公开(公告)号：US12120821B2

公开(公告)日：2024-10-15

申请号：US17920960

申请日：2021-04-26

Applicant: Ennovi Industries, Inc.

Inventor： Richard Schneider ,  Richard A. Johannes

IPC: H05K1/14 ,  H01R12/52 ,  H01R12/62 ,  H01R12/91 ,  H05K3/36

CPC classification number: H05K1/148 ,  H01R12/52 ,  H01R12/62 ,  H01R12/91 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/10598 ,  H05K2203/167

Abstract: A jumper assembly for connecting together first and second circuit boards. The jumper assembly includes a frame secured to a flexible circuit having a plurality of conductive traces. The frame includes a bridge that connects together first and second side structures, each having a window and a moveable lever. The first side structure is secured over the first circuit board and the second side structure is secured over the second circuit board. First end portions of the traces of the flexible circuit are secured to contact pads of the first circuit board, while second end portions of the traces of the flexible circuit are secured to contact pads of the second circuit board. The bridge of the frame is removed after the jumper assembly is secured to the first and second circuit boards.

公开(公告)号：US20240105639A1

公开(公告)日：2024-03-28

申请号：US17951978

申请日：2022-09-23

Applicant: Apple Inc.

Inventor： Helia Rahmani ,  Stephane J. Marcadet ,  Scott J. Campbell ,  Zhiyong C. Xia ,  Stephen V. Jayanathan ,  Vineet Negi ,  Christian Kettenbeil

IPC: H01L23/00 ,  H01L23/053 ,  H05K1/18 ,  H05K5/00

CPC classification number: H01L23/562 ,  H01L23/053 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0091 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10734

Abstract: Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.

公开(公告)号：US20230343674A1

公开(公告)日：2023-10-26

申请号：US18215854

申请日：2023-06-29

Applicant: Vitesco Technologies GmbH

Inventor： Jens Reiter ,  Rico Hartmann ,  Christian Lammel

IPC: H01L23/40 ,  H05K1/18

CPC classification number: H01L23/4006 ,  H05K1/18 ,  H01L2023/4062 ,  H01L2023/405 ,  H01L2023/4087 ,  H05K2201/10598 ,  H01L25/115

Abstract: A method provides a circuit carrier arrangement that includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

公开(公告)号：US20180020541A1

公开(公告)日：2018-01-18

申请号：US15546239

申请日：2016-01-26

Applicant: Nederlandes Organisastie voor toegepast-natuurwetenschappelijk onderzoek TNO ,  MAS Active Trading (Private) Limited

Inventor： Margaretha Maria de Kok ,  Gerardus Titus van Heck ,  Jeroen van den Brand ,  Arachchige Tharindu Niroshan Athauda ,  Vivek Vashdev Ramchandani ,  Mudiyanselage Praneeth Maheeka Weerasekara

IPC: H05K1/03 ,  H01R12/77 ,  H05K1/18

CPC classification number: H05K1/038 ,  H01R12/77 ,  H05K1/189 ,  H05K3/365 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10598

Abstract: A device module (100) and method for connection to a textile fabric (50) with electrically conductive threads (51, 52) to provide a fabric layer assembly (150). The device module (100) comprises a flexible foil (10) and a thermoplastic layer (20) to enable a mechanical connection (M) between the flexible foil (10) and the textile fabric (50). The device module (100) has an outer circumference (C) comprising inward notches (N1,N2) configured as anchor points for respective conductive threads (51, 52) for holding and guiding the conductive threads (51,52) over and in contact with the respective conductive areas (11, 12) for providing the respective electrical connections (E1,E2) while the mechanical connection (M) by the thermoplastic layer (20) is established.

