公开(公告)号：US20130188361A1

公开(公告)日：2013-07-25

申请号：US13749070

申请日：2013-01-24

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Shigetsugu MURAMATSU ,  Hiroshi SHIMIZU ,  Yasuyoshi HORIKAWA

IPC: H05K7/20 ,  H05K3/46 ,  F21V7/00

CPC classification number: H05K7/2039 ,  F21K9/90 ,  F21V7/00 ,  H01L2224/16225 ,  H05K1/0274 ,  H05K1/056 ,  H05K3/3452 ,  H05K3/46 ,  H05K2201/0191 ,  H05K2201/09409 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating layer on the heat sink; first and second wiring patterns on the insulating layer to be separated from each other at a certain interval; a first reflective layer including a first opening on the insulating layer so as to cover the first and second wiring patterns, wherein a portion of the first and second wiring patterns is exposed from the first opening, and wherein the portion of the first and second wiring patterns is defined as a mounting region on which a light emitting element is to be mounted; and a second reflective layer on the insulating layer, wherein the second reflective layer is interposed between the first and second wiring patterns. A thickness of the second reflective layer is smaller than that of the first reflective layer.

Abstract translation: 提供了布线基板。 布线基板包括：散热器; 散热器上的绝缘层; 绝缘层上的第一和第二布线图案以一定间隔彼此分离; 第一反射层，包括在绝缘层上的第一开口，以覆盖第一和第二布线图案，其中第一和第二布线图案的一部分从第一开口露出，并且其中第一和第二布线的部分 图案被定义为要安装发光元件的安装区域; 以及在绝缘层上的第二反射层，其中第二反射层介于第一和第二布线图案之间。 第二反射层的厚度小于第一反射层的厚度。

公开(公告)号：US08475210B2

公开(公告)日：2013-07-02

申请号：US13210605

申请日：2011-08-16

Applicant: Chien-Chiung Wang ,  Xue-Liang Zhang ,  Qing-Man Zhu

Inventor： Chien-Chiung Wang ,  Xue-Liang Zhang ,  Qing-Man Zhu

IPC: H01R13/648

CPC classification number: H01R24/62 ,  H01R12/57 ,  H01R13/6471 ,  H01R13/6658 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09409

Abstract: An electrical connector comprises a PCB (220) having a front edge to be inserted into a mating receptacle. The PCB comprises a top face having a row of first mating pads (242), and an opposite bottom face having a row of second mating pads (262) and a row of third mating pads (264) behind the second row of mating pads. The first and second mating pads are compatibly fit with an SFP receptacle (120). The PCB comprises a first sub-PCB (540) having a first outer layer containing the first mating pads and an opposite second outer layer containing the second mating pads, and a second sub-PCB (560) attached to the second outer layer on an area behind the second mating pads, the second sub-PCB having a second outer layer containing the third mating pads.

Abstract translation: 电连接器包括具有插入配合插座的前边缘的PCB（220）。 PCB包括具有一排第一配对焊盘（242）的顶面和相对的底面，其具有在第二排匹配焊盘后面的一排第二配合焊盘（262）和一排第三配合焊盘（264）。 第一和第二配合垫与SFP插座（120）兼容地配合。 PCB包括第一子PCB（540），第一子PCB（540）具有包含第一配对焊盘的第一外层和包含第二配对焊盘的相对的第二外层，以及附接到第二外部层的第二子PCB（560） 区域在第二匹配垫后面，第二子PCB具有包含第三配合垫的第二外层。

公开(公告)号：US20130077270A1

公开(公告)日：2013-03-28

申请号：US13678115

申请日：2012-11-15

Applicant: Hyo-Jae BANG ,  Dogeun KIM ,  Hongkyun KIM ,  Youngbok JEON

Inventor： Hyo-Jae BANG ,  Dogeun KIM ,  Hongkyun KIM ,  Youngbok JEON

IPC: H05K1/11 ,  H05K13/00 ,  H05K3/30 ,  H01R13/00 ,  H05K7/02 ,  H05K3/10

CPC classification number: H05K5/0026 ,  G06F1/18 ,  G06F1/185 ,  G06K7/0047 ,  H01R12/57 ,  H01R12/721 ,  H01R13/00 ,  H01R23/70 ,  H01R27/00 ,  H05K1/0295 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3405 ,  H05K7/02 ,  H05K13/00 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10S439/946 ,  Y10S439/951 ,  Y10T29/49124 ,  Y10T29/49147

Abstract: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.

