公开(公告)号：US20070026674A1

公开(公告)日：2007-02-01

申请号：US11163989

申请日：2005-11-07

Applicant: I-Ju Chen

Inventor： I-Ju Chen

IPC: H01L21/302

CPC classification number: B81C1/00896 ,  B81C2201/053 ,  Y10S438/928

Abstract: A wafer comprising a front surface and a back surface is provided. The wafer further includes a front pattern on the front surface, the front pattern having a plurality of holes. A low-viscosity fluid is formed on the front surface and filled into the holes. Following that, a high-viscosity fluid is formed and filled into the holes by diffusion.

Abstract translation: 提供了包括前表面和后表面的晶片。 晶片还包括前表面上的前图案，前图案具有多个孔。 在前表面上形成低粘度流体并填充到孔中。 之后，形成高粘度流体并通过扩散填充到孔中。

公开(公告)号：US07138693B2

公开(公告)日：2006-11-21

申请号：US10969380

申请日：2004-10-19

Applicant: Satyadev Patel ,  Jonathan Doan ,  Andrew Huibers

Inventor： Satyadev Patel ,  Jonathan Doan ,  Andrew Huibers

IPC: H01L27/14 ,  H01L29/82 ,  H01L29/84

CPC classification number: B81C1/00793 ,  B81B2201/042 ,  B81C2201/053

Abstract: A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.

Abstract translation: 本文公开了一种用于处理微机电装置的方法。 该方法通过在连续的牺牲层和结构层之间提供选定的阻挡层来防止牺牲层与微机电器件的结构层之间的扩散和相互作用。

公开(公告)号：US20060160264A1

公开(公告)日：2006-07-20

申请号：US11039688

申请日：2005-01-20

Applicant: William McDonald ,  Stephen Hooper ,  Arvind Salian

Inventor： William McDonald ,  Stephen Hooper ,  Arvind Salian

IPC: H01L21/00

CPC classification number: B81C1/00309 ,  B81C2201/053

Abstract: Methods are provided for manufacturing a sensor. The method comprises depositing a sacrificial material at a first predetermined thickness onto a wafer having at least one sense element mounted thereon, the sacrificial material deposited at least partially onto the at least one sense element, forming an encapsulating layer at a second predetermined thickness less than the first predetermined thickness over the wafer and around the deposited sacrificial material, and removing the sacrificial material. Apparatus for a sensor manufactured by the aforementioned method are also provided.

Abstract translation: 提供了制造传感器的方法。 该方法包括将第一预定厚度的牺牲材料沉积到具有安装在其上的至少一个感测元件的晶片上，所述牺牲材料至少部分地沉积在所述至少一个感测元件上，形成第二预定厚度的封装层， 在晶片上方并围绕沉积的牺牲材料的第一预定厚度，以及去除牺牲材料。 还提供了通过上述方法制造的传感器的装置。

公开(公告)号：US20060030120A1

公开(公告)日：2006-02-09

申请号：US10904741

申请日：2004-11-24

Applicant: Shih-Feng Shao ,  Chih-Ping Kuo

Inventor： Shih-Feng Shao ,  Chih-Ping Kuo

IPC: H01L21/30

CPC classification number: H01L21/304 ,  B81C1/00603 ,  B81C1/00833 ,  B81C2201/053 ,  H01L21/67132

Abstract: First, a wafer having a first surface and a second surface is provided. Then, a first heat sensitive tape is utilized to bond the second surface of the wafer to a first carrier, and at least a first semiconductor process is performed upon the first surface of the wafer. Subsequently, a second heat sensitive tape is utilized to bond the first surface of the wafer to a second carrier, and the first heat sensitive tape is separated from the second surface of the wafer by heating. Following that, at least a second semiconductor process is performed upon the second surface of the wafer, and the second heat sensitive tape is separated from the first surface of the wafer by heating.

