公开(公告)号：US20140362494A1

公开(公告)日：2014-12-11

申请号：US14361730

申请日：2011-12-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Tao Cheng ,  Qilin Chen ,  Zhou Jin

IPC: H01G4/20

CPC classification number: H01G9/07 ,  C08K3/24 ,  C08K7/08 ,  C08K7/14 ,  H01G4/203 ,  H01G9/042 ,  H01G9/055 ,  H01G9/15 ,  H05K1/0366 ,  H05K2201/0293

Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

Abstract translation: 本发明提供一种树脂组合物，其包含：1〜20重量份的增强纤维; 0.2〜5重量份的防沉降剂; 20〜40重量份的环氧树脂; 0.1〜3重量份的固化剂; 和50至75重量份的高介电常数填料。 本发明还提供由该树脂组合物制成的电介质层和包含电介质层的电容器。 在由本发明提供的树脂组合物制成的电介质层中，纤维可以均匀分散并且可以提高树脂组合物的机械强度，并与环氧树脂配合以提供优异的韧性。 因此，在PCB双面蚀刻工艺中使用电介质层时，可以显着提高所制造的电介质层的机械强度，并且可以有效克服其脆性。

公开(公告)号：US08710374B2

公开(公告)日：2014-04-29

申请号：US12360181

申请日：2009-01-27

Applicant: Kiyotaka Tsukada ,  Takamichi Sugiura

Inventor： Kiyotaka Tsukada ,  Takamichi Sugiura

IPC: H05K1/02

CPC classification number: H05K3/4661 ,  H05K1/0366 ,  H05K3/381 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/096

Abstract: A printed wiring board is manufactured by a method in which a core substrate having an insulation substrate and a conductive circuit formed on the insulation substrate is provided. An inner insulation layer is formed on the core substrate, and a surface of the inner insulation layer is treated to form a roughened portion on the surface. An outer insulation layer including a reinforcing material is formed on the surface of the inner insulation layer having the roughened portion.

Abstract translation: 通过设置具有绝缘基板和形成在绝缘基板上的导电电路的芯基板的方法制造印刷布线板。 在芯基板上形成内绝缘层，处理内绝缘层的表面以在表面上形成粗糙部分。 在具有粗糙部分的内绝缘层的表面上形成包括增强材料的外绝缘层。

公开(公告)号：US20130199825A1

公开(公告)日：2013-08-08

申请号：US13817825

申请日：2011-10-21

Applicant: Alex Bruderer ,  Norbert Galster ,  Jurgen Kress ,  Michel Probst

Inventor： Alex Bruderer ,  Norbert Galster ,  Jurgen Kress ,  Michel Probst

IPC: H05K3/00 ,  H05K1/03

CPC classification number: H05K3/0085 ,  H05K1/0313 ,  H05K3/0032 ,  H05K3/4673 ,  H05K2201/0112 ,  H05K2201/0195 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T29/49155 ,  Y10T428/24967

Abstract: Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (1), a resin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).

Abstract translation: 公开了用于制造印刷电路板，IC基板，芯片封装等的复合材料堆积材料。 复合材料堆积材料适用于嵌入诸如微孔，沟槽和垫的电路。 复合堆积材料包括载体层（1），没有增强层（2）的树脂层和具有加强层（3）的树脂层。 电路（9）嵌入树脂层而不加固（2）。

公开(公告)号：US20120034382A1

公开(公告)日：2012-02-09

申请号：US13202961

申请日：2009-05-25

Applicant: Andrea Baccini ,  Marco Galiazzo

Inventor： Andrea Baccini ,  Marco Galiazzo

IPC: B05D1/32 ,  B05C13/02 ,  B05C11/00 ,  B65G35/04 ,  B05C1/02

CPC classification number: H05K3/1216 ,  B41F15/20 ,  B41P2215/10 ,  H01L21/67715 ,  H05K3/0008 ,  H05K2201/0293 ,  H05K2203/0156 ,  H05K2203/0165 ,  H05K2203/082 ,  H05K2203/085

Abstract: The present invention provides a support material (137) used to support a substrate (150) during processing. The support material (137) comprises a non-woven material comprising a top region and a bottom region, wherein the top region (420) is less resilient than the bottom region (410). The non-woven material also has a first surface (141A) adjacent to the top region, and a first end and a second end. In some embodiments, the bottom region comprises a synthetic fabric and the top region comprises a polymeric material. Other embodiments of the invention include an apparatus and methods for processing substrates in a screen printing chamber that can deliver a repeatable and accurate screen printed pattern on one or more processed substrates using a non- woven support material. In one embodiment, the screen printing chamber is adapted to perform a screen printing process within a portion of a crystalline silicon solar cell production line in which a substrate is patterned with a desired material.

