公开(公告)号：US09706648B2

公开(公告)日：2017-07-11

申请号：US14857907

申请日：2015-09-18

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Guofu Zhou ,  Johannes Adrianus Maria Rademakers ,  Petrus Antonius Henricus Snoeijen ,  Josephus Henricus Gerardus Bax ,  Frank Anton Van Abellen ,  Liesbeth Van Pieterson

IPC: H01R33/00 ,  H01R12/00 ,  H05K1/02 ,  F21V21/00 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K1/11 ,  F21K9/20

CPC classification number: H05K1/0283 ,  F21K9/20 ,  F21V21/00 ,  H05K1/0277 ,  H05K1/038 ,  H05K1/111 ,  H05K1/181 ,  H05K1/189 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2203/0152 ,  Y10T29/4913

Abstract: A method of manufacturing an electronic textile (1) comprising the steps of: providing a textile carrier (2) comprising a plurality of conductor lines (6a-b); releasably attaching (101) the textile carrier (2) to a rigid support plate (20); providing (102) a conductive substance on the textile carrier (2) in a pattern forming a plurality of sets of connection pads (5a-b) on the textile carrier (2), each set of connection pads defining a component placement position for placement of an electronic component (3), and each set of connection pads (5a-b) comprising a connection pad overlapping one of the conductor lines, the connection pad having a connection pad length (Lcp) in a direction parallel to the conductor line and a connection pad width (Wcp) in a direction perpendicular to the conductor line, wherein the connection pad width (Wcp) is at least one percent of an extension (Wtc) of the textile carrier (2) in the direction perpendicular to the conductor line; automatically placing (103) electronic components (3) at the component placement positions; curing (104) the conductive substance to attach the electronic components (3) to the textile carrier (2), thereby forming the electronic textile (1) and removing (105) the electronic textile from the rigid support plate.

公开(公告)号：US20170179003A1

公开(公告)日：2017-06-22

申请号：US15070184

申请日：2016-03-15

Applicant: SK Hynix Inc.

Inventor： In Chul HWANG ,  Ki Young KIM ,  Myung Geun PARK

IPC: H01L23/498 ,  H01L23/00 ,  H05K1/11

CPC classification number: H01L23/4985 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/17 ,  H01L2224/17104 ,  H05K1/111 ,  H05K1/189 ,  H05K3/32 ,  H05K3/3436 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10962 ,  Y02P70/613

Abstract: A semiconductor package may be provided. The semiconductor package may include a substrate formed with one or more connection pads. The semiconductor package may include a semiconductor device including at least one bump. The semiconductor package may include an anisotropic conductive fabric including conductive fibers and configured to electrically couple the at least one connection pad to the at least one bump.

公开(公告)号：US20170017264A1

公开(公告)日：2017-01-19

申请号：US15124710

申请日：2014-07-14

Applicant: Paulino Vacas Jacques

Inventor： Paulino Vacas Jacques

IPC: G06F1/16 ,  A41B1/08 ,  A41D1/00 ,  A61B5/00

CPC classification number: G06F1/163 ,  A41B1/08 ,  A41D1/005 ,  A61B5/6805 ,  G06F3/015 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/115 ,  H05K1/118 ,  H05K1/18 ,  H05K2201/0281 ,  H05K2201/10053

Abstract: The present invention concerns a textile motherboard (MB) employable in garments, tablecloths, gowns, etc. that incorporates at least a central processing unit (CPU) or a peripheral or a combination thereof, with the intention of monitoring, informing, or controlling parameters of interest. The garments may be utilized or worn by users (human or not). The textile of the garment is utilized as substrate to conform the TMB. The TMB may exhibit multiple-layer structures and VIAs (Vertical Interconnect Accesses). The routings of the TMB are conformed of textile material capable of transmitting signals between CPU and a means to register information or between the CPU and the combination of peripherals. Layers, routings, and VIAs may be incorporated into the TMB by using known textile manipulation techniques such as: knitting, weaving, stamping, perforating, or they may also be printed on the textiles. Every component is modular and interchangeable and connects to the TMB utilizing textile connectors such as snaps, hooks, or similar elements. TMB, CPU, and peripherals are washable. CPU and peripherals may be mounted on textile boards, as well as on rigid or flexible PCBs (printed circuit boards), utilizing discrete electronic and photonic elements. The CPU includes a microcontroller, a microprocessor, or a comparable element. The peripherals include photonic transducers or electronic transducers or combinations thereof such as: capacitive, pulse, humidity, temperature, accelerometers, and gyroscopes sensors. The peripherals also include screens, modules for serial communications, radiofrequency (including Zigbee technology, Bluetooth, etc.) and Wi-Fi, as well as similar elements.

