F×T)/(f×t)≧1 is satisfied when t is a thickness of the copper foil, f is a stress of the copper foil under tensile strain of 4%, T is a thickness of the resin layer and F is a stress of the resin layer under tensile strain of 4%.

Abstract translation: 包含铜箔和层压在其上的树脂层的铜箔复合体，其中铜箔断裂后的伸长率为5％以上，并且当t为a时，满足（F×T）/（f×t）≥1 铜箔的厚度，f是拉伸应变为4％时的铜箔的应力，T是树脂层的厚度，F是树脂层在拉伸应变下的应力为4％。

公开(公告)号：US08187723B2

公开(公告)日：2012-05-29

申请号：US11915038

申请日：2006-06-12

Applicant: Tetsuhiro Matsunaga

Inventor： Tetsuhiro Matsunaga

IPC: B05D3/02 ,  B32B15/04 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20

CPC classification number: C23C28/00 ,  B05D2202/45 ,  B05D2350/65 ,  H05K3/384 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/265 ,  Y10T428/27 ,  Y10T428/31663

Abstract: A surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. The surface-treated copper foil comprises a rust-proofing layer and a silane coupling agent layer formed on an electrodeposited copper foil , wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the silane coupling layer is applied on top of the tin layer. The surface-treated copper foil may be further coated with a very thin primer resin layer having a thickness of 0.5 to 5 μm.

Abstract translation: 一种表面处理铜箔，其包含具有无铬防锈层的电沉积铜箔，其作为印刷线路板在化学处理后表现出良好的剥离强度和耐剥离损失性能。 表面处理铜箔包括在电沉积铜箔上形成的防锈层和硅烷偶联剂层，其中防锈层包括厚度为5至40mg / m 2的镍层和锡 层叠重量为5〜40mg / m 2的层，并且将硅烷偶联层涂覆在锡层的顶部。 表面处理的铜箔可以进一步涂覆厚度为0.5至5μm的非常薄的底漆树脂层。

公开(公告)号：US20120125680A1

公开(公告)日：2012-05-24

申请号：US13357663

申请日：2012-01-25

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K1/02 ,  C25D5/02 ,  B23K1/20 ,  B23K31/02 ,  H05K3/46 ,  C25D7/00

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以防止通孔的连接的可靠性。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20120102732A1

公开(公告)日：2012-05-03

申请号：US13281735

申请日：2011-10-26

Applicant: Shinnosuke MAEDA

Inventor： Shinnosuke MAEDA

IPC: H05K3/04

CPC classification number: H05K3/4682 ,  H01L21/4857 ,  H05K3/0026 ,  H05K2201/0358 ,  H05K2203/0228 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156

Abstract: A method of manufacturing a multilayer wiring substrate is provided. A foil of a metal-foil-clad resin insulation material is brought into contact with a foil of a metal-foil-clad support substrate. A peripheral edge portion of the resin insulation material exposed as a result of removal of a peripheral edge portion of the foil is adhered to the foil of the support substrate. A plurality of conductor layers and a plurality of resin insulation layers are laminated so as to obtain a laminate structure having a wiring laminate portion, which is to become the multilayer wiring substrate. The laminate structure is cut along a boundary between the wiring laminate portion and a surrounding portion, and the surrounding portion is removed. The wiring laminate portion is separated from the support substrate along the boundary between the two foils.

Abstract translation: 提供一种制造多层布线基板的方法。 使金属箔包覆的树脂绝缘材料的箔与覆盖金属箔的支撑衬底的箔接触。 由于去除箔的周缘部而露出的树脂绝缘材料的周边部分被粘附到支撑基板的箔上。 层叠多个导体层和多个树脂绝缘层，以获得具有将成为多层布线基板的布线层叠部分的层叠结构。 层叠结构沿着布线层压体部分和周围部分之间的边界被切割，并且周围部分被去除。 布线层叠部分沿着两个箔片之间的边界与支撑基板分离。