Abstract translation: 本发明提供了一种用于在加工过程中支撑基底（150）的支撑材料（137）。 支撑材料（137）包括包括顶部区域和底部区域的无纺材料，其中顶部区域（420）比底部区域（410）具有更小的弹性。 非织造材料还具有与顶部区域相邻的第一表面（141A），以及第一端部和第二端部。 在一些实施例中，底部区域包括合成织物，并且顶部区域包括聚合物材料。 本发明的其它实施例包括用于处理丝网印刷室中的基板的装置和方法，其可以使用非织造支撑材料在一个或多个处理的基板上传送可重复且准确的丝网印刷图案。 在一个实施例中，丝网印刷室适于在晶体硅太阳能电池生产线的一部分内进行丝网印刷工艺，其中基底被图案化所需的材料。

公开(公告)号：US20090286055A1

公开(公告)日：2009-11-19

申请号：US12092738

申请日：2006-11-08

Applicant: Behnam Pourdeyhimi ,  Edward Grant ,  H. Troy Nagle ,  Carey Reid Merritt ,  Burcak Karaguzel ,  Tae-Ho Kang ,  John Michael Wilson

Inventor： Behnam Pourdeyhimi ,  Edward Grant ,  H. Troy Nagle ,  Carey Reid Merritt ,  Burcak Karaguzel ,  Tae-Ho Kang ,  John Michael Wilson

IPC: B32B3/00 ,  B32B38/14

CPC classification number: H05K1/0393 ,  H01B5/14 ,  H05K1/028 ,  H05K1/03 ,  H05K1/038 ,  H05K3/125 ,  H05K3/281 ,  H05K2201/0293 ,  H05K2203/013 ,  Y10T428/24851

Abstract: Methods and devices for providing flexible electronics are described. In an exemplary embodiment of the present invention, a conductive ink is applied to a nonwoven substrate. More particularly, the exemplary embodiment provides a nonwoven substrate with a general depth in the z-direction and a conductive ink carried by the nonwoven substrate on the surface of the substrate and at least partially but no more than 50% within the nonwoven substrate in the z-direction.

Abstract translation: 描述了用于提供柔性电子装置的方法和装置。 在本发明的示例性实施例中，将导电油墨施加到非织造基底上。 更具体地，示例性实施例提供了在z方向上具有一般深度的非织造基底和由非织造基底承载在基底表面上的导电油墨，并且在非织造基底中的至少部分但不超过50％ z方向。

公开(公告)号：US20070160810A1

公开(公告)日：2007-07-12

申请号：US10586341

申请日：2005-01-13

Applicant: Fumihiro Hayashi ,  Yasuhito Masuda ,  Yasuhiro Okuda

Inventor： Fumihiro Hayashi ,  Yasuhito Masuda ,  Yasuhiro Okuda

IPC: B32B3/12 ,  B32B27/12 ,  B32B3/26

CPC classification number: B24C3/322 ,  B24C1/04 ,  B24C11/00 ,  C23C18/1605 ,  C23C18/1644 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/30 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/182 ,  H05K3/184 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/025 ,  H05K2203/0565 ,  Y10T428/24479 ,  Y10T428/24496 ,  Y10T428/24612 ,  Y10T428/249953 ,  Y10T428/249987 ,  Y10T442/674

Abstract: An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions. With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric. The invention provides a porous molded product or a nonwoven fabric in which a plated layer has been selectively formed on the surfaces of the through portions or the recessed portions, or both of these, an electric circuit component, or the like.

