公开(公告)号：US20090159316A1

公开(公告)日：2009-06-25

申请号：US12337965

申请日：2008-12-18

Applicant: Toshiyuki KURAMOCHI

Inventor： Toshiyuki KURAMOCHI

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09972 ,  Y10T29/49124

Abstract: A wiring substrate is provided. The wiring substrate includes: a core layer in which a gap is formed; and a lamination layer which includes an insulating layer and a wiring layer and which is formed on at least one surface of the core layer. The lamination layer has a thermal expansion coefficient different from that of the core layer. A plurality of mounting regions on which an electronic component is to be mounted are provided on the lamination layer to be spaced from each other. The gap in the core layer is filled with an insulating member having the same material as the insulating layer and surrounds each of the plurality of mounting regions or each of mounting region groups including one or more of the mounting regions.

Abstract translation: 提供布线基板。 布线基板包括：形成有间隙的芯层; 以及层叠层，其包括绝缘层和布线层，并且形成在所述芯层的至少一个表面上。 层叠层的热膨胀系数与芯层的热膨胀系数不同。 要在其上安装电子部件的多个安装区域设置在层压层上以彼此间隔开。 芯层中的间隙填充有与绝缘层具有相同材料的绝缘构件，并且围绕多个安装区域中的每一个或包括一个或多个安装区域的每个安装区域组。

公开(公告)号：US20090101393A1

公开(公告)日：2009-04-23

申请号：US12224803

申请日：2007-03-06

Applicant: Byung-Nam Kim ,  Heon-Sik Song ,  Joo-Eun Ko ,  Soon-Yong Park ,  Jung-Jin Shim

Inventor： Byung-Nam Kim ,  Heon-Sik Song ,  Joo-Eun Ko ,  Soon-Yong Park ,  Jung-Jin Shim

IPC: H05K1/00 ,  B32B15/08 ,  H01B13/00 ,  B05D3/02 ,  B05D3/00

CPC classification number: B32B15/08 ,  B32B7/02 ,  B32B15/20 ,  B32B27/08 ,  B32B27/281 ,  B32B2307/51 ,  B32B2457/08 ,  C23C26/00 ,  C23C28/00 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0346 ,  H05K1/036 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31681

Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C.

Abstract translation: 本发明提供一种金属层压体及其制备方法。 金属层压体包括金属层和至少一个聚酰亚胺树脂层。聚酰亚胺树脂层在400℃下的弹性模量为70Mpa。

公开(公告)号：US20090090465A1

公开(公告)日：2009-04-09

申请号：US12171658

申请日：2008-07-11

Applicant: Kalu K. Vasoya

Inventor： Kalu K. Vasoya

IPC: B32B37/00

CPC classification number: H05K3/4641 ,  H05K1/115 ,  H05K3/0005 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4638 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09236 ,  H05K2201/09636 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09718 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Printed wiring boards and methods of manufacturing printed wiring boards are disclosed. In one aspect of the invention, the printed wiring boards include electrically conductive constraining cores having at least one resin filled channel. The resin filled channels perform a variety of functions that can be associated with electrical isolation and increased manufacturing yields.

Abstract translation: 公开了印刷电路板和制造印刷电路板的方法。 在本发明的一个方面，印刷电路板包括具有至少一个树脂填充通道的导电约束芯。 填充树脂的通道执行各种功能，可以与电气隔离和增加的制造产量相关联。

公开(公告)号：US20090084590A1

公开(公告)日：2009-04-02

申请号：US12188257

申请日：2008-08-08

Applicant: Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

Inventor： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC: H05K1/00

CPC classification number: H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

Abstract translation: 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

公开(公告)号：US07507914B2

公开(公告)日：2009-03-24

申请号：US11136120

申请日：2005-05-24

Applicant: Aaron Levine ,  Jay D. Stanke

Inventor： Aaron Levine ,  Jay D. Stanke

IPC: H05K1/16

CPC classification number: H01L21/485 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/225 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/09645 ,  H01L2924/00

Abstract: A miniature PWB with features that incorporate the required circuitry changes and component footprints, which has been enhanced with micro-castellations such as those found on ceramic surface mount packages. The miniature PWB is mounted on the circuit board using techniques well known in the art. This combination of technologies provides an adaptable, durable interconnect methodology, which allows for circuit and part changes without changing the layout of the base printed wiring board.

Abstract translation: 具有特征的微型电路板，其中包含所需的电路变化和组件占位面积，这已经通过微型铸造（如陶瓷表面贴装封装上发现的）进行了增强。 使用本领域公知的技术将微型PWB安装在电路板上。 这种技术的组合提供了一种适应性强，耐用的互连方法，其允许电路和部件更改，而不改变基本印刷线路板的布局。

公开(公告)号：US07498522B2

公开(公告)日：2009-03-03

申请号：US11507478

申请日：2006-08-22

Applicant: Nobutaka Itoh

Inventor： Nobutaka Itoh

IPC: H05K1/03

CPC classification number: H05K1/0271 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09618 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/1572

Abstract: A printed circuit board includes a product portion and a backing plate. Upper and lower surfaces of the backing plate are coated with solder masks with different material characteristics.

