公开(公告)号：US08570122B1

公开(公告)日：2013-10-29

申请号：US12779307

申请日：2010-05-13

Applicant: Jonathan Hale Hammond

Inventor： Jonathan Hale Hammond

IPC: H01H51/22

CPC classification number: B81B7/0019 ,  B81B2201/014 ,  H01H59/0009

Abstract: A microstructure device that includes at least one thermally compensating anchor for preventing undesirable thermal displacement or actuation during manufacturing or operation is disclosed. In particular, the microstructure device includes a substrate and a movable structure suspended above the substrate by at least one anchor. The anchor is attached to the substrate. The anchor also includes an upper area of an upper surface region of a bottom portion attached to a lower surface of a proximal portion of the movable structure. The anchor further includes a top portion having a lower area of a lower surface region attached to an upper surface of the proximal portion of the movable structure, wherein the lower surface region of the top portion and the upper surface region of the bottom portion are geometrically asymmetric.

Abstract translation: 公开了一种微结构装置，其包括至少一个用于在制造或操作期间防止不期望的热位移或致动的热补偿锚。 特别地，微结构装置包括基板和通过至少一个锚悬挂在基板上方的可移动结构。 锚固件附接到基板。 锚固件还包括附接到可移动结构的近侧部分的下表面的底部的上表面区域的上部区域。 锚固体还包括顶部，其具有附接到可移动结构的近侧部分的上表面的下表面区域的下部区域，其中顶部的下表面区域和底部的上表面区域是几何形状 不对称。

公开(公告)号：US08535966B2

公开(公告)日：2013-09-17

申请号：US12844299

申请日：2010-07-27

Applicant: Felix P. Anderson ,  Thomas L. McDevitt ,  Anthony K. Stamper

Inventor： Felix P. Anderson ,  Thomas L. McDevitt ,  Anthony K. Stamper

IPC: H01L21/00

CPC classification number: H01H59/00 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00182 ,  B81C2201/0107 ,  G06F17/5068

Abstract: A MEMS structure and methods of manufacture. The method includes forming a sacrificial metal layer at a same level as a wiring layer, in a first dielectric material. The method further includes forming a metal switch at a same level as another wiring layer, in a second dielectric material. The method further includes providing at least one vent to expose the sacrificial metal layer. The method further includes removing the sacrificial metal layer to form a planar cavity, suspending the metal switch. The method further includes capping the at least one vent to hermetically seal the planar cavity.

Abstract translation: MEMS结构及制造方法。 该方法包括在第一电介质材料中形成与布线层相同水平的牺牲金属层。 该方法还包括在第二电介质材料中形成与另一配线层相同水平的金属开关。 该方法还包括提供至少一个通风口以暴露牺牲金属层。 该方法还包括去除牺牲金属层以形成平坦的空腔，使金属开关悬挂。 该方法还包括加盖至少一个通气口以气密地密封平面腔。

公开(公告)号：US08458888B2

公开(公告)日：2013-06-11

申请号：US12973381

申请日：2010-12-20

Applicant: Anthony K. Stamper ,  John G. Twombly

Inventor： Anthony K. Stamper ,  John G. Twombly

IPC: H01S4/00

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is movable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

Abstract translation: 形成至少一个微电子机械系统（MEMS）的方法包括：对布线层进行图案化以形成至少一个固定板并在布线层上形成牺牲材料。 该方法还包括在至少一个固定板上形成一层或多层薄膜的绝缘体层，以及下层衬底的暴露部分，以防止在布线层和牺牲材料之间形成反应产物。 该方法进一步包括形成至少一个可在该至少一个固定板上移动的MEMS梁。 该方法还包括排出或剥离牺牲材料以形成至少第一腔。

公开(公告)号：US08450912B2

公开(公告)日：2013-05-28

申请号：US12974121

申请日：2010-12-21

Applicant: Takamichi Fujii

Inventor： Takamichi Fujii

IPC: H01L41/08

CPC classification number: B81C1/00976 ,  B81B2201/014 ,  H01H57/00 ,  H01H2057/006 ,  H01L41/094 ,  H01L41/316 ,  Y10T29/42

Abstract: An actuator element includes: a piezoelectric body; a pair of electrodes mutually opposing to each other via the piezoelectric body; a diaphragm to which the piezoelectric body sandwiched between the pair of electrodes is bonded; and a base substrate arranged to oppose a movable part including the piezoelectric body and the diaphragm, the movable part being displaced in a direction toward the base substrate by application of a drive voltage to the pair of electrodes, wherein polarization (Pr)-electric field (E) hysteresis characteristics of the piezoelectric body are biased with respect to an electric field, and by application of a voltage in an opposite direction to the drive voltage, to the pair of electrodes, the movable part is displaced in a direction away from the base substrate.