Abstract translation: 首先，提供具有第一表面和第二表面的晶片。 然后，利用第一热敏胶带将晶片的第二表面接合到第一载体上，并且至少第一半导体工艺在晶片的第一表面上进行。 随后，使用第二热敏胶带将晶片的第一表面粘合到第二载体上，并且通过加热将第一热敏胶带与晶片的第二表面分离。 接着，在晶片的第二表面上执行至少第二半导体工艺，并且通过加热将第二热敏带与晶片的第一表面分离。

公开(公告)号：US20050214462A1

公开(公告)日：2005-09-29

申请号：US11089111

申请日：2005-03-24

Applicant: Toshiyuki Kaeriyama ,  Richard Knipe ,  Michael Mignardi ,  Simon Jacobs

Inventor： Toshiyuki Kaeriyama ,  Richard Knipe ,  Michael Mignardi ,  Simon Jacobs

IPC: B05D1/00 ,  B05D1/02 ,  B81C1/00 ,  B05D7/00

CPC classification number: B81C1/00896 ,  B05D1/005 ,  B05D1/02 ,  B81C2201/053

Abstract: A method of fabricating a micromechanical device. Several of the micromechanical devices are fabricated 20 on a common wafer. After the devices are fabricated, the sacrificial layers are removed 22 leaving open spaces where the sacrificial layers once were. These open spaces allow for movement of the components of the micromechanical device. The devices optionally are passivated 24, which may include the application of a lubricant. After the devices have been passivated, they are tested 26 in wafer form. After testing 26, any surface treatments that are not compatible with the remainder of the processing steps are removed 28. The substrate wafer containing the completed devices receives a conformal overcoat 30. The overcoat layer is thick enough to project the micromechanical structures, but thin and light enough to prevent deforming the underlying micromechanical structures. Once the devices on the wafer are overcoated, the wafer is separated 32, and the known good devices are cleaned 34 to remove debris left by the dicing process. Once the devices are separated and cleaned, the overcoat may be removed, however, the overcoat typically is left in place to protect the device during the initial stages of the packaging process. Typically the devices are mounted 36 in the package substrate, the overcoat removed 38 from the devices, and the package containing the micromechanical device finished by sealing the package to enclose the device.

Abstract translation: 一种制造微机械装置的方法。 几个微机械器件在公共晶片上制造20。 在器件制造之后，去除牺牲层22，留下牺牲层一次的开放空间。 这些开放空间允许微机械装置的部件移动。 所述装置可选地被钝化24，其可以包括施加润滑剂。 在器件被钝化之后，它们以晶片形式被测试26。 在测试26之后，除去与其余处理步骤不相容的任何表面处理。含有完成的器件的衬底晶片接收共形外涂层30.该外涂层足够厚以使微机械结构突出，但是薄和 光足以防止底层微机械结构变形。 一旦晶片上的器件被覆盖，晶片被分离32，并且已知的良好器件被清洁34以去除由切割工艺留下的残留物。 一旦设备被分离和清洁，可以去除外涂层，然而，外包层通常留在适当位置以在包装过程的初始阶段保护装置。 通常，将器件安装在封装衬底36中，从器件移除外涂层38，并且将包含微机械器件的封装通过密封封装封闭器件而完成。

公开(公告)号：US20040065637A1

公开(公告)日：2004-04-08

申请号：US10242213

申请日：2002-09-12

Applicant: Network Photonics, Inc.

Inventor： Bevan Staple ,  Jillian Buriak

IPC: C23F001/00

CPC classification number: B82Y30/00 ,  B81C1/00476 ,  B81C1/00801 ,  B81C2201/0114 ,  B81C2201/0133 ,  B81C2201/0139 ,  B81C2201/053

Abstract: A microelectromechanical structure is formed by depositing sacrificial and structural material over a substrate to form a structural layer on a component electrically attached with the substrate. The galvanic potential of the structural layer is greater than the galvanic potential of the component. At least a portion of the structural material is covered with a protective material that has a galvanic potential less than or equal to the galvanic potential of the component. The sacrificial material is removed with a release solution. At least one of the protective material and release solution is surfactanated, the surfactant functionalizing a surface of the component.

