公开(公告)号：US12120822B2

公开(公告)日：2024-10-15

申请号：US17870555

申请日：2022-07-21

Applicant: MONOLITHIC POWER SYSTEMS, INC.

Inventor： Daocheng Huang ,  Xinmin Zhang ,  Yishi Su ,  Yingxin Zhou ,  Wenyang Huang

IPC: H05K1/18 ,  H02M3/158

CPC classification number: H05K1/185 ,  H05K1/181 ,  H02M3/158 ,  H05K2201/10053 ,  H05K2201/10378

Abstract: A power module has a printed circuit board (PCB) having an output inductor substrate layer and an output capacitor substrate layer. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on a surface of the power module. Output voltages of the power converters are provided at output voltage nodes. The power converters include output inductors that are embedded within the output inductor substrate layer and output capacitors that are embedded within the output capacitor substrate layer. Embedded output inductors and capacitors are connected to corresponding output voltage nodes.

公开(公告)号：US20240339823A1

公开(公告)日：2024-10-10

申请号：US18629256

申请日：2024-04-08

Applicant: HS Elektronik Systeme GmbH

Inventor： Stefan Schreitmueller ,  Denny Friese

IPC: H02H3/08 ,  B64D47/00 ,  H05K1/18

CPC classification number: H02H3/08 ,  B64D47/00 ,  H05K1/18 ,  H05K2201/10053

Abstract: An electric fuse for an aircraft solid-state power controller comprising at least one electric conductor, which is connected between an electric input terminal and an electric output terminal, and which is configured to blow when an electric current (I) flowing through the at least one electric conductor exceeds a predefined threshold (Imax). The at least one electric conductor is encapsulated in a potting and at least one outer surface of the potting is covered with a polymeric coating.

公开(公告)号：US20240324695A1

公开(公告)日：2024-10-03

申请号：US18738083

申请日：2024-06-10

Applicant: Japan Tobacco Inc.

Inventor： Keiji MARUBASHI ,  Minoru KITAHARA

IPC: A24F40/60 ,  A24F40/10 ,  A24F40/20 ,  A24F40/30 ,  A24F40/57 ,  H05K1/02 ,  H05K1/18

CPC classification number: A24F40/60 ,  A24F40/10 ,  A24F40/57 ,  H05K1/028 ,  H05K1/189 ,  A24F40/20 ,  A24F40/30 ,  H05K2201/10053

Abstract: A power supply unit for an aerosol generating device, the power supply unit includes: a power supply; a controller configured to control supply of electric power from the power supply to an atomizer that atomizes an aerosol source; a flexible circuit substrate; and a switch operable by a user and electrically connected to the controller. The switch is directly mounted on the flexible circuit substrate.

公开(公告)号：US20240314926A1

公开(公告)日：2024-09-19

申请号：US18122891

申请日：2023-03-17

Applicant: Infineon Technologies Austria AG

Inventor： Luca Peluso ,  Kushal Kshirsagar ,  Paul Yeaman ,  Anil Jeswani ,  Marco Pennetti ,  Kok Yau Chua

IPC: H05K1/02 ,  H01L23/50 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0262 ,  H01L23/50 ,  H05K1/0201 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10227

Abstract: A voltage regulator module includes: a substrate having power input and output terminals; a power stage package mounted to the substrate and having first and second pads at a side facing away from the substrate, the power stage package configured to receive an input voltage from the power input terminal and output a phase current at the first pad; an inductor having a vertical conductor embedded in a magnetic core, the vertical conductor having a first end attached to the first pad of the power stage package and an opposite second end; and a metallic clip attached to each of the second end of the vertical conductor, the power output terminal, and the second pad of the power stage package. The second pad of the power stage package does not carry any of the phase current.

公开(公告)号：US20240285847A1

公开(公告)日：2024-08-29

申请号：US18571520

申请日：2022-06-22

Applicant: T.J.Smith and Nephew,Limited

Inventor： Allan Kenneth Frazer Grugeon Hunt ,  Daniel Jorna ,  Jaime Owst ,  Felix Clarence Quintanar ,  Neil Andrew Ramsbottom ,  Liam Bradley James Thomson

IPC: A61M1/00 ,  H05K1/18

CPC classification number: A61M1/962 ,  H05K1/181 ,  A61M2205/15 ,  A61M2205/18 ,  A61M2205/3317 ,  A61M2205/3368 ,  A61M2205/50 ,  A61M2205/8206 ,  H05K2201/10053 ,  H05K2201/10151

Abstract: The approaches described herein can provide mitigation against the risk of one or more malfunctions of electronics of a negative pressure wound therapy device. The one or more malfunctions can include flow reverse current, flow of excessive current, liquid ingress, or inadvertent activation. The approaches described herein can provide protection against a single fault (or higher protection against more than one fault). Advantageously, mitigation against the risk of burning or otherwise causing discomfort to the patient or the risk of fire can be provided.

公开(公告)号：US20240206049A1

公开(公告)日：2024-06-20

申请号：US18541849

申请日：2023-12-15

Applicant: Valmet Automotive EV Power Oy

Inventor： Juuso Kelkka ,  Toni Karsikas

IPC: H05K1/02 ,  G01R19/165 ,  H05K3/34

CPC classification number: H05K1/0263 ,  G01R19/16571 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/10053 ,  H05K2201/10272

Abstract: Disclosed is a printed circuit board (PCB) for load switching between an electric power supply and one or more loads. The PCB comprises a PCB body, a busbar embedded into the PCB body for acting as a heat sink and one or more switches for the load switching, wherein the one or more switches are coupled to the busbar for routing an electric current for the load switching through the busbar.

