中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

564 records (took 0.019 seconds)

    DISPLAY DEVICE
    131.
    发明申请
    DISPLAY DEVICE 有权
    显示设备

    公开(公告)号：US20110002105A1

    公开(公告)日：2011-01-06

    申请号：US12828563

    申请日：2010-07-01

    Applicant: Hiroyuki MIYAZAKI

    Inventor： Hiroyuki MIYAZAKI

    IPC: H05K1/00

    CPC classification number: G02F1/13452 ,  G02F1/133308 ,  G02F2201/503 ,  H05K1/118 ,  H05K2201/09145

    Abstract: Provided is a display device including: a display panel; a circuit board; a connector mounted on the circuit board; a flexible wiring board attached to the connector; and a housing which accommodates the display panel, the circuit board, and one part of the flexible wiring board, and includes a slit formed therein, from which another part of the flexible wiring board is pulled out. The flexible wiring board includes, in the one part of the flexible wiring board, a first region extending in directions which intersect a pull-out direction from the slit, and having a width which is larger than a width of the flexible wiring board at a position overlapping the slit.

    Abstract translation: 提供一种显示装置，包括：显示面板; 电路板; 安装在电路板上的连接器; 连接到连接器的柔性布线板; 以及容纳显示面板，电路板和柔性布线板的一部分的壳体，并且包括形成在其中的狭缝，柔性布线板的另一部分从该狭缝被拉出。 柔性布线基板包括在柔性布线基板的一部分中的从狭缝向与拉出方向相交的方向延伸的第一区域，其宽度大于柔性布线基板的宽度 位置与狭缝重叠。

    PCB CONNECTOR
    132.
    发明申请
    PCB CONNECTOR 失效
    PCB连接器

    公开(公告)号：US20100330833A1

    公开(公告)日：2010-12-30

    申请号：US12495725

    申请日：2009-06-30

    Applicant: Yi-Kuo Wang

    Inventor： Yi-Kuo Wang

    IPC: H01R13/62

    CPC classification number: H05K3/0097 ,  H05K2201/09145 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/167

    Abstract: For connecting multiple PC boards to form a PCB pane, a PCB connector is disclosed include a bearing strip, which has locating grooves spaced along the length, upright pins disposed in the locating grooves and inserted through respective through holes on connection portions of the PC boards to be connected and studs spaced along the length and disposed beyond the locating grooves, and a holding down strip, which has locating grooves corresponding to the locating grooves of the bearing strip for receiving the connection strips of the PC boards, pin holes respectively press-fitted onto the upright pins and sockets respectively fastened to the studs of the bearing strip.

    Abstract translation: 为了连接多个PC板以形成PCB板，公开了一种PCB连接器，其包括具有沿着长度间隔开的定位槽的轴承条，设置在定位槽中的直立销插入通过PC板的连接部分上的相应通孔 被连接并且沿着长度间隔开并且设置在定位槽之外的螺柱，以及具有与用于接收PC板的连接条的轴承条的定位槽相对应的定位槽的压紧带， 安装在分别固定在轴承条的螺柱上的直立销和插座上。

    Non-volatile memory module for preventing system failure and system including the same
    133.
    发明授权
    Non-volatile memory module for preventing system failure and system including the same 有权
    用于防止系统故障的非易失性存储器模块及包含其的系统

    公开(公告)号：US07733680B2

    公开(公告)日：2010-06-08

    申请号：US11962435

    申请日：2007-12-21

    Applicant: Jeon-Taek Im

    Inventor： Jeon-Taek Im

    IPC: G11C5/02

    CPC classification number: G11C5/00 ,  G08B13/1409 ,  H05K1/14 ,  H05K3/366 ,  H05K2201/09145 ,  H05K2201/10159 ,  H05K2201/10325 ,  H05K2203/167 ,  H05K2203/168

    Abstract: A non-volatile memory module for preventing system failure and a system including the same, in which the non-volatile memory system includes a first socket and a second socket each having a notch coupler, a first memory module, a memory controller configured to control the first memory module, and a printed circuit board on which the memory controller and the first and second sockets are installed and electrical signal lines are formed between the memory controller and the first and second sockets. The first memory includes a plurality of non-volatile memory devices and stores system software. The first memory module has a structure such that it can be installed at the first socket but cannot be installed at the second socket. The non-volatile memory system may further include a second memory module for an extension of the memory capacity. The second memory module has a structure such that it can be installed at the second socket but cannot be installed at the first socket. Accordingly, system failure caused by misusage of a non-volatile memory module can be prevented.

