公开(公告)号：US07377030B2

公开(公告)日：2008-05-27

申请号：US11266480

申请日：2005-11-04

Applicant: Takashi Shuto ,  Kenji Takano ,  Kenji Ilda ,  Kenichiro Abe ,  Keiji Arai ,  Kiyotaka Seyama

Inventor： Takashi Shuto ,  Kenji Takano ,  Kenji Ilda ,  Kenichiro Abe ,  Keiji Arai ,  Kiyotaka Seyama

IPC: H05K3/36

CPC classification number: H01L21/6835 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/183 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0391 ,  H05K2201/068 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/016 ,  H05K2203/061 ,  H05K2203/085 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  H01L2224/0401

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract translation: 本发明涉及一种制造布线板的方法，包括：堆叠层，其中布线图案用绝缘层堆叠; 以及与所述堆积层分开形成的芯基板，所述方法包括以下步骤：在板状支撑体上可分离地形成所述堆积层; 将芯基板电连接到支撑体上的堆积层的布线图案; 并且从堆积层移除支撑体以形成其中堆积层连接到芯基板的布线板。 通过可分离地形成积层和芯基板，可以制造有效显示其特性的布线板。

公开(公告)号：US20080107884A1

公开(公告)日：2008-05-08

申请号：US11709680

申请日：2007-02-23

Applicant: Kuen Yuan Hwang ,  An Pang Tu ,  Sheng Yen Wu ,  Te Yu Lin

Inventor： Kuen Yuan Hwang ,  An Pang Tu ,  Sheng Yen Wu ,  Te Yu Lin

IPC: B32B27/32

CPC classification number: B32B15/08 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/269 ,  Y10T428/31681

Abstract: The present invention relates to a polyimide composite flexible board and a process for preparing the same. The process comprises sequentially applying polyamic acids individually having a coefficient of thermal expansion (CTE) after imidization of more than 20 ppm and less than 20 ppm on a metal foil, subsequently subjecting the polyamic acids to imidization into polyimide by heating, to produce a polyimide composite flexible board, which is used as a printed circuit flexible board.According to the present invention, it can obtain a polyimide composite flexible board having an excellent mechanical property, high heat resistance, and excellent dimension stability, and no warp without using an adhering agent.

Abstract translation: 本发明涉及一种聚酰亚胺复合柔性板及其制备方法。 该方法包括在金属箔上亚胺化大于20ppm且小于20ppm之后分别具有热膨胀系数（CTE）的聚酰胺酸，随后通过加热将聚酰胺酸酰亚胺化成聚酰亚胺，以制备聚酰亚胺 复合柔性板，用作印刷电路柔性板。 根据本发明，可以得到机械性能优异，耐热性高，尺寸稳定性优异的聚酰亚胺复合柔性基板，无需使用粘合剂即可不翘曲。

公开(公告)号：US20080054446A1

公开(公告)日：2008-03-06

申请号：US11977980

申请日：2007-10-26

Applicant: Mitul Modi ,  Patricia Brusso ,  Ruben Cadena ,  Carolyn McCormick ,  Sankara Subramanian

Inventor： Mitul Modi ,  Patricia Brusso ,  Ruben Cadena ,  Carolyn McCormick ,  Sankara Subramanian

IPC: H01L23/12 ,  H05K7/00

CPC classification number: H01L23/145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/068 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An IC package is disclosed that comprises a core region disposed between upper and lower build-up layer regions. In one embodiment, the core region comprises a low modulus material. In an alternative embodiment the core region comprises a medium modulus material. In an alternative embodiment, the core material is selected based upon considerations such as it modulus, its coefficient of thermal expansion, and/or the resulting total accumulated strain. In an alternative embodiment, boundaries with respect to the softness of the core material are established be considering the reflective density in opposing conductive build-up layers above and below the core region.

Abstract translation: 公开了一种IC封装，其包括设置在上部和下部积聚层区域之间的芯区域。 在一个实施例中，芯区域包括低模量材料。 在替代实施例中，芯区域包括中等模量材料。 在替代实施例中，基于诸如其模量，其热膨胀系数和/或所得到的总累积应变的考虑来选择芯材料。 在替代实施例中，考虑到核心区域上方和下方的相对的导电堆积层中的反射密度，建立了关于芯材料的柔软度的边界。

公开(公告)号：US20080044639A1

公开(公告)日：2008-02-21

申请号：US11758782

申请日：2007-06-06

Applicant: Kwok Pong Chan ,  Erik Hagberg ,  Tara J. Mullen ,  Roy Ray Odle

Inventor： Kwok Pong Chan ,  Erik Hagberg ,  Tara J. Mullen ,  Roy Ray Odle

IPC: C08G69/26 ,  B32B5/00 ,  C08K3/34

CPC classification number: H05K1/0346 ,  B82Y30/00 ,  C08G73/1007 ,  C08J5/005 ,  C08J5/18 ,  C08J2379/08 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/068

Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4′-oxydiphthalic dianhydride, 3,3′-oxydiphthalic dianhydride, 4,4′-oxydiphthalic dianhydride, and combinations thereof, with a diamine component wherein the polyimide has a glass transition temperature of at least 190° C.; wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, and less than 5% residual solvent by weight; wherein the polyimide has less than 15 molar % of structural units derived from a member selected from the group consisting of biphenyltetracarboxylic acid, a dianhydride of biphenyltetracarboxylic acid, an ester of biphenyltetracarboxylic acid, and a combination thereof.