Abstract translation: 本发明的一个目的是提供一种多孔材料的制造方法，其中图形化了复杂而精细的通过部分，凹陷部分等。 提供一种图案化的多孔模制产品或非织造织物，其中已经在通孔部分和凹进部分的表面上选择性地形成镀层。 通过本发明，将具有图案部分的面罩放置在多孔成型品或无纺布的至少一侧。 含有磨粒的流体或流体从掩模上方喷射，从而形成通过部分或凹陷部分或两者，其中通过掩模的每个通过部分的开口形状被转移到多孔模制产品中 或无纺布。 本发明提供一种多孔成型体或非织造布，其中，在贯通部或凹部的表面，或这两者，电路部件等的表面上选择性地形成镀层。

公开(公告)号：US20070149001A1

公开(公告)日：2007-06-28

申请号：US11316473

申请日：2005-12-22

Applicant: Harshad Uka

Inventor： Harshad Uka

IPC: H05K1/00 ,  H01B13/00 ,  C23F1/00 ,  C23C26/00 ,  H05K3/00 ,  B05D5/12

CPC classification number: C23C26/00 ,  C23C28/00 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/0055 ,  H05K3/181 ,  H05K3/386 ,  H05K3/387 ,  H05K3/388 ,  H05K2201/0116 ,  H05K2201/029 ,  H05K2201/0293

Abstract: A flexible circuit and a method of fabricating the flexible circuit is provided wherein adhesive is flowed into the interstices of a fabric. The adhesive is then cured to a “B” stage and a conductive foil is bonded to the adhesive on one or both sides of the fabric. Thereafter, the adhesive may be fully cured. A conductive pattern may then be etched into the conductive foil via print and etch techniques. The conductive pattern may be protected with a cover layer. For example, the cover layer may be a base layer with adhesive flowed in its pores and fully cured. The adhesive may be effectively formulated to withstand stresses between the adhesive and the conductive pattern such that bending and flexing the flexible circuit or subjecting the flexible circuit to thermal stresses does not delaminate the bond between the adhesive and the conductive pattern. The adhesive resists delamination from the fabric because the adhesive has been flowed into the fabric's interstices and cured.

Abstract translation: 提供柔性电路和制造柔性电路的方法，其中粘合剂流入织物的间隙中。 然后将粘合剂固化到“B”阶段，并且将导电箔粘合到织物的一侧或两侧上的粘合剂上。 此后，粘合剂可以完全固化。 然后可以通过印刷和蚀刻技术将导电图案蚀刻到导电箔中。 导电图案可以用覆盖层保护。 例如，覆盖层可以是具有粘合剂在其孔中流动并完全固化的基底层。 可以有效地配制粘合剂以承受粘合剂和导电图案之间的应力，使得弯曲和弯曲柔性电路或使柔性电路经受热应力不会使粘合剂和导电图案之间的结合分层。 由于粘合剂已经流入织物的间隙并固化，所以粘合剂抵抗了织物的分层。

公开(公告)号：US20050136233A1

公开(公告)日：2005-06-23

申请号：US11050264

申请日：2005-02-03

Applicant: Michael Samuels ,  Subhotosh Khan ,  Mikhail Levit

Inventor： Michael Samuels ,  Subhotosh Khan ,  Mikhail Levit

IPC: D04H1/00 ,  D04H13/00 ,  H05K1/03 ,  B32B27/04 ,  B32B27/12

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/145 ,  B32B5/26 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2264/0221 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2307/7265 ,  B32B2457/08 ,  D21H27/30 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24942 ,  Y10T442/2066 ,  Y10T442/2484 ,  Y10T442/2861

Abstract: A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

公开(公告)号：US20050014035A1

公开(公告)日：2005-01-20

申请号：US10890329

申请日：2004-07-12

Applicant: Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

Inventor： Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

IPC: C08J5/04 ,  D04H1/42 ,  D04H13/00 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  C04B35/64 ,  B28B1/00 ,  B28B3/00 ,  B28B5/00 ,  B32B3/00 ,  B32B5/02 ,  B32B9/00 ,  C04B33/32 ,  C04B33/36 ,  D04H1/00 ,  D04H3/00 ,  D04H5/00 ,  H01R12/04 ,  H05K1/11

CPC classification number: H05K1/0366 ,  C08J5/046 ,  D04H1/4318 ,  D04H1/64 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T442/20

Abstract: A prepreg for a printed wiring board includes fluorocarbon fibers as a reinforcing material, and the reinforcing material is impregnated with a resin. The fluorocarbon fibers include short fibers having a branch structure. The reinforcing material includes a nonwoven fabric formed by interlacing the fluorocarbon fibers in the thickness direction. The proportion of the fluorocarbon fibers among the fibers constituting the nonwoven fabric ranges from 50 wt % to 100 wt %, and the remaining fibers are synthetic fibers or inorganic fibers. The nonwoven fabric is heat-treated at 330° C. to 390° C., then annealed at 200° C. to 270° C., and impregnated with the resin. This prepreg can used to provide a printed wiring board with low Interstitial Via Hole connection resistance and high connection stability and a method for manufacturing the printed wiring board.

