公开(公告)号：US20140102774A1

公开(公告)日：2014-04-17

申请号：US13651789

申请日：2012-10-15

Applicant: RAYTHEON COMPANY

Inventor： Andrew K. Brown ,  Thomas L. Obert ,  Michael J. Sotelo ,  Darin M. Gritters ,  Kenneth W. Brown

IPC: H05K1/11 ,  H05K3/22

CPC classification number: H05K1/167 ,  H05K1/0234 ,  H05K1/0242 ,  H05K3/06 ,  H05K2201/0379 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2201/09781

Abstract: An apparatus for conveying an electrical signal includes: a conductive pathway having a conductive material. The conductive material has a first edge and a second edge and is configured to convey the electrical signal. The apparatus also includes a resistive material in contact with at least a portion of the conductive pathway, covering an edge of the conductive pathway, and extending beyond the edge. The resistive material has a conductivity less than the conductivity of the conductive material.

Abstract translation: 用于传送电信号的装置包括：具有导电材料的导电路径。 导电材料具有第一边缘和第二边缘，并且被配置为传送电信号。 该装置还包括与导电路径的至少一部分接触的电阻材料，覆盖导电路径的边缘并且延伸超过边缘。 电阻材料的导电率小于导电材料的导电率。

公开(公告)号：US08633584B2

公开(公告)日：2014-01-21

申请号：US12550327

申请日：2009-08-28

Applicant: Peter C. Salmon

Inventor： Peter C. Salmon

IPC: H01L23/053

CPC classification number: H05K3/363 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05573 ,  H01L2224/11332 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3651 ,  H05K1/0289 ,  H05K1/115 ,  H05K3/007 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/4015 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0568 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599

Abstract: This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths as narrow as 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is preferably used to fabricate the interconnection circuits. A multi-layer interconnection circuit is fabricated on the glass panel using a release layer. A special assembly layer is formed over the interconnection circuit comprising a thick dielectric layer with openings formed at input/output (I/O) pad locations. Solder paste is deposited in the openings using a squeegee to form wells filled with solder. IC chips are provided with gold stud bumps at I/O pad locations, and these bumps are inserted in the wells to form flip chip connections. The IC chips are tested and reworked. The same bump/well connections can be used to attach fine-pitch cables. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server or supercomputer embodiment is also described.

Abstract translation: 本说明书描述了用于制造电子系统模块的技术。 该模块包括具有窄至5微米或更小的迹线宽度的柔性多层互连电路。 与用于制造液晶显示器，LCD，面板的玻璃面板制造设备相似，优选地用于制造互连电路。 使用剥离层在玻璃面板上制造多层互连电路。 在互连电路上形成特殊的组装层，该电路包括在输入/输出（I / O）焊盘位置处形成有开口的厚电介质层。 使用刮刀将焊膏沉积在开口中以形成填充有焊料的孔。 IC芯片在I / O焊盘位置处设有金柱凸起，并且这些凸块插入孔中以形成倒装芯片连接。 IC芯片经过测试和返工。 相同的凹凸/连接可用于连接细间距电缆。 提供模块封装层用于密封和电磁屏蔽。 还描述了刀片服务器或超级计算机实施例。

公开(公告)号：US08581407B2

公开(公告)日：2013-11-12

申请号：US12414502

申请日：2009-03-30

Applicant: Peter C. Salmon

Inventor： Peter C. Salmon

IPC: H01L23/485

CPC classification number: H01L24/16 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/25 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0289 ,  H05K1/115 ,  H05K3/007 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/4682 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0568 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/20751 ,  H01L2924/00

Abstract: This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths of 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is used to fabricate the interconnection circuits. A polymer base layer is formed on a glass carrier with an intermediate release layer. Alternate layers of metal and dielectric are formed on the base layer, and patterned to create an array of multi-layer interconnection circuits on the glass panel. A thick layer of polymer is deposited on the interconnection circuit, and openings formed at input/output (I/O) pad locations. Solder paste is deposited in the openings to form wells filled with solder. After dicing the glass carrier to form separated interconnection circuits, IC chips are stud bumped and assembled using flip chip bonding, wherein the stud bumps on the components are inserted into corresponding wells on the interconnection circuits. The IC chips are tested and reworked to form tested circuit assemblies. Methods for connecting to testers and to other modules and electronic systems are described. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server embodiment is also described.

公开(公告)号：US08541299B2

公开(公告)日：2013-09-24

申请号：US12787527

申请日：2010-05-26

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 电互连形成方法。 电互连包括包括第一导电焊盘的第一衬底，包括第二导电焊盘的第二衬底以及将第一导电焊盘电连接和机械地连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US08273458B2

公开(公告)日：2012-09-25

申请号：US13166591

申请日：2011-06-22

Applicant: Itsuo Watanabe ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

Inventor： Itsuo Watanabe ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC: B32B27/38

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  H01L2924/00

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract translation: 一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份 粘合剂树脂组合物。

公开(公告)号：US20120220117A1

公开(公告)日：2012-08-30

申请号：US13463855

申请日：2012-05-04

Applicant: Timothy H. Daubenspeck ,  Jeffrey P. Gambino ,  Christopher D. Muzzy ,  Wolfgang Sauter ,  Timothy D. Sulliwan

Inventor： Timothy H. Daubenspeck ,  Jeffrey P. Gambino ,  Christopher D. Muzzy ,  Wolfgang Sauter ,  Timothy D. Sulliwan

IPC: H01L21/283

CPC classification number: H01L23/49816 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/11822 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/17051 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10674 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A method of connecting chips to chip carriers, ceramic packages, etc. (package substrates) forms smaller than usual first solder balls and polymer pillars on the surface of a semiconductor chip and applies adhesive to the distal ends of the polymer pillars. The method also forms second solder balls, which are similar in size to the first solder balls, on the corresponding surface of the package substrate to which the chip will be attached. Then, the method positions the surface of the semiconductor chip next to the corresponding surface of the package substrate. The adhesive bonds the distal ends of the polymer pillars to the corresponding surface of the package substrate. The method heats the first solder balls and the second solder balls to join the first solder balls and the second solder balls into solder pillars.