    Abstract translation: 一种用于防止系统故障的非易失性存储器模块和包括该非易失性存储器系统的系统，其中非易失性存储器系统包括第一插座和每个具有陷波耦合器的第二插座，第一存储器模块，被配置为控制 第一存储器模块和其上安装有存储器控制器和第一和第二插槽的印刷电路板，并且在存储器控制器和第一和第二插槽之间形成电信号线。 第一存储器包括多个非易失性存储器件并存储系统软件。 第一存储器模块具有这样的结构，使得其可以安装在第一个插座处，但不能安装在第二个插座上。 非易失性存储器系统还可以包括用于扩展存储器容量的第二存储器模块。 第二存储器模块具有这样的结构，使得它可以安装在第二个插座上，但是不能安装在第一插座上。 因此，可以防止由非易失性存储器模块的滥用引起的系统故障。

    MULTI-PIECE BOARD AND FABRICATION METHOD THEREFOR
    134.
    发明申请
    MULTI-PIECE BOARD AND FABRICATION METHOD THEREFOR 有权
    多层板及其制造方法

    公开(公告)号：US20100118504A1

    公开(公告)日：2010-05-13

    申请号：US12537713

    申请日：2009-08-07

    Applicant: Yasushi HASEGAWA

    Inventor： Yasushi HASEGAWA

    IPC: H05K7/14 ,  H05K3/36

    CPC classification number: H05K3/0097 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/0169 ,  H05K2203/162 ,  Y10T29/49126 ,  Y10T29/49208

    Abstract: A method for fabricating a multi-piece board includes: preparing a board main portion having a first coupling member and multiple piece portions connected to the first coupling member, the first coupling member forming a part of a coupling member of a multi-piece board, each of the piece portions having a printed wiring board; preparing a second coupling member which forms the coupling member together with the first coupling member; and adhering the second coupling member to the first coupling member of the board main portion, thereby yielding the multi-piece board.

    Abstract translation: 一种制造多片板的方法包括：制备具有第一联接构件的板主体和连接到第一联接构件的多个部分，第一联接构件形成多片板的联接构件的一部分， 每个片部分具有印刷线路板; 准备与第一联接构件一起形成联接构件的第二联接构件; 并且将第二联接构件粘合到板主要部分的第一联接构件，从而产生多片板。

    Angular encapsulation of tandem stacked printed circuit boards
    136.
    发明授权
    Angular encapsulation of tandem stacked printed circuit boards 有权
    串联堆叠印刷电路板的角封装

    公开(公告)号：US07712213B2

    公开(公告)日：2010-05-11

    申请号：US11606961

    申请日：2006-12-01

    Applicant: Michael J. Karmazyn

    Inventor： Michael J. Karmazyn

    IPC: H01R43/00 ,  H05K13/00 ,  H05K3/36 ,  H05K3/30 ,  B28B1/00 ,  B32B15/00

    CPC classification number: B29C45/14655 ,  B29C45/0046 ,  B29C45/14467 ,  B29C45/34 ,  B29C45/568 ,  H05K1/144 ,  H05K3/284 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09145 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T428/24917

    Abstract: A method is provided for making an encapsulated stack of circuit boards. The method includes assembling the stack of circuit boards from a plurality of circuit boards, the circuit boards being spaced apart from each other; inserting the stack into an internal volume of a shell, the shell having a first end and a second end opposite the first end, an input orifice adjacent the first end, and an output orifice adjacent the second end and on a side opposite the input orifice; positioning the shell such that the input orifice is at a lowest point of any part of the internal volume of the shell, and such that the output orifice is at a highest point of any part of the internal volume of the shell; angling the shell relative to horizontal; and injecting an encapsulating compound into the input orifice to fill the internal volume of the shell with the encapsulating compound.

    Abstract translation: 提供了一种用于制造电路板的封装的堆叠的方法。 该方法包括从多个电路板组装电路板堆叠，电路板彼此间隔开; 将所述堆叠插入壳体的内部容积中，所述壳体具有与所述第一端相对的第一端和第二端，邻近所述第一端的输入孔，以及邻近所述第二端和与所述输入孔相对的一侧的输出孔 ; 定位壳体使得输入孔口位于壳体的内部体积的任何部分的最低点处，并且使得输出孔口处于壳体的内部体积的任何部分的最高点; 相对于水平方向倾斜壳体; 以及将封装化合物注入所述输入孔以用所述封装化合物填充所述壳的内部体积。

    Semiconductor device and memory card using the same
    138.
    发明授权
    Semiconductor device and memory card using the same 有权
    半导体器件和存储卡使用相同

    公开(公告)号：US07679174B1

    公开(公告)日：2010-03-16

    申请号：US11691716

    申请日：2007-03-27

    Applicant: Takashi Okada ,  Kiyokazu Okada ,  Akinori Ono ,  Taku Nishiyama

    Inventor： Takashi Okada ,  Kiyokazu Okada ,  Akinori Ono ,  Taku Nishiyama

    IPC: H01L23/02

    CPC classification number: H05K1/0256 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0761 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2203/0228 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.

    Abstract translation: 电路板具有设置在其外部形状的至少一侧的弯曲部分。 外部连接端子设置在电路板的第一主表面上。 半导体元件安装在电路板的第二主表面上。 第一布线网络设置在除了第一主表面上的端子区域之外的区域中。 第二配线网络设置在第二主表面上。 从包括弯曲部分到第一布线网络的一侧的距离大于从另一侧至第一布线网络中的至少一个的距离，并且从包括弯曲部分到第二布线网络的一侧的距离大于距离 至少一个对方到第二布线网络。

Patent Agency Ranking