公开(公告)号：US20130078825A1

公开(公告)日：2013-03-28

申请号：US13611592

申请日：2012-09-12

Applicant: Richard Mark Wain

Inventor： Richard Mark Wain

IPC: H01R12/52 ,  H05K3/36

CPC classification number: H05K3/366 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09063 ,  H05K2201/09163 ,  H05K2201/09781 ,  H05K2203/167 ,  Y10T29/49126

Abstract: There is provided a first, connecting printed circuit board (PCB) and a second, receiving PCB and a method for connecting the first and second PCBs. The first PCB has three projections or prongs extending from the main body of the PCB. The second PCB has three holes into which the prongs of the first PCB can be inserted to provide a secure mechanical connection whilst the PCBs are soldered together.

Abstract translation: 提供了第一连接印刷电路板（PCB）和第二接收PCB以及用于连接第一和第二PCB的方法。 第一个PCB具有从PCB的主体延伸的三个突起或插脚。 第二个PCB有三个孔，第一个PCB的插脚可插入该孔中，以提供一个安全的机械连接，同时将PCB焊接在一起。

公开(公告)号：US20110090691A1

公开(公告)日：2011-04-21

申请号：US12579946

申请日：2009-10-15

Applicant: Joshua Josiah Markle ,  Robert Edward Higley

Inventor： Joshua Josiah Markle ,  Robert Edward Higley

IPC: F21S4/00 ,  F21V1/00 ,  H01J9/24

CPC classification number: F21K9/00 ,  F21V19/0055 ,  F21V29/76 ,  F21V29/763 ,  F21V29/85 ,  H01L25/0753 ,  H01L2224/48227 ,  H01L2924/19107 ,  H05K1/021 ,  H05K3/0058 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09163 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10409

Abstract: Lamp assemblies and methods of making the same are provided. Such a lamp assembly can include a heat sink and a light-emitting diode package that can be mounted to the heat sink. The light-emitting diode package can include a substrate with a top surface and bottom surface, a lens, and electrical contacts on the surface of the substrate. The lamp assembly can also include a printed circuit board with a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface. The printed circuit board can have electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package. The substrate of the light-emitting diode package can engage the opening of the printed circuit board to mechanically couple the light-emitting diode package to the printed circuit board. When assembled, a bottom surface of the substrate can be flush and aligned with a rear surface of the printed circuit board.

Abstract translation: 提供灯组件及其制造方法。 这种灯组件可以包括可以安装到散热器的散热器和发光二极管封装。 发光二极管封装可以包括具有顶表面和底表面的基板，透镜以及在基板表面上的电触点。 灯组件还可以包括具有面表面的印刷电路板，与表面相对的后表面和从表面延伸到后表面的开口。 印刷电路板可以在其上具有电接触以与发光二极管封装的电触点电连接。 发光二极管封装的基板可以接合印刷电路板的开口以将发光二极管封装机械耦合到印刷电路板。 当组装时，衬底的底表面可以与印刷电路板的后表面齐平并对齐。

公开(公告)号：US07919717B2

公开(公告)日：2011-04-05

申请号：US11161872

申请日：2005-08-19

Applicant: Todd L. Braman ,  Myles A. Koshiol

Inventor： Todd L. Braman ,  Myles A. Koshiol

IPC: H01R12/04 ,  H05K1/11 ,  H01K3/10

CPC classification number: H05K3/403 ,  H05K3/3405 ,  H05K3/366 ,  H05K3/4611 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/10446 ,  H05K2201/10727 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A three-dimensional PWB is provided that may include two or more layers stacked together forming a top surface, a bottom surface, and one or more side surfaces, and one or more solder pad situated on at least one of the one or more side surfaces. The one or more solder pads may include exposed voids in the one or more side surfaces. In some cases, the top surface and/or the bottom surface may have one or more solder pad. The one or more solder pads on at least one of the one or more side surfaces may be electrically connected to the one or more solder pads on the top surface and/or the bottom surface. In the illustrative PWB, the top surface and/or the bottom surface may be adapted to be mounted with an inertial sensor. The one or more side surfaces may be adapted to be mounted to a printed wiring board.