Abstract translation: 示例性实施例涉及电路板，连接器，外壳，电路板组件，壳体组件，其制造方法及其制造方法，这对于至少两种不同的形状因子是共同的。

公开(公告)号：US08323037B2

公开(公告)日：2012-12-04

申请号：US13197368

申请日：2011-08-03

Applicant: Su-Hyun Cha ,  Junghoon Kim ,  Seongchan Han

Inventor： Su-Hyun Cha ,  Junghoon Kim ,  Seongchan Han

IPC: H01R12/00

CPC classification number: H05K1/117 ,  H01L23/13 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K2201/09145 ,  H05K2201/09409 ,  H05K2201/09845 ,  H05K2201/1059 ,  H01L2924/00

Abstract: Example embodiments relate to semiconductor modules and semiconductor devices including the same. The semiconductor module may include a board, a plurality of semiconductor chips, a plurality of first taps, and a plurality of second taps. The board may include a chip region, a first tap region, and a second tap region. The first tap region of the board may have a first width that extends in a thickness direction of the board. The second tap region may have a second width that is less than the first width. The second tap region may be disposed under the first tap region. The semiconductor chips may be mounted in the chip region of the board. The first taps may be disposed in the first tap region, and the second taps may be disposed in the second tap region. The first and second taps may be configured to transmit/receive an electric signal to/from the plurality of semiconductor chips.

Abstract translation: 示例性实施例涉及包括其的半导体模块和半导体器件。 半导体模块可以包括板，多个半导体芯片，多个第一抽头和多个第二抽头。 板可以包括芯片区域，第一分接区域和第二分接区域。 板的第一分接区域可以具有沿着板的厚度方向延伸的第一宽度。 第二抽头区域可以具有小于第一宽度的第二宽度。 第二抽头区域可以设置在第一抽头区域下方。 半导体芯片可以安装在板的芯片区域中。 第一抽头可以设置在第一抽头区域中，并且第二抽头可以设置在第二抽头区域中。 第一和第二抽头可以被配置为向/从多个半导体芯片发送/接收电信号。

公开(公告)号：US08267728B2

公开(公告)日：2012-09-18

申请号：US12991442

申请日：2010-04-08

Applicant: Toshiyuki Nakaie ,  Hirotsugu Fusayasu ,  Shouichi Mimura ,  Masafumi Kumoi ,  Ryo Matsubara

Inventor： Toshiyuki Nakaie ,  Hirotsugu Fusayasu ,  Shouichi Mimura ,  Masafumi Kumoi ,  Ryo Matsubara

IPC: H01R24/00

CPC classification number: H01R13/6467 ,  H01R12/724 ,  H01R13/6471 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10825

Abstract: A receptacle includes a signal terminal, a ground terminal, and a signal terminal. A second portion of the ground terminal is distanced from a first portion of the signal terminal in an extension direction. A third portion of the signal terminal is distanced from the first portion of the signal terminal in the extension direction.

Abstract translation: 插座包括信号端子，接地端子和信号端子。 接地端子的第二部分在延伸方向上远离信号端子的第一部分。 信号端子的第三部分在延伸方向上远离信号端子的第一部分。

公开(公告)号：US20120230700A1

公开(公告)日：2012-09-13

申请号：US13045972

申请日：2011-03-11

Applicant: Luca Cafiero ,  Zhiping Yang ,  Victor Odisho ,  Francisco Matus

Inventor： Luca Cafiero ,  Zhiping Yang ,  Victor Odisho ,  Francisco Matus

IPC: H04B10/00

CPC classification number: G02B6/4201 ,  H05K1/117 ,  H05K2201/09409 ,  H05K2201/10121