Abstract translation: 通过将牺牲和结构材料沉积在衬底上以在与衬底电连接的部件上形成结构层来形成微机电结构。 结构层的电位大于元件的电位。 结构材料的至少一部分被保护材料覆盖，该保护材料具有小于或等于部件的电位的电位。 牺牲材料用释放溶液除去。 保护材料和释放溶液中的至少一种被表面活性化，表面活性剂对组分的表面进行官能化。

公开(公告)号：US20030141561A1

公开(公告)日：2003-07-31

申请号：US10203729

申请日：2002-11-08

Inventor： Frank Fischer ,  Peter Hein ,  Eckhard Graf

IPC: H01L029/82

CPC classification number: B81C1/00801 ,  B81B2203/0136 ,  B81B2203/0315 ,  B81C2201/0109 ,  B81C2201/053 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814

Abstract: The present invention relates to a method for manufacturing a micromechanical component (100), that has at least one hollow space (110) and a functional element (12) that is provided at least partially in the hollow space (110) and/or a functional layer (13a, 13b, 13c) that is provided at least partially therein, and to a micromechanical component (100) that is manufactured in accordance with the method, according to the species of the relevant independent patent claim. To reduce manufacturing costs, the functional element (12) and/or the functional layer (13a, 13b, 13c) is provided with a first protective layer (41; 71) at least in an area that directly or indirectly borders on a first sacrificial layer (52), which temporarily occupies the space of the hollow space (22) that is subsequently formed in one or a plurality of etching steps (FIG. 4; FIG. 7), the material of the first protective layer (41) being selected such that at least one etching process and/or etching medium, which etches or dissolves the first sacrificial layer (52), either does not substantially attack the first protective layer (41; 71) or does so only at a reduced etching rate in comparison to the first sacrificial layer (52).

Abstract translation: 本发明涉及一种用于制造微机械部件（100）的方法，其具有至少一个中空空间（110）和至少部分地设置在中空空间（110）中的功能元件（12）和/或 至少部分地设置有功能层（13a，13b，13c）以及根据该方法制造的微机电部件（100）。 为了降低制造成本，功能元件（12）和/或功能层（13a，13b，13c）至少在直接或间接地接合在第一牺牲部分上的区域中设置有第一保护层（41; 71） （52），其临时占据随后在一个或多个蚀刻步骤中形成的中空空间（22）的空间（图4;图7），第一保护层（41）的材料为 被选择为使得蚀刻或溶解第一牺牲层（52）的至少一个蚀刻工艺和/或蚀刻介质基本上不会攻击第一保护层（41; 71），或者仅以降低的蚀刻速率 与第一牺牲层（52）的比较。

公开(公告)号：US20030049879A1

公开(公告)日：2003-03-13

申请号：US09915217

申请日：2001-07-25

Inventor： Chuang-Chia Lin

IPC: H01L021/00 ,  C23F001/00

CPC classification number: G02B6/3518 ,  B81B3/004 ,  B81B2201/045 ,  B81B2203/058 ,  B81C2201/053 ,  G02B6/3514 ,  G02B6/3546 ,  G02B6/3566 ,  G02B6/357 ,  G02B6/3572 ,  G02B6/358

Abstract: A microelectromechanical systems (MEMS) element, MEMS optical switch and MEMS fabrication method are described. The MEMS element comprises a crystalline and moveable element is moveably attached to the substrate. The moveable element includes a perpendicular portion oriented substantially perpendicular to a plane of the substrate. The crystal structure of the perpendicular portion and substrate are substantially similar. The moveable element moveable is moveably attached to the substrate for motion substantially constrained to a plane oriented substantially perpendicular to a plane of the substrate. In at least one position, a part of a perpendicular portion of the moveable element projects beyond a surface of the substrate. The moveable element may be retained in place by a latch. The perpendicular portion may be formed substantially perpendicular portion to the substrate. An array of such structures can be implemented to work as an optical switch. The optical switch may comprise a crystalline substrate and one or more moveable elements moveably attached to the substrate The MEMS elements may be fabricated by providing a substrate; forming one or more trenches in the substrate to define a perpendicular portion of a element; and moveably attaching the moveable element to a first surface of the substrate; removing a portion of the substrate such that at least a part of the perpendicular portion projects beyond a second surface of the substrate. The various embodiments provide for a robust and reliable MEMS elements that may be simply fabricated and densely packed.