Abstract translation: 提供三维PWB，其可以包括层叠在一起的两层或更多层，形成顶表面，底表面和一个或多个侧表面，以及位于一个或多个侧表面中的至少一个侧表面上的一个或多个焊盘 。 一个或多个焊盘可以包括在一个或多个侧表面中的暴露的空隙。 在一些情况下，顶表面和/或底表面可以具有一个或多个焊盘。 一个或多个侧表面中的至少一个侧面上的一个或多个焊盘可以电连接到顶表面和/或底表面上的一个或多个焊盘。 在说明性的PWB中，顶表面和/或底表面可适于安装惯性传感器。 一个或多个侧表面可以适于安装到印刷电路板。

公开(公告)号：US20100006327A1

公开(公告)日：2010-01-14

申请号：US12260096

申请日：2008-10-29

Applicant: Cheng-Po Yu ,  Han-Pei Huang

Inventor： Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K1/11 ,  H05K1/00 ,  B29C35/08 ,  C04B35/00

CPC classification number: H05K1/11 ,  H05K1/0284 ,  H05K1/142 ,  H05K3/185 ,  H05K3/4007 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2203/1327 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: A circuit board structure including a circuit board main body and an injection molded three-dimensional circuit device encapsulating at least a portion of the circuit board main body is provided. The three-dimensional circuit device includes a molded plastic body having a non-plate type, stereo structure, on which a three-dimensional pattern is also fabricated. The three-dimensional pattern is interconnected with a contact pad on the circuit board main body through a conductive via.

Abstract translation: 提供一种包括电路板主体和封装有电路板主体的至少一部分的注射成型的三维电路装置的电路板结构。 三维电路装置包括具有非板型立体结构的模制塑料体，其上还制造三维图案。 三维图案通过导电通孔与电路板主体上的接触焊盘互连。

公开(公告)号：US07553162B2

公开(公告)日：2009-06-30

申请号：US11915349

申请日：2006-05-25

Applicant: Masaaki Isoda ,  Kazuhiro Takamura ,  Tokushi Yamauchi ,  Katsuyuki Kiyozumi ,  Nobumichi Nishihama

Inventor： Masaaki Isoda ,  Kazuhiro Takamura ,  Tokushi Yamauchi ,  Katsuyuki Kiyozumi ,  Nobumichi Nishihama

IPC: F21V21/00

CPC classification number: F21V29/56 ,  F21K9/00 ,  F21S2/005 ,  F21V19/0025 ,  F21V23/06 ,  F21Y2115/10 ,  H01R13/22 ,  H01R13/514 ,  H05K1/0204 ,  H05K1/142 ,  H05K1/183 ,  H05K2201/09163 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/209 ,  Y10S439/928

Abstract: The present invention relates to a socket for electronic component which contains an electronic component. The socket for electronic component comprises a platy base, containers formed to be concaved on a front face of the base and to contain LED packages therein, connectors provided on side faces and connected to other members, supports each of which supports and fixes the LED package contained in the container and electrically connected to the LED package, heat conductors each of which is provided continuously from a bottom face side of the container to a rear face of the base and contacts the LED package contained in the container so as to conduct heat generated by the LED package, and terminals electrically connected to the other members coupled with the connectors and the supports. The heat generated by the LED package is conducted to the rear face of the base through the heat conductors, and effectively radiated to an installation member on which the socket for electronic component is mounted.

Abstract translation: 本发明涉及一种包含电子部件的电子部件用插座。 用于电子部件的插座包括板状基座，形成为凹陷在基座的前表面上并容纳LED封装的容器，设置在侧面上并连接到其它构件的连接器，每个支撑件支撑并固定LED封装 容纳在容器中并电连接到LED封装的导热体，每个热导体从容器的底面侧连续地设置到基座的后表面，并与容纳在容器中的LED封装体接触，以便产生热量 通过LED封装，以及电连接到与连接器和支撑件耦合的其它构件的端子。 由LED封装产生的热量通过导热体传导到基座的后表面，并有效地辐射到安装有用于电子部件的插座的安装部件上。