Abstract translation: 致动器元件包括：压电体; 经由压电体彼此相对的一对电极; 夹在一对电极之间的压电体接合的隔膜; 以及基板，被配置为与包括所述压电体和所述隔膜的可动部相对，所述可动部通过对所述一对电极施加驱动电压而朝向所述基板的方向移位，其中，所述极化（Pr）电场 （E）压电体的滞后特性相对于电场偏移，并且通过向驱动电压施加相反方向的电压而偏移到一对电极，可动部分沿远离 基底。

公开(公告)号：US08420427B2

公开(公告)日：2013-04-16

申请号：US11492671

申请日：2006-07-25

Applicant: Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Gilbert

Inventor： Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Gilbert

IPC: H01L21/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Methods for Implementation of a Switching Function in a Microscale Device and for Fabrication of a Microscale Switch. According to one embodiment, a method is provided for implementing a switching function in a microscale device. The method can include providing a stationary electrode and a stationary contact formed on a substrate. Further, a movable microcomponent suspended above the substrate can be provided. A voltage can be applied between the between a movable electrode of the microcomponent and the stationary electrode to electrostatically couple the movable electrode with the stationary electrode, whereby the movable component is deflected toward the substrate and a movable contact moves into contact with the stationary contact to permit an electrical signal to pass through the movable and stationary contacts. A current can be applied through the first electrothermal component to produce heating for generating force for moving the microcomponent.

Abstract translation: 用于实现微尺度装置中的切换功能以及用于制造微型开关的方法。 根据一个实施例，提供了一种用于在微型设备中实现切换功能的方法。 该方法可以包括提供固定电极和形成在基板上的固定触点。 此外，可以提供悬浮在基板上方的可移动微型部件。 可以在微型组件的可动电极和固定电极之间施加电压，以使可动电极与固定电极静电耦合，由此可动部件朝向基板偏转，并且可动触点移动到与固定触点接触 允许电信号通过可移动和固定触点。 可以通过第一电热部件施加电流以产生用于产生用于移动微型部件的力的加热。

公开(公告)号：US20130027146A1

公开(公告)日：2013-01-31

申请号：US13550950

申请日：2012-07-17

Applicant: Shogo INABA

Inventor： Shogo INABA

IPC: H03B1/00

CPC classification number: H03H9/2457 ,  B81B3/007 ,  B81B2201/014 ,  H03H3/0072 ,  H03H2009/02283 ,  H03H2009/02456 ,  H03H2009/02511

Abstract: A MEMS vibrator includes: a substrate; a first electrode disposed above the substrate; and a second electrode disposed in a state where at least one portion of the second electrode has a space between the first electrode and the second electrode, and having a beam portion capable of vibrating, in the thickness direction of the substrate, with electrostatic force and a supporting portion supporting one edge of the beam portion and disposed above the substrate, wherein a supporting side face of the supporting portion supporting the one edge has a bending portion which bends in plan view from the thickness direction of the substrate, and the one edge is supported by the supporting side face including the bending portion.

Abstract translation: MEMS振动器包括：基板; 设置在所述基板上方的第一电极; 以及第二电极，其设置在所述第二电极的至少一部分具有在所述第一电极和所述第二电极之间的空间的状态下，并且具有能够在所述基板的厚度方向上以静电力振动的光束部分， 支撑部分，其支撑梁部分的一个边缘并且设置在基板上方，其中支撑所述一个边缘的支撑部分的支撑侧面具有从基板的厚度方向在平面图中弯曲的弯曲部分，并且所述一个边缘 由包括弯曲部的支撑侧面支撑。

公开(公告)号：US20120318648A1

公开(公告)日：2012-12-20

申请号：US13161126

申请日：2011-06-15

Applicant: Dawn D. HALL ,  Mark C.H. LAMOREY ,  Anthony K. STAMPER

Inventor： Dawn D. HALL ,  Mark C.H. LAMOREY ,  Anthony K. STAMPER

IPC: H01H59/00 ,  G06F17/50 ,  H01H11/00

CPC classification number: H01H59/0009 ,  B81B2201/014 ,  G06F17/5068 ,  H01H11/00 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: Normally closed (shut) micro-electro-mechanical switches (MEMS), methods of manufacture and design structures are provided. A method of forming a micro-electrical-mechanical structure (MEMS), includes forming a plurality of electrodes on a substrate, forming a beam structure in electrical contact with a first of the electrodes, and bending the beam structure with a thermal process. The method further includes forming a cantilevered electrode extending over an end of the bent beam structure, and returning the beam structure to its original position, which will contact the cantilevered electrode in a normally closed position.