Abstract translation: 本发明涉及可以在至少包含中央处理单元（CPU）或外围设备或其组合的服装，桌布，礼服等中使用的纺织品母板（MB），其目的在于监视，通知或控制参数 出于兴趣。 服装可能会被用户使用或穿戴（人或不用）。 服装的纺织品被用作衬底以符合TMB。 TMB可以展示多层结构和VIA（垂直互连访问）。 TMB的路由符合能够在CPU之间传输信号的纺织材料和用于注册信息的手段之间或CPU与外围设备的组合之间的连接。 可以通过使用已知的纺织操作技术将织物，布线和VIA结合到TMB中，例如：编织，编织，冲压，穿孔，或者它们也可以印刷在纺织品上。 每个组件都是模块化和可互换的，并且使用诸如按钮，钩或类似元件之类的织物连接器连接到TMB。 TMB，CPU和外围设备都可以清洗。 CPU和外围设备可以安装在纺织板以及刚性或柔性PCB（印刷电路板）上，利用分立的电子和光子元件。 CPU包括微控制器，微处理器或可比元件。 外围设备包括光子传感器或电子传感器或其组合，例如：电容，脉冲，湿度，温度，加速度计和陀螺仪传感器。 外设还包括屏幕，用于串行通信的模块，射频（包括Zigbee技术，蓝牙等）和Wi-Fi以及类似元素。

公开(公告)号：US09504151B2

公开(公告)日：2016-11-22

申请号：US14225910

申请日：2014-03-26

Applicant: TOKAI RUBBER INDUSTRIES, LTD.

Inventor： Jun Kobayashi ,  Yusuke Yamashita ,  Yutaro Taguchi ,  Hitoshi Yoshikawa

IPC: H01B1/24 ,  H05K1/02 ,  H05K1/11 ,  C01B31/04 ,  C08K3/04 ,  C08L101/12 ,  H05K1/09

CPC classification number: H05K1/11 ,  C01B32/20 ,  C08K3/04 ,  C08K3/041 ,  C08K2201/001 ,  C08K2201/011 ,  C08L33/20 ,  H01B1/24 ,  H05K1/0283 ,  H05K1/095 ,  H05K2201/0245 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0314 ,  H05K2201/0323 ,  Y10T428/254 ,  C08L21/00

Abstract: Provided is a conductive film having a high conductivity in which electric resistance is less likely to increase, and a conductive composition for forming the same. The conductive composition includes an elastomer component, a fibrous carbon material having a fiber diameter of less than 30 nm, and a flake-like carbon material having a graphite structure, having an intensity ratio (G/D ratio) of a peak (G band) appearing in the vicinity of 1580 cm−1 to a peak (D band) appearing in the vicinity of 1330 cm−1 of Raman spectrum of not less than 1.8, and having a maximum length of not less than 150 nm and a thickness of not more than 100 nm. The conductive film is formed from the conductive composition.

Abstract translation: 提供一种导电性薄膜，其导电性优异，导电性低，电阻不太可能增加，导电性组合物也可以形成。 导电组合物包括弹性体组分，纤维直径小于30nm的纤维状碳材料和具有石墨结构的片状碳材料，具有峰（G带）的强度比（G / D比） ）出现在拉曼光谱1330cm -1附近出现的峰值（D带）不小于1.8，最大长度不小于150nm，厚度为 不超过100nm。 导电膜由导电组合物形成。

公开(公告)号：US09173282B2

公开(公告)日：2015-10-27

申请号：US13638536

申请日：2011-03-31

Applicant: Pulugurtha Markondeya Raj ,  Nitesh Kumbhat ,  Venkatesh Sundaram ,  Rao R. Tummala

Inventor： Pulugurtha Markondeya Raj ,  Nitesh Kumbhat ,  Venkatesh Sundaram ,  Rao R. Tummala

IPC: H01R9/00 ,  H05K1/02 ,  H01L23/498 ,  H01L25/065 ,  H01R12/52 ,  H01R12/71 ,  H05K3/34 ,  H05K1/18 ,  H05K3/10 ,  H01L29/41 ,  H01L23/13 ,  H01L25/10 ,  H01L23/00

CPC classification number: H05K1/0213 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L29/413 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/45147 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81385 ,  H01L2224/81399 ,  H01L2224/81815 ,  H01L2224/8182 ,  H01L2224/8185 ,  H01L2224/81897 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/15791 ,  H01R12/52 ,  H01R12/714 ,  H05K1/18 ,  H05K3/107 ,  H05K3/3436 ,  H05K2201/0248 ,  H05K2201/0281 ,  H05K2201/10378 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/48

Abstract: The various embodiments of the present invention provide a stress-relieving, second-level interconnect structure that is low-cost and accommodates TCE mismatch between low-TCE packages and PCBs. The various embodiments of the interconnect structure are reworkable and can be scaled to pitches from about 1 millimeter (mm) to about 150 micrometers (μm). The interconnect structure comprises a dielectric body element and at least one interconnection array that provides a conductive path between two electronic components. Each interconnection array comprises a plurality of wires that provide both conductivity and compliance to the overall interconnect structure. The versatility and scalability of the interconnect structure of the present invention make it a desirable structure to utilize in current two-dimensional and ever-evolving three-dimensional IC structures.