公开(公告)号：US07525816B2

公开(公告)日：2009-04-28

申请号：US11606947

申请日：2006-12-01

Applicant: Youichi Sawachi

Inventor： Youichi Sawachi

IPC: H05K1/11

CPC classification number: H05K3/363 ,  H05K1/0212 ,  H05K3/3494 ,  H05K3/4691 ,  H05K2201/09063 ,  H05K2201/09163 ,  H05K2201/09781 ,  H05K2203/107 ,  H05K2203/163 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53274

Abstract: The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern and the second wiring pattern are electrically connected, wherein the first board includes: a board insertion opening in which the second board is inserted; and a first connection pattern provided inside the board insertion opening and electrically connected to the first wiring pattern, and the second board includes: an inserting portion to be inserted into the board insertion opening of the first board; and a second connection pattern provided at a position opposed to the first connection pattern and electrically connected to the second wiring pattern in the case where the inserting portion of the second board is inserted into the board insertion opening of the first board, and further comprising: solder or brazing filler metal applied at least to a surface of one of the first connection pattern and second connection pattern; and a heat generating device which generates heat by energization and melts the solder or the brazing filler metal to connect the first connection pattern with the second connection pattern.

Abstract translation: 本发明提供了一种布线板，其包括：第一布线图案的第一板和设置有第二布线图案的第二布线图案，同时第一布线图案和第二布线图案电连接，其中第一板包括：板插入 插入第二块板的开口; 以及第一连接图案，其设置在所述基板插入口的内部并电连接到所述第一布线图案，所述第二基板包括：插入到所述第一板的板插入口中的插入部; 以及第二连接图案，其设置在与所述第一连接图案相对的位置处并且在所述第二板的插入部插入到所述第一板的板插入口中的情况下电连接到所述第二布线图案，并且还包括： 至少施加到第一连接图案和第二连接图案中的一个的表面的焊料或钎料; 以及发热装置，其通过通电而产生热量并熔化所述焊料或所述钎料以将所述第一连接图案与所述第二连接图案连接。

公开(公告)号：US07497695B2

公开(公告)日：2009-03-03

申请号：US12071330

申请日：2008-02-20

Applicant: Shinji Uchida ,  Hiroshi Yamane ,  Akihito Funakoshi ,  Kazuto Miura

Inventor： Shinji Uchida ,  Hiroshi Yamane ,  Akihito Funakoshi ,  Kazuto Miura

IPC: H01R12/00

CPC classification number: H01R12/79 ,  H05K3/365 ,  H05K2201/09163

Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC has an elongated substrate, and plural conductors are laminated on a surface of the substrate for extending along an axial direction of the substrate. The printed wiring board has an insertion opening provided at an edge surface for being inserted by a top end portion of the FPC, and plural line connecting terminals formed on an internal wall surface of the insertion opening. The top end portion of the FPC has a slider including plural elastic deformable first contacts, and a first housing for holding the plurality of contacts. The FPC is inserted into the insertion opening of the printed wiring board such that one end of the first contact presses the conductor and the other end of the first contact presses the line connecting terminal. The FPC can be connected to the printed wiring board on an edge surface thereof, allowing circuit elements to be mounted in high density, and improving freedom in designing wiring patterns.

Abstract translation: 本发明涉及一种与FPC电连接的印刷电路板的连接结构。 FPC具有细长基板，并且多个导体层叠在基板的表面上，以沿着基板的轴向延伸。 印刷电路板具有设置在边缘表面处以由FPC的顶端部分插入的插入开口，以及形成在插入开口的内壁表面上的多个线连接端子。 FPC的顶端部具有滑动件，该滑块包括多个弹性变形的第一触点，以及用于保持多个触点的第一壳体。 FPC被插入到印刷线路板的插入口中，使得第一接触的一端压住导体，并且第一接触的另一端压入线路连接端子。 FPC可以在其边缘表面上连接到印刷线路板，从而允许电路元件以高密度安装，并提高设计布线图案的自由度。

公开(公告)号：US20090047802A1

公开(公告)日：2009-02-19

申请号：US12100294

申请日：2008-04-09

Applicant: TA-HSIANG YEN ,  YEN-HUNG HUANG ,  CHIH-MING LAI

Inventor： TA-HSIANG YEN ,  YEN-HUNG HUANG ,  CHIH-MING LAI

IPC: H01R12/00

CPC classification number: H05K1/142 ,  H05K2201/09163 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2203/167