公开(公告)号：US09829189B2

公开(公告)日：2017-11-28

申请号：US15303522

申请日：2014-12-13

Applicant: SHENZHEN TCL NEW TECHNOLOGY CO., LTD

Inventor： Jie Lin ,  Kewen Qiang ,  Xiehe Zhong

IPC: F21V29/70 ,  F21V23/00 ,  F21V29/80 ,  F21V19/00 ,  F21Y115/10

CPC classification number: F21V29/70 ,  F21V19/0025 ,  F21V23/00 ,  F21V29/80 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  H05K1/0203 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/10598 ,  H05K2201/10878

Abstract: The present disclosure provides a LED module. The LED module includes a LED lamp, a heat radiator, and a PCB. The LED lamp includes a LED main body, and a heat conducting block and a pin configured to the main body. The heat conducting block is mounted on the bottom surface of the LED main body towards the PCB. The pin has a free end passing through the PCB, and electrically connecting a bonding pad of the PCB. The heat radiator is caught between the heat conducting block and the PCB, and the heat conducting block resists against the heat radiator. A display device is also provided. The heat introduced by the LED lamp can directly dissipate from the heat conducting block to the heat radiator, thus enhancing the heat dissipation of the LED lamp.

公开(公告)号：US20170013734A1

公开(公告)日：2017-01-12

申请号：US15196277

申请日：2016-06-29

Applicant: ZF Friedrichshafen AG

Inventor： Thomas WITTIG

IPC: H05K5/02 ,  H05K1/18

CPC classification number: H05K1/18 ,  H05K3/30 ,  H05K5/0091 ,  H05K2201/09063 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: The protective housing can cover at least one component on the circuit board; the interior of the cover has several protrusions that are built, so that at least one part is displaced by raising the protective housing on at least one component, so that it is in contact with the exterior contour of the component and fastens it. Moreover, a circuit board is provided with at least one protective housing.

Abstract translation: 保护壳可以覆盖电路板上的至少一个部件; 盖的内部具有几个构成的突出物，使得至少一个部分通过在至少一个部件上升高保护壳体而移位，使得其与部件的外部轮廓接触并固定。 此外，电路板设置有至少一个保护壳体。

公开(公告)号：US09437947B2

公开(公告)日：2016-09-06

申请号：US14547497

申请日：2014-11-19

Applicant: Douglas M. Johnescu ,  Gregory A. Hull

Inventor： Douglas M. Johnescu ,  Gregory A. Hull

IPC: H01R13/60 ,  H01R12/70 ,  H05K3/30 ,  H01R12/72 ,  H01R13/518

CPC classification number: H01R12/7047 ,  H01R12/724 ,  H01R13/518 ,  H05K3/306 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10598 ,  Y10T29/49147

Abstract: An electrical connector include a movable hold down member that is configured to receive a fastener so as to secure the electrical connector to an underlying substrate to which the electrical connector is mounted.

Abstract translation: 电连接器包括可移动的压紧构件，其被配置为接收紧固件，以将电连接器固定到安装有电连接器的下面的基板。

公开(公告)号：US09414505B2

公开(公告)日：2016-08-09

申请号：US14613017

申请日：2015-02-03

Applicant: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Wen-Hsiang Hung ,  Chun-Bao Gu ,  Hong-Mei Zhang

IPC: H05K7/02 ,  H05K7/04 ,  H05K5/00 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K1/141 ,  H05K3/301 ,  H05K2201/049 ,  H05K2201/10189 ,  H05K2201/10598

Abstract: An electronic device includes an enclosure, a circuit board mounted in the enclosure, an electronic component attached to the circuit board, an antenna module mounted to the electronic component, and a mounting apparatus configured to mount the antenna module. The mounting apparatus includes a pressing member mounted on the circuit board. The mounting apparatus includes a pressing panel, a pressing block extending from the pressing panel, a positioning piece extending from the pressing panel, and a pressing piece extending from the pressing block. The pressing piece has a back wall. The pressing block presses the electronic component, the pressing panel presses the antenna module, and the back wall and the positioning piece abut against two adjacent sidewalls of the electronic component.