Abstract translation: 本发明的各种实施例提供了一种应力消除的二级互连结构，其低成本并且适应低TCE封装和PCB之间的TCE不匹配。 互连结构的各种实施例是可再加工的，并且可以缩放到约1毫米（mm）至约150微米（μm）的间距。 互连结构包括介电体元件和提供两个电子部件之间的导电路径的至少一个互连阵列。 每个互连阵列包括提供导电性和整体互连结构的柔性的多条导线。 本发明的互连结构的多功能性和可扩展性使其成为在目前的二维和不断发展的三维IC结构中使用的理想结构。

公开(公告)号：US20150282323A1

公开(公告)日：2015-10-01

申请号：US14663921

申请日：2015-03-20

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi Shimizu ,  Wataru Kaneda ,  Akio Rokugawa

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/0222 ,  H05K1/0225 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/116 ,  H05K3/26 ,  H05K3/381 ,  H05K3/4673 ,  H05K3/4676 ,  H05K2201/0191 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/068 ,  H05K2201/09227 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2203/0514

Abstract: A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

Abstract translation: 布线基板包括形成在芯层的一个表面上的第一布线层，形成在芯层的一个表面上以覆盖第一布线层的第一绝缘层，嵌入第一绝缘层中的通孔布线， 第二布线层，形成在第一绝缘层的第一表面上，以及比形成在第一绝缘层的第一表面上的第一绝缘层更薄的第二绝缘层，以覆盖第二布线层。 第一布线层包括焊盘和设置在焊盘周围的平面层。 通孔布线的一个端面从第一绝缘层的第一表面露出并直接接合到第二布线层。 通孔布线的另一个端面直接接合到第一绝缘层中的焊盘。

公开(公告)号：US09065175B2

公开(公告)日：2015-06-23

申请号：US13655215

申请日：2012-10-18

Applicant: Apple Inc.

Inventor： Sean S. Corbin ,  Taylor H. Gilbert ,  Rodney A. Gomez Angulo ,  Yi Jiang ,  Conor P. Lenahan ,  Qingxiang Li ,  Stephen R. McClure ,  Robert W. Schlub ,  Salih Yarga ,  Jiang Zhu

IPC: H04N5/225 ,  H01Q1/36 ,  H01Q1/48 ,  H01Q1/24 ,  H01Q1/38 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H04N5/2257 ,  H05K1/0215 ,  H05K1/189 ,  H05K2201/0281 ,  H05K2201/10409

Abstract: An electronic device may have a conductive housing with an antenna window. Antenna structures may be mounted adjacent to the antenna window. The antenna structures may have a dielectric carrier. Patterned metal antenna traces may be formed on the surface of the dielectric carrier. A proximity sensor may be formed from a flexible printed circuit mounted on the dielectric carrier. The flexible printed circuit may have a tail that contains a transmission line for feeding the antenna structures. The transmission line may include a positive signal conductor that is maintained at a desired distance from the conductive housing using a polymer sheet. A portion of the antenna structures may protrude between a microphone and a camera module. Plastic camera module housing structures may have an inner surface coated with a shielding metal. A U-shaped conductive fabric layer may be used as a grounding structure.

Abstract translation: 电子设备可以具有带有天线窗口的导电壳体。 天线结构可以安装在天线窗口附近。 天线结构可以具有电介质载体。 图案化的金属天线迹线可以形成在电介质载体的表面上。 接近传感器可以由安装在电介质载体上的柔性印刷电路形成。 柔性印刷电路可以具有包含用于馈送天线结构的传输线的尾部。 传输线可以包括使用聚合物片材从导电壳体保持在期望距离的正信号导体。 天线结构的一部分可以在麦克风和相机模块之间突出。 塑料相机模块外壳结构可以具有涂覆有屏蔽金属的内表面。 可以使用U形导电织物层作为接地结构。

公开(公告)号：US08991917B2

公开(公告)日：2015-03-31

申请号：US12581383

申请日：2009-10-19

Applicant: Kohei Kato ,  Fumitoshi Akaike ,  Seiya Nishimura

Inventor： Kohei Kato ,  Fumitoshi Akaike ,  Seiya Nishimura

IPC: A47C7/62 ,  B60N2/00 ,  B60N2/58 ,  B60R21/015 ,  H01R4/04 ,  H01R12/61 ,  H01R12/63 ,  H05K1/03 ,  H05K3/32

CPC classification number: H01R12/61 ,  B60N2/002 ,  B60N2/58 ,  B60R21/01532 ,  H01R4/04 ,  H01R12/63 ,  H01R2201/26 ,  H05K1/038 ,  H05K3/325 ,  H05K2201/0281 ,  H05K2201/10386 ,  H05K2201/10409

Abstract: A method and a structure of electrically connecting a conductive fiber in fabric to an external device electrically connects the conductive fiber to the external device by pressing a conductive member that is electrically connected to the external device against the fabric.