Abstract translation: 提供常闭（关闭）微机电开关（MEMS），制造方法和设计结构。 一种形成微机电结构（MEMS）的方法，包括在基板上形成多个电极，形成与第一电极电接触的光束结构，以及用热过程弯曲光束结构。 该方法还包括形成在弯曲梁结构的一端延伸的悬臂电极，并将梁结构返回到其初始位置，其将在常闭位置接触悬臂电极。

公开(公告)号：US20120223400A1

公开(公告)日：2012-09-06

申请号：US13411849

申请日：2012-03-05

Applicant: Ricky Alan JACKSON ,  Walter Baker MEINEL ,  Kalin Valeriev LAZAROV ,  Brian E. GOODLIN

Inventor： Ricky Alan JACKSON ,  Walter Baker MEINEL ,  Kalin Valeriev LAZAROV ,  Brian E. GOODLIN

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81B7/0019 ,  B81B2201/014 ,  B81C1/0038 ,  B81C1/00523 ,  B81C1/0069 ,  B81C1/00801 ,  H01L27/144

Abstract: A MEMS IR sensor, with a cavity in a substrate underlapping an overlying layer and a temperature sensing component disposed in the overlying layer over the cavity, may be formed by forming an IR-absorbing sealing layer on the overlying layer so as to cover access holes to the cavity. The sealing layer is may include a photosensitive material, and the sealing layer may be patterned using a photolithographic process to form an IR-absorbing seal. Alternately, the sealing layer may be patterned using a mask and etch process to form the IR-absorbing seal.

Abstract translation: 可以通过在覆盖层上形成IR吸收密封层来形成MEMS IR传感器，该MEMS红外传感器在衬底上覆盖覆盖层的空腔和设置在空腔上的上覆层中的温度感测部件，以便覆盖通路孔 到空腔。 密封层可以包括感光材料，并且可以使用光刻工艺对密封层进行图案化以形成IR吸收密封。 或者，可以使用掩模和蚀刻工艺对密封层进行图案化以形成IR吸收密封。

公开(公告)号：US20120156820A1

公开(公告)日：2012-06-21

申请号：US12973105

申请日：2010-12-20

Applicant: Sangchae Kim

Inventor： Sangchae Kim

IPC: H01L21/02

CPC classification number: B81C1/00626 ,  B81B2201/014 ,  H01H1/0036 ,  H01H59/0009

Abstract: The present Disclosure provides for fabrication devices and methods for manufacturing a micro-electromechanical system (MEMS) switch on a substrate. The MEMS fabrication device may have a first and second sacrificial layer that form the mold of an actuation member. The actuation member is formed over the first and second sacrificial layers to manufacture a MEMS switch from the MEMS fabrication device.

Abstract translation: 本公开提供了用于在基板上制造微机电系统（MEMS）开关的制造装置和方法。 MEMS制造装置可以具有形成致动构件的模具的第一和第二牺牲层。 致动构件形成在第一和第二牺牲层上，以从MEMS制造装置制造MEMS开关。

公开(公告)号：US20110316099A1

公开(公告)日：2011-12-29

申请号：US12973422

申请日：2010-12-20

Applicant: George A. DUNBAR, III ,  Zhong-Xiang HE ,  Jeffrey C. MALING ,  William J. MURPHY ,  Anthony K. STAMPER

Inventor： George A. DUNBAR, III ,  Zhong-Xiang HE ,  Jeffrey C. MALING ,  William J. MURPHY ,  Anthony K. STAMPER

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a lower wiring layer on a substrate. The method further includes forming a plurality of discrete wires from the lower wiring layer. The method further includes forming an electrode beam over the plurality of discrete wires. The at least one of the forming of the electrode beam and the plurality of discrete wires are formed with a layout which minimizes hillocks and triple points in subsequent silicon deposition.

Abstract translation: 形成至少一个微机电系统（MEMS）的方法包括在基板上形成下布线层。 该方法还包括从下布线层形成多条分立布线。 该方法还包括在多个离散导线上形成电极束。 形成电极束和多个离散导线中的至少一个形成有最小化后续硅沉积中的小丘和三点的布局。