Abstract:
A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.
Abstract:
Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.
Abstract:
The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.
Abstract:
A first flexible printed wiring board (10) has a first wiring line (14) and includes a first opening (12) and second opening (13) that are positioned at a prescribed distance from each other. A portion of a second flexible printed wiring board (20) is inserted into the first opening (12) and second opening (13). The second flexible printed wiring board (20) has a second wiring line (22) on a narrow-width section (26), which is located at a tip part in an insertion direction (30) and has a smaller width than the first opening (12) and second opening (13) in a width direction (31) that is perpendicular to the insertion direction (30) towards the first flexible printed wiring board (10). The second flexible printed wiring board (20) contains a positioning section (24) that connects to the narrow-width section (26) and that has a width greater than either the first opening (12) or the second opening (13) in the width direction (31). In other words, the first wiring line (14) and the second wiring line (22) are connected when the first opening (12) or the second opening (13) is coupled to the positioning section (24) to lock the first flexible printed wiring board (10) and the second flexible printed wiring board (20) together.
Abstract:
A gas turbine engine 10 is provided with electrical harness rafts 200 comprising electrical conductors embedded in a rigid composite material. The rafts 200 are used to transport electrical signals (which may be, for example power and/or control signals) around a gas turbine engine. Rafts 200 may be connected together and to other components using flexible cables, that may help to accommodate relative movement of the rafts 200, for example through vibration. The rafts 200 are lighter, more compact, and more convenient to handle than conventional electrical harnesses. The rafts 200 may provide a convenient and secure mounting surface for other components/systems of a gas turbine engine, such as EECs and/or fluid pipes.
Abstract:
An electro-optical device includes an electro-optical panel, a first wiring board and a second wiring board. The first wiring board having a one-side first connection terminal electrically connected to the panel-side connection terminal at one end of a first wiring forming surface and having an other-side first connection terminal at the other end of the first wiring forming surface. The second wiring board having one-side second connection terminal electrically connected to the other-side first connection terminal at one end of a second wiring forming surface and having the other-side second connection terminal at the other end of the second wiring forming surface.
Abstract:
A light module (1; 14), comprising a carrier (8, 10) for mounting at least one semiconductor source (5), in particular a light emitting diode, wherein: the carrier (8, 10) has a flexible printed circuit board (10), the flexible printed circuit board (10) is bonded face-to face to at least one base plate, (8) and the carrier (8, 10) can be bent along at least one predetermined bending line (3; 3a-3e), the base plate (8) can be bent along the at least one bending line, (3; 3a-3e), the base plate (8) has at least one cutout (9) along the bending line (3; 3a-3e) and the flexible printed circuit board (10) has at least one strip (11; 15) which crosses at least one of the cutouts (9).
Abstract:
A junction structure and a joining method of substrates are provided that stably can join the substrates and achieve high workability during joining. A second substrate 2 to be joined with solder to a first substrate 1 is bent with elasticity generated by a bending portion 9, and first joints 5 on the first substrate 1 and second joints 6 on the second substrate 2 are joined with solder in a state in which the first substrate 1 is brought into contact with, in a direction that increases the bending angle of the bending portion 9, a part where the joints 6 are formed on the second substrate 2.
Abstract:
A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
Abstract:
An LCD device includes: a backlight unit including a plurality of light emitting diodes (LEDs) which generate light, and emit the light to a liquid crystal panel; a main flexible circuit board on which driving circuits to drive the LEDs and the liquid crystal panel; a sub-flexible circuit board on which the LEDs are mounted and electrically connected to a wire pattern formed on the main flexible circuit board by being soldered to a side surface of the main flexible circuit board to electrically connect the light emitting diodes and the driving circuits for the light emitting diodes; and a support main encompassing the liquid crystal panel and the backlight unit and including a step portion at a side surface thereof to accommodate a soldering portion between the side surface of the main flexible circuit board and the sub-flexible circuit board which are connected by soldering.