Abstract translation: 将芯片与芯片载体，陶瓷封装等（封装基板）连接的方法比半导体芯片表面上的通常的第一焊球和聚合物柱形成更小，并且将粘合剂施加到聚合物柱的远端。 该方法还形成与芯片将附接到的封装衬底的相应表面上尺寸相似的第二焊球。 然后，该方法将半导体芯片的表面定位在封装衬底的相应表面的旁边。 粘合剂将聚合物柱的末端粘合到包装基底的相应表面上。 该方法加热第一焊球和第二焊球以将第一焊球和第二焊球接合成焊料柱。

公开(公告)号：US08252635B2

公开(公告)日：2012-08-28

申请号：US12786314

申请日：2010-05-24

Applicant: Peter C. Salmon

Inventor： Peter C. Salmon

IPC: H01L21/60

CPC classification number: H05K3/363 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05573 ,  H01L2224/11332 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3651 ,  H05K1/0289 ,  H05K1/115 ,  H05K3/007 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/4015 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0568 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A trace routing method for a multi-layer interconnection circuit includes the steps of providing stacked contacts with trace stubs at input/output pads of said interconnection circuit, and limiting contacts between conductive layers to two-level contacts in routing areas where maximum routing density is desired.

Abstract translation: 用于多层互连电路的迹线布线方法包括以下步骤：在所述互连电路的输入/输出焊盘处提供具有迹线短截线的堆叠触点，以及将导电层之间的触点限制在路由区域中的两级触点，其中最大路由密度为 想要的

公开(公告)号：US20120085580A1

公开(公告)日：2012-04-12

申请号：US13377998

申请日：2010-06-04

Applicant: Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

Inventor： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Yasuhiro Okuda

IPC: H01R4/00 ,  B23K1/00 ,  C09J9/02 ,  B32B37/12

CPC classification number: H05K3/323 ,  C09J9/02 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H05K3/282 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/0379 ,  Y10T156/10 ,  H01L2924/00

Abstract: By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

Abstract translation: 通过使用导电粘合剂将具有用作防氧化膜的有机膜的连接电极连接在一起，可以简化制造工艺，并且可以以低成本构建高可靠性的连接结构。 一种电极连接方法，其中第一连接电极2和第二连接电极10通过介于电极之间的导电粘合剂9连接在一起，包括至少形成有机膜6的有机膜形成步骤 第一连接电极的表面和电极连接步骤，其中第一连接电极和第二连接电极通过导电粘合剂连接在一起。 在电极连接工序中，通过使在导电性粘合剂中混合的有机膜分解成分作用于有机膜，有机膜分解，从而进行连接电极之间的连接。

公开(公告)号：US08134080B2

公开(公告)日：2012-03-13

申请号：US11477935

申请日：2006-06-30

Applicant: Jun Ishii ,  Yasuhito Ohwaki ,  Yasuhito Funada

Inventor： Jun Ishii ,  Yasuhito Ohwaki ,  Yasuhito Funada

IPC: H05K1/09

CPC classification number: H05K3/38 ,  H05K1/056 ,  H05K3/06 ,  H05K3/205 ,  H05K3/44 ,  H05K2201/0379 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/2072 ,  H05K2203/0323

Abstract: A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.

Abstract translation: 一种布线电路板，其能够以简单的结构提供在金属支撑板上形成的开口的边缘部分处的金属支撑板的增强的附着，以防止金属支撑板的剥离。 在具有电路的悬挂板中，为了减少导电图案的传输损耗，嵌入绝缘基底层中的金属箔以包括第一金属箔部分和围绕第一金属箔的第二金属箔部分的图案形成 部分间隔开，并且在金属支撑板上形成开口，使得开口的边缘部分位于第一金属箔部分和第二金属箔部分之间的空间中。

公开(公告)号：US20120043386A1

公开(公告)日：2012-02-23

申请号：US13138918

申请日：2010-04-28

Applicant: Hiroyoshi Gotou

Inventor： Hiroyoshi Gotou

IPC: G06K19/077 ,  H01P11/00 ,  H01Q7/00

CPC classification number: G06K19/07783 ,  G06K19/07754 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10098 ,  H05K2203/0195 ,  H05K2203/107 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: A method for manufacturing an antenna sheet, includes: a pressing step in which an overlapped portion of an antenna coil and/or a connection pattern formed from a metal material and provided on one surface of a substrate formed from a thermoplastic resin, and a conductive member formed from a metal material and provided on the other surface of the substrate is pressed using a pressing unit at least from the surface of one side of the substrate; and a welding steps in which the overlapped portion of the antenna coil and/or the connection pattern and the conductive member is welded.

Abstract translation: 一种天线片的制造方法，其特征在于，包括：加压工序，在所述加压工序中，将由天线线圈和/或由金属材料形成的连接图案的重叠部分设置在由热塑性树脂形成的基板的一个表面上， 由金属材料形成的并且设置在基板的另一个表面上的部件至少从基板的一侧的表面使用压制单元进行加压; 以及其中焊接天线线圈和/或连接图案和导电构件的重叠部分的焊接步骤。