Abstract translation: 电子设备包括外壳，安装在外壳中的电路板，附接到电路板的电子部件，安装到电子部件的天线模块以及被配置为安装天线模块的安装装置。 安装装置包括安装在电路板上的按压部件。 安装装置包括按压板，从按压板延伸的按压块，从按压板延伸的定位件以及从压块延伸的按压件。 压制件具有后壁。 按压块按压电子部件，按压板按压天线模块，并且后壁和定位件抵靠电子部件的两个相邻的侧壁。

公开(公告)号：US09258918B2

公开(公告)日：2016-02-09

申请号：US12676935

申请日：2008-08-04

Applicant: Josef Loibl ,  Thomas Preuschl ,  Hermann-Josef Robin ,  Karl Smirra

Inventor： Josef Loibl ,  Thomas Preuschl ,  Hermann-Josef Robin ,  Karl Smirra

IPC: H05K7/00 ,  H05K13/00 ,  H05K5/06 ,  B60R16/023 ,  H05K5/00 ,  F16H61/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K5/069 ,  B60R16/0239 ,  F16H61/0006 ,  H05K1/141 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/365 ,  H05K3/4691 ,  H05K5/0082 ,  H05K2201/0999 ,  H05K2201/10598 ,  H05K2203/1147 ,  Y10T29/49002

Abstract: A housing concept for integrated control electronics, comprising a housing bottom, a circuit carrier populated with electronic components of the central control electronics, and a signal and current distribution component as the electric connection between the central control electronics and peripheral components. The housing bottom is configured in the shape of a basin, the circuit carrier for the electronic components of the central control electronics being disposed therein such that the same can be electrically connected on at least one upwardly curved edge region to the signal and current distribution component disposed above the same via contact points, and wherein the housing bottom may also be connected circumferentially to the signal and current distribution component.

Abstract translation: 用于集成控制电子器件的壳体概念，包括壳体底部，安装有中央控制电子器件的电子部件的电路载体，以及作为中央控制电子设备和外围部件之间的电连接的信号和电流分配部件。 壳体底部构造为盆形，用于中央控制电子器件的电子部件的电路载体设置在其中，使得其可以在至少一个向上弯曲的边缘区域上电连接到信号和电流分布部件 设置在同一经过接触点上方，并且其中壳体底部也可以与信号和电流分布部件周向连接。

公开(公告)号：US09054410B2

公开(公告)日：2015-06-09

申请号：US13479599

申请日：2012-05-24

Applicant: Gregory Joseph Maley

Inventor： Gregory Joseph Maley

IPC: H01Q9/16 ,  H01Q21/26 ,  H01Q1/12 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01Q9/16 ,  H01Q1/1207 ,  H01Q21/26 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09027 ,  H05K2201/09145 ,  H05K2201/10598

Abstract: An antenna comprising PCB elements mechanically secured by a clip is provided. The antenna has a feedboard printed circuit board having a feed network, at least one radiating element, and the clip. The radiating element includes first and second printed circuit boards, each having a base disposed on a surface of the feedboard printed circuit board. In one example, the printed circuit boards each further include a dipole disposed above the feedboard. In another example, the PCBs are supports and a cross-polarized radiating may be mounted on top. The first and second PCBs may include slots so that the boards may be assembled together. The PCBs also include an extension extending through a first slot on the feedboard PCB, and indentations disposed on the first extension. The clip may have retainers that engage the indentations of the extensions.

Abstract translation: 提供了包括通过夹子机械固定的PCB元件的天线。 天线具有馈电板印刷电路板，其具有馈电网络，至少一个辐射元件和夹子。 辐射元件包括第一和第二印刷电路板，每个印刷电路板具有设置在馈电板印刷电路板的表面上的基座。 在一个示例中，印刷电路板各自还包括设置在馈电板上方的偶极子。 在另一示例中，PCB是支撑件，并且可以在顶部安装交叉极化辐射。 第一和第二PCB可以包括槽，使得板可以组装在一起。 PCB还包括延伸穿过馈送板PCB上的第一槽的延伸部和设置在第一延伸部上的压痕。 夹子可以具有接合延伸部的凹槽的保持器。