公开(公告)号：US20120045955A1

公开(公告)日：2012-02-23

申请号：US12860117

申请日：2010-08-20

Applicant: Dylan Joseph Boday ,  Joseph Kuczynski

Inventor： Dylan Joseph Boday ,  Joseph Kuczynski

IPC: B32B17/02 ,  B32B15/08 ,  C08G63/06 ,  C08L67/00 ,  C08G61/02 ,  B05D3/02 ,  C08L71/10

CPC classification number: H05K1/0353 ,  B32B17/02 ,  B32B17/064 ,  C03C25/323 ,  C08G65/485 ,  C08L71/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2205/02 ,  C08L2205/05 ,  H05K1/0326 ,  H05K1/0366 ,  H05K3/025 ,  H05K2201/0358 ,  Y10T428/31678 ,  Y10T442/2992

Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

Abstract translation: 用于印刷电路板（PCB）层压板的增强型预浸料包括基材和施加到基材上的树脂。 该树脂包括可固化聚合物和具有主链的聚合引发剂聚合物，所述主链具有自由基引发剂形成段，其经受热而分裂以产生多种不挥发性起始物质。 在制备PCB层压板的所有加工步骤期间，该树脂组合物消除了自由基引发剂可能的挥发性损失。 树脂可另外包括交联剂，阻燃剂和粘度调节剂。 在一个实施方案中，用树脂浸渍玻璃纤维片，随后干燥或固化。 玻璃布基材可以包括将树脂偶联到基材上的硅烷偶联剂。 在另一个实施方案中，通过将树脂施加到铜上并随后固化树脂来制备树脂涂覆的铜（RCC）。

公开(公告)号：US07992296B2

公开(公告)日：2011-08-09

申请号：US12351333

申请日：2009-01-09

Applicant: Woon-Chun Kim ,  Sung Yi

Inventor： Woon-Chun Kim ,  Sung Yi

IPC: H01K3/10

CPC classification number: H05K3/387 ,  H05K3/0055 ,  H05K3/108 ,  H05K3/381 ,  H05K3/426 ,  H05K3/4661 ,  H05K2201/0358 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first insulation layer, a first circuit pattern, a second insulation layer and a resin layer are successively laminated; boring a through-hole penetrating the substrate; forming roughness on the resin layer by a desmear process; forming a via making an electrical connection between layers through the through-hole; and forming a second circuit pattern on the resin layer having roughness formed thereon.

Abstract translation: 公开了印刷电路板及其制造方法。 根据本发明的实施例的方法包括：提供其上依次层叠有第一绝缘层，第一电路图案，第二绝缘层和树脂层的基板; 镗孔穿透基底的通孔; 通过去污工艺在树脂层上形成粗糙度; 形成通过所述通孔在层之间形成电连接的通孔; 并在其上形成粗糙度的树脂层上形成第二电路图案。

公开(公告)号：US07927453B2

公开(公告)日：2011-04-19

申请号：US11603201

申请日：2006-11-22

Applicant: Tetsuro Sato ,  Noriyuki Nagashima

Inventor： Tetsuro Sato ,  Noriyuki Nagashima

IPC: B32B37/00

CPC classification number: H05K3/4655 ,  H05K1/0366 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  H05K2203/0307 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted “a method of manufacturing a copper foil with an insulating layer 1 which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer 3 in an uncured or semi-cured state.

Abstract translation: 为了提供一种能够使制造的覆铜层压板的绝缘层中含有尽可能薄的骨架成分的材料的制造方法，能够可靠地防止附着的铜箔的结节处理面与 骨骼成分。 为了达到此目的，这里采用“一种具有绝缘层1的铜箔的制造方法”，该方法是在一个侧面上设置有含有骨架成分的半固化绝缘树脂层的铜箔的制造方法 的铜箔，其特征在于：具有未固化或半固化状态的第一热固性树脂层3。

公开(公告)号：US20110014453A1

公开(公告)日：2011-01-20

申请号：US12921567

申请日：2009-03-19

Applicant: Noriyuki Ohigashi

Inventor： Noriyuki Ohigashi

IPC: B32B15/08 ,  B32B15/092 ,  H01L23/12 ,  H05K1/03 ,  B32B37/00

CPC classification number: H05K3/4655 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/147 ,  B32B7/06 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  B32B2255/062 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/538 ,  B32B2307/734 ,  B32B2457/08 ,  H05K3/025 ,  H05K3/4652 ,  H05K2201/0358 ,  Y10T428/24917 ,  Y10T428/249921 ,  Y10T428/24994 ,  Y10T428/252 ,  Y10T428/265 ,  Y10T428/2839 ,  Y10T428/287