Abstract: An illumination device using LEDs (101) has a circuit board and a plurality of LEDs disposed on the circuit board elements. The circuit board can be obtained by assembling a plurality of the circuit board elements (11) together. The circuit board element comprises a board (110) and an electric trace (1151) attached to the board. The board comprises a plurality of connecting units (111, 112, 113, 114) formed at lateral sides thereof. The circuit board element connects with an adjacent circuit board element via the connecting units. The electric trace extends from the board to the connecting units and electrically connects with the electric trace of the adjacent circuit board element.

Abstract translation: 使用LED（101）的照明装置具有布置在电路板元件上的电路板和多个LED。 可以通过将多个电路板元件（11）组装在一起来获得电路板。 电路板元件包括板（110）和连接到板的电迹线（1151）。 板包括形成在其横向侧面的多个连接单元（111,112,113,114）。 电路板元件通过连接单元与相邻的电路板元件连接。 电迹线从板延伸到连接单元，并与相邻电路板元件的电迹线电连接。

公开(公告)号：US07238044B2

公开(公告)日：2007-07-03

申请号：US10554693

申请日：2004-03-23

Applicant: Shinji Uchida ,  Hideyasu Yamada ,  Akihito Funakoshi

Inventor： Shinji Uchida ,  Hideyasu Yamada ,  Akihito Funakoshi

IPC: H01R12/24

CPC classification number: H01R12/79 ,  H01R13/025 ,  H01R13/05 ,  H05K3/365 ,  H05K3/4092 ,  H05K2201/09163

Abstract: An FPC is electrically connected to a printed wiring board. The FPC includes an elongated substrate and a conductor part laminated on the face of the substrate. The conductor part includes a plurality of conductors extending along the axial direction of the substrate, and elastically deformable first contact terminals each of which extends from the face of the conductors toward the base end of the FPC. The printed wiring board includes an insertion opening formed at the edge surface thereof, and plural line connecting terminals which are formed on the internal wall surface of the insertion opening, and which extend in the inserting direction for inserting the FPC.

Abstract translation: FPC与印刷电路板电连接。 FPC包括细长基板和层压在基板的表面上的导体部分。 导体部分包括沿着基板的轴向延伸的多个导体，以及可弹性变形的第一接触端子，每个接触端子从导体的表面延伸到FPC的基端。 印刷电路板包括形成在其边缘表面处的插入孔和形成在插入开口的内壁表面上并且在插入FPC的插入方向上延伸的多个线连接端子。

公开(公告)号：US20050018410A1

公开(公告)日：2005-01-27

申请号：US10624063

申请日：2003-07-21

Applicant: Scott Brandenburg ,  Thomas Degenkolb

Inventor： Scott Brandenburg ,  Thomas Degenkolb

IPC: H01R13/66 ,  H01R31/06 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/40 ,  H05K7/06

CPC classification number: H05K3/4092 ,  H01R13/6658 ,  H01R31/065 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/184 ,  H05K3/284 ,  H05K2201/086 ,  H05K2201/09163 ,  H05K2201/09754 ,  H05K2201/10924

Abstract: A printed circuit board (PCB) assembly includes a PCB and a first integrated conductive bus structure extending from a first edge of the PCB. The PCB connects a plurality of electronic components and includes a plurality of conductive layers, each separated by a non-conductive layer. The first integrated conductive bus structure includes a first portion that extends from the first edge of the PCB and which forms a plurality of electrically separate contacts of a connector. A second portion of the bus structure is integrated within the PCB and couples each of the contacts to at least one conductive trace of the PCB through plated holes.

Abstract translation: 印刷电路板（PCB）组件包括PCB和从PCB的第一边缘延伸的第一集成导电总线结构。 PCB连接多个电子部件，并且包括多个导电层，每个导电层由非导电层隔开。 第一集成导电总线结构包括从PCB的第一边缘延伸并且形成连接器的多个电分离触点的第一部分。 总线结构的第二部分集成在PCB内，并且通过电镀孔将每个触点耦合到PCB的至少一个导电迹线。