公开(公告)号：US20080096046A1

公开(公告)日：2008-04-24

申请号：US11908329

申请日：2006-03-10

Applicant: Tomoaki Yamashita ,  Yasuo Inoue ,  Masaharu Matsuura ,  Toyoki Ito ,  Akira Shimizu ,  Fumio Inoue ,  Akishi Nakaso

Inventor： Tomoaki Yamashita ,  Yasuo Inoue ,  Masaharu Matsuura ,  Toyoki Ito ,  Akira Shimizu ,  Fumio Inoue ,  Akishi Nakaso

IPC: C23F1/00 ,  B32B15/20

CPC classification number: H05K3/385 ,  C23C8/02 ,  C23C8/40 ,  C23C22/63 ,  C23C28/00 ,  C23C28/321 ,  C23C28/322 ,  C23C28/345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/384 ,  H05K3/389 ,  H05K3/4644 ,  H05K2201/0347 ,  H05K2201/0373 ,  H05K2203/0315 ,  H05K2203/1157 ,  Y10T428/12438 ,  Y10T428/12771 ,  Y10T428/12875 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 μm on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.

Abstract translation: 提供一种处理铜表面的方法，以确保铜表面和绝缘层之间的粘合强度，而不会在铜表面上形成超过1um的凹凸，并提高布线之间的绝缘可靠性。 还提供了通过上述表面处理方法处理其表面的铜。 处理铜的表面的方法包括铜的表面，包括以下步骤：在铜的表面上离散地形成比铜更贵的金属; 然后通过使用含有氧化剂的碱性溶液氧化铜的表面。

公开(公告)号：US20080029874A1

公开(公告)日：2008-02-07

申请号：US11839740

申请日：2007-08-16

Applicant: Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

Inventor： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H05K3/3426 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49811 ,  H01L24/02 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  Y02P70/613

Abstract: A semiconductor component including a surface-mount housing and a method for producing the same are described herein. The semiconductor component includes lead pieces embedded into a plastic housing composition and arranged on an underside of the housing. External contact areas of the lead pieces are free of the plastic housing composition. A structured solderable coating is arranged on the external contact areas that have been kept free of the plastic housing composition, the coating includes a plurality of electrically conductive and mechanically elastic contact elements.

Abstract translation: 本文描述了包括表面安装壳体的半导体部件及其制造方法。 半导体部件包括嵌入塑料外壳组合物中并布置在壳体的下侧上的引线片。 引导件的外部接触区域不含塑料外壳构成。 结构可焊接涂层布置在已经保持没有塑料外壳组合物的外部接触区域上，涂层包括多个导电和机械弹性的接触元件。

公开(公告)号：US20080023832A1

公开(公告)日：2008-01-31

申请号：US11762729

申请日：2007-06-13

Applicant: Shyh-Ming Chang

Inventor： Shyh-Ming Chang

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H05K3/4007 ,  H01L22/32 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/0361 ,  H01L2224/0391 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/056 ,  H01L2224/11515 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13552 ,  H01L2224/13553 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/2919 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09909 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A contact structure including a contact pad, a polymer bump and a conductive layer is provided in the present invention. The contact pad is disposed on a substrate. The polymer bump is disposed on the contact pad. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad. The invention further discloses a manufacturing method of a contact structure. First, a substrate is provided having a contact pad already formed thereon. Then, a polymer bump is formed on the contact pad and a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.

Abstract translation: 在本发明中提供了包括接触垫，聚合物凸块和导电层的接触结构。 接触垫设置在基板上。 聚合物凸块设置在接触垫上。 导电层覆盖聚合物凸块并延伸到聚合物凸块的外部。 延伸到聚合物凸块外部的导电层的部分用作测试垫。 本发明还公开了一种接触结构的制造方法。 首先，提供具有已在其上形成的接触垫的基板。 然后，在接触焊盘上形成聚合物凸块，并且在聚合物凸块上形成导电层。 导电层覆盖聚合物凸块并延伸到聚合物凸块的外部。 延伸到聚合物凸块外部的导电层的部分用作测试垫。

公开(公告)号：US20070284711A1

公开(公告)日：2007-12-13

申请号：US11450667

申请日：2006-06-09

Applicant: Tien Yu T. Lee ,  Craig S. Amrine ,  Victor A. Chiriac ,  Lizabeth Ann Keser ,  George R. Leal ,  Robert J. Wenzel

Inventor： Tien Yu T. Lee ,  Craig S. Amrine ,  Victor A. Chiriac ,  Lizabeth Ann Keser ,  George R. Leal ,  Robert J. Wenzel

IPC: H01L23/02

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L23/5389 ,  H01L24/25 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/19 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4641 ,  H05K2201/0373 ,  H05K2201/09509 ,  H05K2201/10416

Abstract: A multi-layer structure (102) includes a first build-up layer structure (202) configured to connect to a heat-generating module (120), a second build-up layer structure (206) configured to connect to a substrate, and a middle layer (204) provided between the first build-up layer structure and the second build-up layer structure, the middle layer including at least one semiconductor component (110) and a heat spreader (130). A first set of thermal vias (210) extend through the first build-up layer structure to the heat spreader, and a second set of thermal vias (2100 extend through the second build-up layer structure to the heat spreader, wherein at least a portion of the first set of thermal vias is in thermal contact with the heat-generating module.