Abstract translation: 描述了微机电系统（MEMS）元件，MEMS光开关和MEMS制造方法。 MEMS元件包括可移动地附接到基底的结晶和可移动元件。 可移动元件包括垂直于基本垂直于基底平面的垂直部分。 垂直部分和基底的晶体结构基本相似。 可移动的可移动元件可移动地附接到基板，用于基本上约束到基本上垂直于基板的平面定向的平面的运动。 在至少一个位置中，可移动元件的垂直部分的一部分突出超过衬底的表面。 可移动元件可以通过闩锁保持在适当的位置。 垂直部分可以形成为基本上垂直于基底的部分。 可以实现这种结构的阵列以用作光学开关。 光学开关可以包括晶体衬底和可移动地附接到衬底的一个或多个可移动元件。可以通过提供衬底来制造MEMS元件; 在所述衬底中形成一个或多个沟槽以限定元件的垂直部分; 以及将所述可移动元件可移动地附接到所述基板的第一表面; 去除所述基底的一部分，使得所述垂直部分的至少一部分突出超过所述基底的第二表面。 各种实施例提供了可以简单地制造和密集包装的鲁棒且可靠的MEMS元件。

公开(公告)号：US20030021523A1

公开(公告)日：2003-01-30

申请号：US09911818

申请日：2001-07-24

Applicant: INNOVATIVE TECHNOLOGY LICENSING, LLC

Inventor： Jeffrey F. De Natale

IPC: G02B006/35 ,  G02B007/198

CPC classification number: G02B6/3518 ,  B81B3/0083 ,  B81B2201/042 ,  B81C1/00214 ,  B81C2201/053 ,  G02B6/3584

Abstract: A new hybrid method of fabricating optical micro electro mechanical system (MEMS) devices is disclosed that uses both bulk and surface micromachining techniques, and a new optical MEMS device is also disclosed that is fabricated using the new method. The method includes the step of mounting a handle layer to one or more layers of MEMS structural material. Layers of structural and sacrificial material are then built up on the MEMS structural material using surface micromachining techniques. Drive electronics are mounted to the layers of structural and sacrificial material. The handle layer is removed to reveal the MEMS structural layer and the sacrificial material within the various layers is dissolved. The new method is particularly applicable to fabricating optical MEMS devices, with the handle layer being adjacent to a Si mirror layer. The surface micomachining layers form electrode and spring structures. Drive electronics are then mounted on the layers of structural material, so that a bias can be applied to the MEMS structures. The handle layer is removed from the mirror layer to reveal the mirror's reflective surface, and the sacrificial material is dissolved away, freeing the MEMS structures to operate. For optical or other MEMS arrays, a linking framework can be included to attach the MEMS devices.

公开(公告)号：US20020122881A1

公开(公告)日：2002-09-05

申请号：US10038791

申请日：2001-12-31

Inventor： Toshiyuki Kaeriyama ,  Richard L. Knipe ,  Michael A. Mignardi ,  Simon Joshua Jacobs

IPC: B05D003/12 ,  B05D001/02 ,  B05D003/06 ,  B05D001/18

CPC classification number: B81C1/00896 ,  B05D1/005 ,  B05D1/02 ,  B81C2201/053

Abstract: A method of fabricating a micromechanical device. Several of the micromechanical devices are fabricated 20 on a common wafer. After the devices are fabricated, the sacrificial layers are removed 22 leaving open spaces where the sacrificial layers once were. These open spaces allow for movement of the components of the micromechanical device. The devices optionally are passivated 24, which may include the application of a lubricant. After the devices have been passivated, they are tested 26 in wafer form. After testing 26, any surface treatments that are not compatible with the remainder of the processing steps are removed 28. The substrate wafer containing the completed devices receives a conformal overcoat 30. The overcoat layer is thick enough to project the micromechanical structures, but thin and light enough to prevent deforming the underlying micromechanical structures. Once the devices on the wafer are overcoated, the wafer is separated 32, and the known good devices are cleaned 34 to remove debris left by the dicing process. Once the devices are separated and cleaned, the overcoat may be removed, however, the overcoat typically is left in place to protect the device during the initial stages of the packaging process. Typically the devices are mounted 36 in the package substrate, the overcoat removed 38 from the devices, and the package containing the micromechanical device finished by sealing the package to enclose the device.