Abstract: A small form-factor pluggable (SFP) module includes a board with an end portion to be inserted into a connector device. A first set of signal pads is arranged along an edge of a first surface of the SFP board at the end portion and a second set of signal pads along an edge of a second surface of the SFP board at the end portion. A third set of signal pads is disposed on the second surface at the end portion, offset from the edge of the second surface. A transceiver, coupled to the signal pads of the first, second, and third sets of signal pads, is configured to transmit and receive signals via the third set of signal pads and to transmit and receive signals via at least one of the first and second sets of signal pads.

Abstract translation: 小尺寸可插拔（SFP）模块包括具有插入连接器装置的端部的板。 第一组信号焊盘沿端部的SFP板的第一表面的边缘和沿端部的SFP板的第二表面的边缘的第二组信号焊盘排列。 第三组信号垫设置在端部处的第二表面上，偏离第二表面的边缘。 耦合到第一，第二和第三组信号焊盘的信号焊盘的收发器被配置成经由第三组信号焊盘发送和接收信号，并且经由第一和第二信号焊盘中的至少一个来发送和接收信号 套信号垫。

公开(公告)号：US08130504B2

公开(公告)日：2012-03-06

申请号：US12749255

申请日：2010-03-29

Applicant: Akira Muto ,  Tomokazu Tanaka

Inventor： Akira Muto ,  Tomokazu Tanaka

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H01R12/79 ,  H05K1/0219 ,  H05K1/0237 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09618 ,  H05K2201/09727 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A method of manufacturing a flexible printed circuit board having an insulation layer, a first signal wiring layer including a microstrip line, a second signal wiring layer including a signal connection terminal for allowing the microstrip line to connect the exterior connector electrically, and a ground conductive section having a ground connection terminal for connecting the exterior connector. The microstrip line and the signal connection terminal are connected to each other by a wiring via hole. The wiring via hole passes through the insulation layer, the first signal wiring layer, and the second signal wiring layer. The microstrip line has a taper section which gradually enlarges a width of the microstrip line toward the wiring via hole in the vicinity of the wiring via hole. The ground conductive section that corresponds to the microstrip line has a taper section with a shape matching the taper section of the microstrip line.

Abstract translation: 一种制造具有绝缘层的柔性印刷电路板的方法，包括微带线的第一信号布线层，包括用于允许微带线电连接外部连接器的信号连接端子的第二信号布线层和接地导电 具有用于连接外部连接器的接地连接端子。 微带线和信号连接端子通过布线孔相互连接。 布线通孔穿过绝缘层，第一信号布线层和第二信号布线层。 微带线具有锥形部，其在布线通孔附近逐渐扩大微带线的宽度朝向布线通孔。 对应于微带线的接地导电部分具有与微带线的锥形部分匹配的形状的锥形部分。

公开(公告)号：US08081285B2

公开(公告)日：2011-12-20

申请号：US11227018

申请日：2005-09-15

Applicant: Masanori Yumoto ,  Yoshihisa Hirano

Inventor： Masanori Yumoto ,  Yoshihisa Hirano

IPC: G02F1/1345

CPC classification number: G02F1/13452 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09727

Abstract: A mounting structure includes a first substrate that has a first surface and a second surface, a plurality of first connection terminals that are disposed on the first surface in a first direction, a plurality of second connection terminals that are disposed on the first surface in a second direction perpendicular to the first direction and that are disposed at predetermined gaps from the first connection terminals, a plurality of connection wiring lines that are disposed on the second surface, each having first portions that overlap the first and second connection terminals in plan view and a second portion that is formed to have a width narrower than those of the first and second connection terminals in the first direction, a plurality of through holes that pass through the first substrate so as to correspondingly connect the second connection terminals to the connection wiring lines, and a second substrate that has a plurality of third connection terminals correspondingly connected to the first and second connection terminals and correspondingly overlap the first and second connection terminals in plan view.