公开(公告)号：US12010799B2

公开(公告)日：2024-06-11

申请号：US16449761

申请日：2019-06-24

Applicant: Black & Decker Inc.

Inventor： Joshua M. Lewis ,  Michael D. Grove

IPC: H02K7/14 ,  B25B21/02 ,  B25F5/02 ,  H01H9/54 ,  H01H13/14 ,  H01H13/52 ,  H01H21/24 ,  H02K11/30 ,  H02K11/33 ,  H02K23/18 ,  H02M7/48 ,  H02P6/14 ,  H02P6/16 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K1/181 ,  B25B21/02 ,  B25F5/02 ,  H01H9/54 ,  H01H13/14 ,  H01H13/52 ,  H01H21/24 ,  H02K7/145 ,  H02K11/33 ,  H02K23/18 ,  H02M7/48 ,  H02P6/14 ,  H02P6/16 ,  H05K1/0206 ,  H05K1/112 ,  H05K1/115 ,  H05K7/2039 ,  H01H2013/525 ,  H01H2231/048 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10545

Abstract: An electronic module is provided including a circuit board defining a longitudinal axis and having a first surface and a second surface. A module housing is provided having a bottom surface and side walls extending from the bottom surface to form an open face through which the circuit board is received. Power switches configured as an inverter circuit to drive an electric motor are mounted on the second surface of the circuit board facing the bottom surface of the module housing, and a series of heat sinks are discretely mounted on the first surface of the circuit board facing the open face opposite the power switches. Potting material is disposed in the distance between the circuit board and the bottom surface of the module housing to cover the power switches. Thermal vias are disposed through the circuit board between corresponding ones of the heat sinks and the power switches.

公开(公告)号：US11961686B2

公开(公告)日：2024-04-16

申请号：US17602799

申请日：2020-04-17

Applicant: KANDA KOGYO CO., LTD.

Inventor： Haruki Tamamizu ,  Takashi Nakano ,  Tadayoshi Kikuchi ,  Misaki Doi

IPC: H01H13/12 ,  H05K1/18

CPC classification number: H01H13/12 ,  H01H2209/002 ,  H01H2227/032 ,  H05K1/18 ,  H05K2201/10037 ,  H05K2201/10053

Abstract: An irreversible power switch which is operational from the outside after lamination of laminated communication device and the like, includes a substrate, electrodes disposed on the substrate, a brittle member disposed so as to face the electrodes and apart from the electrodes and a conductive adhesive portion disposed on the brittle member at a side to face the electrodes thereof. The electrodes and the conductive adhesive portion are irreversibly and electrically bonded by brittle fracture of the brittle member under the external pressing force in the thickness direction of the laminated communication device.

公开(公告)号：US11917762B2

公开(公告)日：2024-02-27

申请号：US17694720

申请日：2022-03-15

Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.

Inventor： Chih-Ming Lai ,  Yung-Shun Kao

IPC: H05K5/02 ,  H05K1/18 ,  H01H13/14 ,  H01H13/20

CPC classification number: H05K1/181 ,  H01H13/14 ,  H01H13/20 ,  H05K2201/10053

Abstract: A circuit board module includes a circuit board body, a connector, a press button, a bracket, and a linkage. The connector includes a base and a rotating button rotatably disposed on the base. The press button is located away from the connector. The bracket includes a first limiting portion. The linkage is located between the rotating button and the press button and includes a second limiting portion corresponding to the first limiting portion, a first segment, and a second segment linked to the first segment. The first segment extends along a first axis and is linked to the rotating button. The second segment extends along a second axis and is linked to the press button. One of the second limiting portion and the first limiting portion extends along the first axis. The first segment is movably disposed on the bracket along the first axis.

公开(公告)号：US11909275B2

公开(公告)日：2024-02-20

申请号：US18327000

申请日：2023-05-31

Applicant: Nidec Motor Corporation

Inventor： Chetan O. Modi ,  Steven R. Palmer ,  Daniel E. Bailey ,  Jared Joseph Lesicko

IPC: H02K11/33 ,  H05K5/00 ,  H05K1/14 ,  H05K1/18 ,  H02K5/22 ,  H02K11/28

CPC classification number: H02K11/33 ,  H02K5/225 ,  H02K11/28 ,  H05K1/144 ,  H05K1/18 ,  H05K5/0069 ,  H02K2211/03 ,  H02K2213/12 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10189

Abstract: A motor assembly includes a motor, a controller controlling at least one aspect of operation of the motor, and a control housing defining a control chamber. The controller is in part received within the control chamber. The controller includes a main electronics board and a modular connector assembly. The modular connector assembly includes a secondary electronics board and a connector at least in part supporting the secondary electronics board. The connector includes an inner connector portion and an outer connector portion. The connector extends through the control housing such that the inner connector portion is disposed inside the control chamber and the outer connector portion is disposed outside the control chamber. The outer connector portion defines a first access portal facilitating access to a first component of the secondary electronics board.