Abstract translation: 用于印刷线路板的预浸料包括作为增强材料的氟碳纤维，并且增强材料用树脂浸渍。 氟碳纤维包括具有分支结构的短纤维。 增强材料包括通过使碳氟化合物纤维沿厚度方向交织而形成的无纺布。 构成无纺布的纤维中的氟碳纤维的比例为50重量％〜100重量％，剩余的纤维为合成纤维或无机纤维。 无纺布在330℃至390℃下热处理，然后在200℃下退火至270℃，并用树脂浸渍。 该预浸料可用于提供具有低间隙通孔连接电阻和高连接稳定性的印刷线路板以及印刷线路板的制造方法。

公开(公告)号：US06838401B1

公开(公告)日：2005-01-04

申请号：US10343605

申请日：2000-08-04

Applicant: Sadamitsu Murayama ,  Michikage Matsui ,  Masanori Wada ,  Shigeru Ishihara

Inventor： Sadamitsu Murayama ,  Michikage Matsui ,  Masanori Wada ,  Shigeru Ishihara

IPC: D21H13/26 ,  D04H1/42 ,  D04H1/4334 ,  D04H1/4342 ,  D04H1/54 ,  D04H1/549 ,  D04H1/58 ,  D04H1/64 ,  D21H13/24 ,  H05K1/03 ,  D02G3/00 ,  D21H13/00

CPC classification number: D04H1/4334 ,  D04H1/4342 ,  D04H1/549 ,  D04H1/64 ,  D21H13/24 ,  D21H13/26 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/2904 ,  Y10T428/2969 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69

Abstract: A heat-resistant fiber paper sheet which is formed from staple fibers made from a heat-resistant organic polymer, undrawn or low ratio drawn para-aromatic polyamide staple fibers, and an organic resin binder and/or fibrids comprising a heat-resistant organic polymer as main components, wherein the amount of said staple fibers is 45 to 97 percent by weight based on the total amount of said heat-resistant fiber paper sheet; the total amount of said organic resin binder and/or said fibrids is 3 to 55 percent by weight based on the total amount of said heat-resistant fiber paper sheet; and said organic resin binder is cured, and/or said undrawn or low ratio drawn para-aromatic polyamide staple fibers and said fibrids are partially softened, deformed and/or melted to exhibit the actions of binders. The obtained heat-resistant fiber paper sheet has excellent heat resistance, excellent heat dimensional stability, excellent plybond strength, an excellent electric insulating property in a high humidity, and the like, has good resin impregnability in spite of having a high bulk density, and is especially suitable for use as a substrate for electric insulating materials or as a substrate for laminates used for electric circuits.

Abstract translation: 由耐热有机聚合物，未拉伸或低比例拉伸的对 - 芳族聚酰胺短纤维制成的短纤维形成的耐热纤维纸片和包含耐热有机聚合物的有机树脂粘合剂和/或纤条体 作为主要成分，其中所述短纤维的量相对于所述耐热性纤维纸的总量为45〜97重量％ 所述有机树脂粘合剂和/或所述纤条体的总量相对于所述耐热纤维纸的总量为3〜55重量％ 并且所述有机树脂粘合剂固化，和/或所述未拉伸或低比例拉伸的对位芳族聚酰胺短纤维和所述纤维状物部分软化，变形和/或熔融以显示粘合剂的作用。 获得的耐热纤维纸片具有优异的耐热性，优异的热尺寸稳定性，优异的聚苯乙烯强度，高湿度下的优异的电绝缘性等，尽管具有高的堆积密度，但具有良好的树脂浸渍性，以及 特别适合用作电绝缘材料的基材或用作电路用层压体的基材。