Abstract translation: 将织物中的导电纤维电连接到外部装置的方法和结构通过将与外部装置电连接的导电构件压靠在织物上而将导电纤维电连接到外部装置。

公开(公告)号：US20140191211A1

公开(公告)日：2014-07-10

申请号：US14110534

申请日：2012-03-23

Applicant: Peter Chabrecek ,  Uriel Sonderegger

Inventor： Peter Chabrecek ,  Uriel Sonderegger

IPC: H05K1/02 ,  H01L51/56 ,  H01L31/0224 ,  H05K1/18 ,  H01L51/00 ,  H01L33/38

CPC classification number: H05K1/0274 ,  D03D1/0088 ,  D10B2401/16 ,  H01L31/0224 ,  H01L33/38 ,  H01L51/0037 ,  H01L51/0096 ,  H01L51/0097 ,  H01L51/442 ,  H01L51/5203 ,  H01L51/56 ,  H01L2924/0002 ,  H05K1/038 ,  H05K1/095 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Electrode substrate for an optoelectronic device having a fabric (10) that includes electrically conductive (14; 56) as well as non-conductive (12; 50) and transparent fibres wherein the fabric is furnished over a wide area with a transparent, electrically conductive coating (26, 28, 58) in such manner that projecting or exposed portions of the electrically conductive fibres cooperate with the conductive coating in order to produce electrical contacts, wherein the conductive coating has a layer thickness that is smaller than a mean diameter of the electrically conductive and electrically non-conductive fibres of the fabric, a fabric weave of the electrically conductive fibres of the fabric is organized in such a manner that in order to create the protruding portions, the fibres encompass at least 2 of the non-conductive fibres that extend transversely in the manner of a twill weave, the fabric is embedded in the coating in such manner that portions (20; 22; 56) of the conductive fibres protrude from a non-conducting polymer material of the coating and/or are exposed, at least on one side of the coating, and the coating is applied to a polymeric, electrically non-conductive and transparent carrier film that is situated opposite the conductive coating that is applied to one side relative to the fabric.

Abstract translation: 用于具有包括导电（14; 56）以及非导电（12,50））和透明纤维的织物（10）的光电子器件的电极基底，其中所述织物被布置在具有透明，导电 涂层（26,28,58），使得导电纤维的突出或暴露部分与导电涂层配合以产生电接触，其中导电涂层的层厚度小于 织物的导电和非导电纤维，织物的导电纤维的织物组织以这样的方式组织，即为了产生突出部分，纤维包含至少2个非导电纤维 其以斜纹织造的方式横向延伸，织物以这样的方式嵌入涂层中，使得导电纤维的部分（20; 22; 56） 从涂层的非导电聚合物材料突出和/或暴露于涂层的至少一侧，并将涂层施加到与导电涂层相对的聚合物，非导电和透明的载体膜 其被施加到相对于织物的一侧。

公开(公告)号：US08642118B2

公开(公告)日：2014-02-04

申请号：US13144412

申请日：2009-12-18

Applicant: Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

Inventor： Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

IPC: B05D5/12 ,  B05D3/00

CPC classification number: H05K3/067 ,  B82Y10/00 ,  G02F1/13439 ,  H01L23/53276 ,  H01L31/022491 ,  H01L2924/0002 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2203/0766 ,  H01L2924/00

Abstract: The present invention can easily provide a method of manufacturing a pattern electrode with excellent electroconductivity and excellent transparency and a pattern electrode manufactured according to the method. The method of manufacturing a pattern electrode is characterized in that it comprises the steps of forming on a substrate an electroconductive layer containing metal nanowires, and carrying out pattern printing on the electroconductive layer employing a metal nanowire removing solution, followed by washing with water.

Abstract translation: 本发明可以容易地提供一种制造具有优异导电性和优异透明度的图案电极的方法和根据该方法制造的图案电极。 制造图案电极的方法的特征在于它包括以下步骤：在衬底上形成含有金属纳米线的导电层，并使用金属纳米线去除溶液在导电层上进行图案印刷，然后用水洗涤。