Abstract translation: 印刷电路板包括产品部分和背板。 背板的上表面和下表面涂覆有具有不同材料特性的焊接掩模。

公开(公告)号：US20090035591A1

公开(公告)日：2009-02-05

申请号：US12242250

申请日：2008-09-30

Applicant: Takahiro NISHIKAWA ,  Masashi Nakano ,  Noriyuki Akane ,  Nobuhito Ito ,  Masaki Sasaki ,  Masao Arima

Inventor： Takahiro NISHIKAWA ,  Masashi Nakano ,  Noriyuki Akane ,  Nobuhito Ito ,  Masaki Sasaki ,  Masao Arima

IPC: B32B15/088

CPC classification number: B32B15/08 ,  B32B27/281 ,  B32B37/04 ,  B32B2038/0028 ,  B32B2307/202 ,  B32B2307/518 ,  B32B2311/00 ,  B32B2379/08 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  H05K1/0346 ,  H05K1/036 ,  H05K3/4635 ,  H05K3/4655 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2203/065 ,  Y10T428/31681

Abstract: In a flexible laminate containing a metal foil layer/a thermoplastic polyimide layer or/and a conductor circuit layer/a thermoplastic polyimide layer, the metal foil layer or the conductor circuit layer is bonded to at least one side of the thermoplastic polyimide layer. The thermoplastic polyimide layer is formed from a thermoplastic polyimide resin film or sheet produced by melt extrusion of a thermoplastic polyimide resin. Alternatively, the thermoplastic polyimide layer is formed from a biaxially oriented thermoplastic polyimide resin film or sheet. Such a flexible laminate can be easily manufactured by a lamination method which comprises bonding a thermoplastic polyimide resin film (1) to a metal foil (2) or a conductive circuit layer (4) by heating under pressure, and has excellent heat resistance, electrical properties and mechanical strength inherent in a polyimide. When the biaxially oriented thermoplastic polyimide resin film or sheet is used, the flexible laminate can be improved in dimensional stability and resistance to soldering heat.

Abstract translation: 在含有金属箔层/热塑性聚酰亚胺层或/和导体电路层/热塑性聚酰亚胺层的柔性层叠体中，金属箔层或导体电路层与热塑性聚酰亚胺层的至少一面接合。 热塑性聚酰亚胺层由热塑性聚酰亚胺树脂膜或通过热塑性聚酰亚胺树脂的熔融挤出制成的片形成。 或者，热塑性聚酰亚胺层由双轴取向的热塑性聚酰亚胺树脂膜或片形成。 这样的柔性层压体可以容易地通过层压方法制造，其包括通过在加压下加热将热塑性聚酰亚胺树脂膜（1）粘合到金属箔（2）或导电电路层（4），并且具有优异的耐热性，电 聚酰亚胺固有的性能和机械强度。 当使用双轴取向的热塑性聚酰亚胺树脂膜或片材时，可以提高柔性层压体的尺寸稳定性和耐焊接热能。

公开(公告)号：US07421778B2

公开(公告)日：2008-09-09

申请号：US11388100

申请日：2006-03-22

Applicant: Jason A. Garcia ,  John J. Beatty

Inventor： Jason A. Garcia ,  John J. Beatty

IPC: H05K3/36

CPC classification number: H05K3/3436 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14141 ,  H01L2224/14142 ,  H01L2224/14145 ,  H01L2224/14146 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/3511 ,  H05K3/3426 ,  H05K2201/068 ,  H05K2201/10242 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00014

Abstract: According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.

Abstract translation: 根据本发明的一个方面，提供一种电子组件。 电子组件包括其中形成有集成电路的第一基板和第二基板。 第一和第二基板通过电连接到集成电路的多个双材料互连互连，并且具有第一部件，该第一部件包括具有第一热膨胀系数的导电第一材料，第二部件包括具有第二材料的第二部件， 第二热膨胀系数。 第一和第二部件被连接和成形，使得当双材料互连件的温度改变时，互连件每个朝着第一或第二部件弯曲。 当第二基板的温度升高时，第二基板从其中心部分扩展。 双材料互连布置成使得双材料互连件远离第二基板的中心部分弯曲。

公开(公告)号：US20080191354A1

公开(公告)日：2008-08-14

申请号：US12081051

申请日：2008-04-10

Applicant: Robert M. Japp ,  Voya R. Markovich ,  Kostas I. Papathomas ,  Mark D. Poliks

Inventor： Robert M. Japp ,  Voya R. Markovich ,  Kostas I. Papathomas ,  Mark D. Poliks

IPC: H01L23/50 ,  H05K3/30

CPC classification number: H01L23/145 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/4922 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/564 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T29/4913 ,  H01L2224/0401

Abstract: A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.

Abstract translation: 一种电路化基板，包括具有浸渍有无卤低吸湿树脂的对芳族聚酰胺纸，并且不包括作为其一部分的连续或半连续玻璃纤维纤维的介电层和位于介电层上的第一电路层。 还提供了制造该基板的方法。

公开(公告)号：US20080180900A1

公开(公告)日：2008-07-31

申请号：US11669362

申请日：2007-01-31

Applicant: Michael J Domitrovits ,  Edward J. Donnelly ,  Raymond F. Frizzell

Inventor： Michael J Domitrovits ,  Edward J. Donnelly ,  Raymond F. Frizzell

IPC: H05K7/02 ,  H05K3/34

CPC classification number: H05K1/0271 ,  H01R12/716 ,  H01R12/721 ,  H05K3/341 ,  H05K3/3421 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.

Abstract translation: 公开了电子部件，电子部件和电子载体基板的组件以及将电子部件连接到载体基板的方法。 载体衬底具有第一热膨胀系数（CTE），并且电子部件具有第二CTE。 组件还包括在载体基板上的用于将电子部件连接到载体基板的导电材料，并且电气部件通过加热连接到载体基板，然后冷却该导电材料。 电子部件包括膨胀接头，以在导电材料的加热和冷却期间允许电子部件相对于载体基板膨胀和收缩。