Abstract translation: 多层结构（102）包括构造成连接到发热模块（120）的第一堆积层结构（202），被配置为连接到衬底的第二堆积层结构（206），以及 设置在第一堆积层结构和第二堆积层结构之间的中间层（204），中间层包括至少一个半导体部件（110）和散热器（130）。 第一组热通孔（210）延伸穿过第一堆积层结构到散热器，第二组热通孔（2100）穿过第二堆积层结构延伸到散热器，其中至少一个 第一组热通孔的一部分与发热模块热接触。

公开(公告)号：US20070220744A1

公开(公告)日：2007-09-27

申请号：US11587439

申请日：2005-07-21

Applicant: Kenji Kitaoka ,  Takayoshi Fujimoto

Inventor： Kenji Kitaoka ,  Takayoshi Fujimoto

IPC: H05K3/10 ,  H01K3/10

CPC classification number: H05K3/4007 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/182 ,  H05K3/246 ,  H05K3/3436 ,  H05K3/4614 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09472 ,  H05K2203/0709 ,  H05K2203/1173 ,  H05K2203/1189 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A wiring circuit board and a method of producing the same are provided in which a desired pattern of wiring is provided at higher density while permitting no overflow from the grooves of an electroless plating catalyst containing solution and an electric conductor forming liquid such as silver ink. The pattern of electric conductor is deposited by applying the electric conductor forming liquid into the grooves provided in a substrate and distributing the same along the grooves with the action of capillarity. The method starts with patterning the grooves in the surface of the substrate (S1), applying the electric conductor forming liquid into the grooves (S2), and coating the surface of the substrate with a layer of repellent liquid which is lower in the affinity with the electric conductor forming liquid (S3). This is followed by cleaning at least the grooves (S4) and then filling the grooves with the electric conductor forming liquid once again (S5). The electric conductor forming liquid applied into the grooves is then distributed throughout the grooves by the action of capillarity. When silver ink is used, the pattern of electric conductor is produced by repeating an action of applying and drying a number of times. Alternatively, the patter of electric conductor can be produced by an electroless plating technique or a combination of an electroless plating technique and an electro-plating technique for separating an electrical conductive material form the electric conductor forming liquid.

Abstract translation: 提供一种布线电路板及其制造方法，其中以更高的密度提供所需的布线图案，同时不允许来自含化学镀电镀催化剂溶液的槽和诸如银墨的电导体形成液体的槽溢出。 通过将导电剂形成液体施加到设置在基板中的凹槽中并通过毛细管作用沿着凹槽分布而将电导体的图案沉积。 该方法开始于图案化基板表面（S 1）中的凹槽，将导电体形成液体施加到凹槽（S 2）中，并且在基板的表面中涂覆一层较低的驱避液体 与导电体形成液体的亲合力（S 3）。 然后，至少清洗槽（S 4），然后再次用导电体形成液填充槽（S 5）。 然后通过毛细作用的作用将施加到槽中的导电体形成液体分布在整个槽中。 当使用银墨时，通过重复施加和干燥多次的作用产生电导体的图案。 或者，电导体的图案可以通过化学镀技术或化学镀技术和电镀技术的组合来制造，用于从形成电导体的液体中分离导电材料。

公开(公告)号：US20070128845A1

公开(公告)日：2007-06-07

申请号：US11408072

申请日：2006-04-21

Applicant: Yung-Yu Hsu ,  Chih-Yuan Chen ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

Inventor： Yung-Yu Hsu ,  Chih-Yuan Chen ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

IPC: H01L21/4763 ,  H01L23/48

CPC classification number: H01L24/12 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/326 ,  H05K2201/0373 ,  H05K2201/209 ,  H01L2924/00

Abstract: An interconnect structure of an integrated circuit and manufacturing method therefor are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conductive first pillars is respectively formed on the first and second pads. With different densities and thicknesses of the first and second pillars, a contact strength can be generated when the pillars interconnecting with each other, such that the pillars are connected closely. Furthermore, the interconnect structure can also be used to connect with fibers made of conductive materials. Moreover, the higher the density of the pillars, the stronger the contact strength. And, electronic substrates and active or passive electronic elements can be stuck on the other side of each pad. Therefore, the interconnect structure can maintain flexibility and have high reliability without being enhanced by any thermosetting polymer.