Abstract translation: 安装结构包括具有第一表面和第二表面的第一基板，在第一方向上设置在第一表面上的多个第一连接端子，多个第一连接端子，其设置在第一表面上 第二方向垂直于第一方向并且设置在距第一连接端子的预定间隙处;多个连接布线，其布置在第二表面上，每个连接布线具有在俯视图中与第一和第二连接端子重叠的第一部分， 第二部分形成为具有比第一和第二连接端子在第一方向的宽度窄的宽度;多个通孔，其穿过第一基板，以将第二连接端子相应地连接到连接布线 以及具有相应连接的多个第三连接端子的第二基板 到第一和第二连接端子，并且在平面图中相应地重叠第一和第二连接端子。

公开(公告)号：US20100175251A1

公开(公告)日：2010-07-15

申请号：US12749255

申请日：2010-03-29

Applicant: Akira MUTO ,  Tomokazu TANAKA

Inventor： Akira MUTO ,  Tomokazu TANAKA

IPC: H05K3/10

CPC classification number: H05K1/118 ,  H01R12/79 ,  H05K1/0219 ,  H05K1/0237 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09618 ,  H05K2201/09727 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A flexible printed circuit board has an insulation layer, a first signal wiring layer including a microstrip line, a second signal wiring layer including a signal connection terminal for allowing the microstrip line to connect the exterior connector electrically, and a ground conductive section having a ground connection terminal for connecting the exterior connector. The microstrip line and the signal connection terminal are connected to each other by a wiring via hole. The wiring via hole passes through the insulation layer, the first signal wiring layer, and the second signal wiring layer. The microstrip line has a taper section which gradually enlarges a width of the microstrip line toward the wiring via hole in the vicinity of the wiring via hole. The ground conductive section that corresponds to the microstrip line has a taper section with a shape matching the taper section of the microstrip line.

Abstract translation: 柔性印刷电路板具有绝缘层，包括微带线的第一信号布线层，包括用于允许微带线将外部连接器电连接的信号连接端子的第二信号布线层和具有地面的接地导电部分 用于连接外部连接器的连接端子。 微带线和信号连接端子通过布线孔相互连接。 布线通孔穿过绝缘层，第一信号布线层和第二信号布线层。 微带线具有锥形部，其在布线通孔附近逐渐扩大微带线的宽度朝向布线通孔。 对应于微带线的接地导电部分具有与微带线的锥形部分匹配的形状的锥形部分。

公开(公告)号：US07688594B2

公开(公告)日：2010-03-30

申请号：US11586209

申请日：2006-10-24

Applicant: Akira Muto ,  Tomokazu Tanaka

Inventor： Akira Muto ,  Tomokazu Tanaka

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H01R12/79 ,  H05K1/0219 ,  H05K1/0237 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09618 ,  H05K2201/09727 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A flexible printed circuit board has an insulation layer, a first signal wiring layer including a microstrip line, a second signal wiring layer including a signal connection terminal for allowing the microstrip line to connect the exterior connector electrically, and a ground conductive section having a ground connection terminal for connecting the exterior connector. The microstrip line and the signal connection terminal are connected to each other by a wiring via hole. The wiring via hole passes through the insulation layer, the first signal wiring layer, and the second signal wiring layer. The microstrip line has a taper section which gradually enlarges a width of the microstrip line toward the wiring via hole in the vicinity of the wiring via hole. The ground conductive section that corresponds to the microstrip line has a taper section with a shape matching the taper section of the microstrip line.

Abstract translation: 柔性印刷电路板具有绝缘层，包括微带线的第一信号布线层，包括用于允许微带线将外部连接器电连接的信号连接端子的第二信号布线层和具有地面的接地导电部分 用于连接外部连接器的连接端子。 微带线和信号连接端子通过布线孔相互连接。 布线通孔穿过绝缘层，第一信号布线层和第二信号布线层。 微带线具有锥形部，其在布线通孔附近逐渐扩大微带线的宽度朝向布线通孔。 对应于微带线的接地导电部分具有与微带线的锥形部分匹配的形状的锥形部分。