Multiple stem design for high density interconnects
    134.
    发明授权
    Multiple stem design for high density interconnects 失效
    多杆设计用于高密度互连

    公开(公告)号:US08152549B1

    公开(公告)日:2012-04-10

    申请号:US12917118

    申请日:2010-11-01

    Abstract: A plurality of connecting elements projects from a body's surface. A plurality of indents is defined in the body's surface. Each stem element includes first and second stalks projecting orthogonally from the surface. The first stub includes a pyramidical cap section and at least one generally planar wall. The second stalk is generally parallel to the first stub and spaced apart from the at least one wall, defining a gap therebetween. The second stalk includes a stem projecting from the surface. A lip section extends from a distal end of the stem and protrudes outwardly relative to the stem. An engagement section extends from the lip section. A free end of the engagement section defines a distal end of the second stalk. An outer surface of the engagement section defines a first gradient tapering from the lip section to the distal end of the second stalk.

    Abstract translation: 多个连接元件从身体的表面伸出。 在身体的表面定义了多个缩进。 每个杆元件包括从表面垂直突出的第一和第二茎。 第一短柱包括金字塔盖部分和至少一个大致平面的壁。 所述第二杆通常平行于所述第一短柱并且与所述至少一个壁间隔开,从而在其间形成间隙。 第二根杆包括从表面突出的杆。 唇部从茎的远端延伸并相对于茎向外突出。 接合部从唇部延伸。 接合部分的自由端限定第二茎的远端。 接合部分的外表面限定了从唇部到第二茎的远端渐缩的第一梯度。

    MULTI-PIECE BOARD AND FABRICATION METHOD THEREFOR
    136.
    发明申请
    MULTI-PIECE BOARD AND FABRICATION METHOD THEREFOR 有权
    多层板及其制造方法

    公开(公告)号:US20100118504A1

    公开(公告)日:2010-05-13

    申请号:US12537713

    申请日:2009-08-07

    Inventor: Yasushi HASEGAWA

    Abstract: A method for fabricating a multi-piece board includes: preparing a board main portion having a first coupling member and multiple piece portions connected to the first coupling member, the first coupling member forming a part of a coupling member of a multi-piece board, each of the piece portions having a printed wiring board; preparing a second coupling member which forms the coupling member together with the first coupling member; and adhering the second coupling member to the first coupling member of the board main portion, thereby yielding the multi-piece board.

    Abstract translation: 一种制造多片板的方法包括:制备具有第一联接构件的板主体和连接到第一联接构件的多个部分,第一联接构件形成多片板的联接构件的一部分, 每个片部分具有印刷线路板; 准备与第一联接构件一起形成联接构件的第二联接构件; 并且将第二联接构件粘合到板主要部分的第一联接构件,从而产生多片板。

    Socket for electronic component
    137.
    发明授权
    Socket for electronic component 失效
    电子元件插座

    公开(公告)号:US07553162B2

    公开(公告)日:2009-06-30

    申请号:US11915349

    申请日:2006-05-25

    Abstract: The present invention relates to a socket for electronic component which contains an electronic component. The socket for electronic component comprises a platy base, containers formed to be concaved on a front face of the base and to contain LED packages therein, connectors provided on side faces and connected to other members, supports each of which supports and fixes the LED package contained in the container and electrically connected to the LED package, heat conductors each of which is provided continuously from a bottom face side of the container to a rear face of the base and contacts the LED package contained in the container so as to conduct heat generated by the LED package, and terminals electrically connected to the other members coupled with the connectors and the supports. The heat generated by the LED package is conducted to the rear face of the base through the heat conductors, and effectively radiated to an installation member on which the socket for electronic component is mounted.

    Abstract translation: 本发明涉及一种包含电子部件的电子部件用插座。 用于电子部件的插座包括板状基座,形成为凹陷在基座的前表面上并容纳LED封装的容器,设置在侧面上并连接到其它构件的连接器,每个支撑件支撑并固定LED封装 容纳在容器中并电连接到LED封装的导热体,每个热导体从容器的底面侧连续地设置到基座的后表面,并与容纳在容器中的LED封装体接触,以便产生热量 通过LED封装,以及电连接到与连接器和支撑件耦合的其它构件的端子。 由LED封装产生的热量通过导热体传导到基座的后表面,并有效地辐射到安装有用于电子部件的插座的安装部件上。

    Display device with electrical zipper interconnect
    138.
    发明授权
    Display device with electrical zipper interconnect 失效
    具有电动拉链互连的显示设备

    公开(公告)号:US07479940B2

    公开(公告)日:2009-01-20

    申请号:US11273454

    申请日:2005-11-14

    CPC classification number: H05K3/365 G02F1/1345 H01H2001/125 H05K2201/209

    Abstract: A display device includes an electronic display adapted to produce images, an electronic device that electrically communicates with the display and a zipper interconnect adapted to enable electrical connection between the display and the electronic device. The electronic display can be a reflective display such as a liquid crystal display or an emissive display such as one containing light emitting diodes. The electronic device that communicates with the display can be drive electronics adapted to electrically address the display so as to produce the images. In particular, the display is a cholesteric liquid crystal display that can be bistable and in the form of a passive matrix, active matrix or direct drive display.

    Abstract translation: 显示设备包括适于产生图像的电子显示器,与显示器电通信的电子设备以及适于实现显示器和电子设备之间的电连接的拉链互连。 电子显示器可以是反射显示器,例如液晶显示器或诸如包含发光二极管的发射显示器。 与显示器通信的电子设备可以是适于电地寻址显示器以便产生图像的驱动电路。 特别地,显示器是胆甾型液晶显示器,其可以是双稳态的,并且是无源矩阵,有源矩阵或直接驱动显示器的形式。

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