Abstract translation: 提供了一种集成电路的互连结构及其制造方法，涉及柔性封装的互连结构。 互连结构包括第一和第二导电焊盘。 多个微小且导电的第一支柱分别形成在第一和第二垫上。 当第一和第二支柱具有不同的密度和厚度时，当支柱互相连接时，可以产生接触强度，使得支柱紧密连接。 此外，互连结构也可以用于与由导电材料制成的纤维连接。 此外，支柱的密度越高，接触强度越强。 并且，电子基板和有源或无源电子元件可以卡在每个垫的另一侧上。 因此，互连结构可以保持柔性并且具有高可靠性，而不会被任何热固性聚合物增强。

公开(公告)号：US07205661B2

公开(公告)日：2007-04-17

申请号：US11268884

申请日：2005-11-08

Applicant: James M. Wark ,  Salman Akram

Inventor： James M. Wark ,  Salman Akram

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/10 ,  G01R1/06738 ,  H01L22/34 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10734 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may be provided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.

Abstract translation: 公开了凸起的半导体器件接触结构，其包括至少一个非平面接触焊盘，其具有从其延伸的多个突起，用于接触凸起的集成电路（IC）器件的至少一个焊球，例如凸起的裸片和凸起的封装 IC设备。 突起被布置成与凸起的IC器件的焊球电接触，而不会使焊球基本上变形。 因此，本发明的接触焊盘不需要焊球的回流以重新形成焊球。 这样的接触垫可以设置在诸如探针等的各种测试设备上，并且可以用于临时和永久连接。 还公开了通过蚀刻和沉积形成接触焊盘的改进方法。

公开(公告)号：US20060234460A1

公开(公告)日：2006-10-19

申请号：US11106151

申请日：2005-04-13

Applicant: Lu-Chen Hwan

Inventor： Lu-Chen Hwan

IPC: H01L21/331 ,  H01L21/00

CPC classification number: H01L21/563 ,  G02F1/13452 ,  H01L2224/73203 ,  H01L2924/01079 ,  H05K1/118 ,  H05K3/244 ,  H05K3/305 ,  H05K3/325 ,  H05K3/361 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10977

Abstract: A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrate, and then removing the photoresist layer. When connecting the cable to a task object such as an LCD glass substrate or PCB, only a usual non-conductive paste is applied to join the cable and the task object, without use of expensive anisotropic-conductive paste or film.

Abstract translation: 具有导电凸块的电缆通过在电缆基底上形成具有多个开口的光致抗蚀剂层来制造，在光致抗蚀剂层上涂覆导电层，由此开口中的导电层在电缆基底上的电路处形成凸块，然后除去光致抗蚀剂 层。 当将电缆连接到诸如LCD玻璃基板或PCB的任务对象时，仅使用通常的不导电浆料来连接电缆和任务对象，而不使用昂贵的各向异性导电膏或膜。

公开(公告)号：US20060223231A1

公开(公告)日：2006-10-05

申请号：US11397711

申请日：2006-04-05

Applicant: Ichiro Koiwa ,  Mitsuhiro Watanabe

Inventor： Ichiro Koiwa ,  Mitsuhiro Watanabe

IPC: H01L21/00

CPC classification number: C09J5/06 ,  C09J2203/326 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/4922 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/19042 ,  H05K1/111 ,  H05K3/305 ,  H05K3/323 ,  H05K3/325 ,  H05K3/383 ,  H05K2201/0373 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A packaging method which makes possible firm connection of electronic components having bump areas and a wiring board having a pad electrode portion with secure electrical conduction is to be provided. To achieve this object, according to the packaging method which makes possible firm connection of electronic components having bump areas and a wiring board having a pad electrode portion with secure electrical conduction, the surface of the pad electrode portion of the wiring board has a roughened surface of 0.1 μm (Rzjis) or more, a layer of thermosetting adhesive resin in a semi-cured stage is provided over the roughened surface of the pad electrode portion, the bump areas of electronic components and the pad electrode portion of the wiring board are placed one over the other to be arranged opposite each other, and crimped under pressure and heating. The roughened surface of the pad electrode portion of the wiring board is obtained by etching the pad electrodes or otherwise.

Abstract translation: 提供一种能够牢固地连接具有凸起区域的电子部件和具有安全导电性的焊盘电极部的布线基板的封装方法。 为了实现该目的，根据能够牢固地连接具有凸起区域的电子部件和具有固定导电性的焊盘电极部的布线基板的封装方法，布线基板的焊盘电极部的表面具有粗糙面 （Rzjis）以上，将半固化阶段的热固性粘合剂树脂层设置在焊盘电极部的粗糙面上，电子部件的凸起区域和布线基板的焊盘电极部分 一个在另一个上彼此相对布置，并在压力和加热下卷曲。 通过蚀刻焊盘电极或其它方式获得布线板的焊盘电极部分的粗糙表面。

公开(公告)号：US20060060968A1

公开(公告)日：2006-03-23

申请号：US11269053

申请日：2005-11-08

Applicant: James Wark ,  Salman Akram

Inventor： James Wark ,  Salman Akram

IPC: H01L23/48

CPC classification number: H01L24/10 ,  G01R1/06738 ,  H01L22/34 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10734 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may be provided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.