Abstract: A resin sheet with a copper foil, comprising: a carrier layer; a copper foil layer having a thickness 0.5 to 5 μm provided over the carrier layer; and an insulating resin layer formed over the copper foil layer, wherein the insulating resin layer is once abutted with base material, and then the carrier layer is delaminated from the copper foil layer, and wherein the insulating resin layer contains a cyanate ester resin having phenolic novolac backbone and a polyfunctional epoxy resin.

Abstract translation: 一种具有铜箔的树脂片，包括：载体层; 设置在载体层上的厚度为0.5〜5μm的铜箔层; 以及形成在铜箔层上的绝缘树脂层，其中绝缘树脂层一旦与基材接触，然后载体层从铜箔层分层，并且其中绝缘树脂层含有具有酚醛树脂的氰酸酯树脂 酚醛清漆骨架和多官能环氧树脂。

公开(公告)号：US20100233476A1

公开(公告)日：2010-09-16

申请号：US12308308

申请日：2007-06-19

Applicant: Makoto Uchida ,  Ryutaro Tanaka ,  Shigeo Hayashimoto ,  Shigeru Moteki ,  Mitsuyo Nishitoh

Inventor： Makoto Uchida ,  Ryutaro Tanaka ,  Shigeo Hayashimoto ,  Shigeru Moteki ,  Mitsuyo Nishitoh

IPC: B32B15/088 ,  C08L79/04 ,  C08L81/06

CPC classification number: H05K3/386 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/306 ,  B32B2307/538 ,  B32B2307/546 ,  B32B2457/08 ,  C08G73/10 ,  C08G73/1046 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1082 ,  C09D5/002 ,  C09D179/08 ,  C09J179/08 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/2804

Abstract: The present invention relates to a copper foil having a primer resin layer which improves the adhesive strength between a copper foil surface without roughening treatment and a substrate resin and a laminated sheet using the same and is characterized by using a polyimide represented by the following formula (1): (wherein, R1 represents a quadrivalent aromatic group which is a residual group of a dicarboxylic acid dianhydride ingredient (pyromellitic acid anhydride, 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, 3,3′,4,4′-benzophenontetracarboxylic acid dianhydride or 2,3,6,7-naphthalenetetracarboxylic acid dianhydride), R2 represents a divalent aromatic group which is a residual group of a diamine ingredient (1,3-bis-(3-aminophenoxy)benzene, 3,3′-diamino-4,4′-dihydroxydiphenylsulfone or/and 4,4′-diamino-3,3′,5,5′-tetraethyldiphenylmethane), and n1 represents a repeating number) as a primer resin; and copper foils and laminated sheets having said polyimide layer as a primer have high adhesive strength and are suitable for flexible printed wiring boards.

Abstract translation: 本发明涉及一种具有底漆树脂层的铜箔，该底漆树脂层提高了不进行粗糙化处理的铜箔表面与基材树脂之间的粘合强度，使用该底漆树脂层和使用其的层叠片材，其特征在于，使用下述式 1）:(式中，R 1表示作为二羧酸二酐成分的残留基的四价芳香族基团（均苯四酸酐，3,3'，4,4'-联苯四羧酸二酐，3,3'，4,4 二苯甲酮酸二酐或2,3,6,7-萘四羧酸二酐），R2表示作为二胺成分（1,3-双 - （3-氨基苯氧基）苯，3,3-双（3-氨基苯氧基）苯的残基的二价芳香族基团， 3'-二氨基-4,4'-二羟基二苯基砜或/和4,4'-二氨基-3,3'，5,5'-四乙基二苯基甲烷），n1表示重复数）作为底漆树脂; 并且具有所述聚酰亚胺层作为底漆的铜箔和层压片具有高粘合强度并且适用于柔性印刷线路板。