Abstract translation: 溶剂流延膜包括聚酰亚胺，其包含衍生自二酐组分的聚合的结构单元，所述二酐组分包含二酐，其选自3,4'-氧二邻苯二甲酸二酐，3,3'-氧联二邻苯二甲酸二酐，4,4'-氧联二邻苯二甲酸二酐， 和其组合与二胺组分，其中聚酰亚胺的玻璃化转变温度至少为190℃; 其中所述膜具有小于60ppm /℃的热膨胀系数，0.1至250微米的厚度和小于5重量％的残留溶剂; 其中所述聚酰亚胺具有少于15摩尔％的衍生自选自联苯四羧酸，联苯四羧酸的二酐，联苯四羧酸的酯及其组合的成员的结构单元。

公开(公告)号：US07321099B2

公开(公告)日：2008-01-22

申请号：US10921196

申请日：2004-08-19

Applicant: Kinuko Mishiro

Inventor： Kinuko Mishiro

IPC: H05K1/16

CPC classification number: H01L24/32 ,  H01L23/04 ,  H01L23/13 ,  H01L23/562 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/19106 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10674 ,  H01L2924/10155 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

Abstract: To provide a component mounting substrate and a component mounting structure which absorb stresses caused by impact or by the difference in the thermal extension coefficient between substrate and component, without increasing the required accuracy in soldering the substrate and the component together. The substrate, which is to be mounted with a component having one or more solder joints via which the component is connected to the substrate, has a depressed part thereof formed on its component side, on which one or more electrodes are provided to be closely joined with the solder joints. The depressed part is filled with a filling material with rigidity different from that of a material making up the substrate body, such that the filling material is flush or almost flush with the surface of the component side of the substrate.

Abstract translation: 为了提供吸收由冲击引起的应力的部件安装基板和部件安装结构，或者基板和部件之间的热延伸系数的差异，而不增加将基板和部件焊接在一起所需的精度。 要安装有具有一个或多个焊接点的部件的基板，部件连接到基板上，其部件形成在其部件侧上，其上设置有一个或多个电极以紧密连接 与焊点。 凹陷部分填充有与构成基体的材料的刚性不同的填充材料，使得填充材料与基材的部件侧的表面齐平或几乎齐平。

公开(公告)号：US20080002374A1

公开(公告)日：2008-01-03

申请号：US11637911

申请日：2006-12-13

Applicant: Kenji Fukuzono ,  Toshihisa Sato ,  Yuki Samejima

Inventor： Kenji Fukuzono ,  Toshihisa Sato ,  Yuki Samejima

IPC: H05K1/00 ,  B29C65/00

CPC classification number: H01L23/49833 ,  H01L21/4857 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0271 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/068 ,  Y10T156/10 ,  H01L2224/0401

Abstract: A manufacturing method for a substrate with a stiffener is disclosed, the substrate being capable of ensuring a good flatness of a printed board when heated to a high temperature and then cooled. The method comprises a first step of preparing a printed board and a stiffener, the printed board including a wiring part and an insulating part formed of an organic insulating material, and the stiffener being formed of a material with a smaller coefficient of thermal expansion than that of the material of the printed board, and a second step of bonding the printed board and the stiffener with a thermosetting adhesive. In the second step, a curing process temperature for curing the thermosetting adhesive is equal to or higher than the glass transition point of the organic insulating material.

Abstract translation: 公开了一种具有加强件的基板的制造方法，该基板能够确保当加热至高温然后冷却时印刷板的良好平整度。 该方法包括制备印刷板和加强件的第一步骤，印刷板包括布线部分和由有机绝缘材料形成的绝缘部分，加强件由热膨胀系数小的材料形成。 的印刷电路板的材料，以及用热固性粘合剂粘合印刷电路板和加强件的第二步骤。 在第二步骤中，用于固化热固性粘合剂的固化过程温度等于或高于有机绝缘材料的玻璃化转变点。

公开(公告)号：US20070278647A1

公开(公告)日：2007-12-06

申请号：US11838431

申请日：2007-08-14

Applicant: Yoshihiro MORITA

Inventor： Yoshihiro MORITA

IPC: H01L23/02

CPC classification number: H05K1/0271 ,  H01L23/16 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/0061 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/10598 ,  H05K2201/10734 ,  H05K2201/2009

Abstract: A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.

Abstract translation: 一种封装板模块，其中诸如LSI的半导体芯片安装在封装板的顶侧表面上，以及封装安装模块，其中封装板安装在大型计算机等的主板上。 用于支撑包装板的加强件和/或用于支撑母板的加强件各自具有双金属结构，其中具有相互不同的热膨胀系数的第一构件和第二构件分别彼此粘合，以便使加强件翘曲 与由温度变化引起的封装板和母板的翘曲一致，从而防止在焊接部分中产生应力。

公开(公告)号：US07301228B2

公开(公告)日：2007-11-27

申请号：US10725993

申请日：2003-12-03

Applicant: Ryosuke Usui ,  Hideki Mizuhara ,  Yusuke Igarashi ,  Noriaki Kojima ,  Noriaki Sakamoto

Inventor： Ryosuke Usui ,  Hideki Mizuhara ,  Yusuke Igarashi ,  Noriaki Kojima ,  Noriaki Sakamoto

IPC: H01L23/04 ,  H01R9/09

CPC classification number: H01L21/6835 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K1/024 ,  H05K3/205 ,  H05K3/4676 ,  H05K3/4682 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: The present invention provides a low-profile and light-weight semiconductor device having improved product reliability and higher frequency performance. A multi-layer interconnect line structure is disposed just under circuit devices 410a and 410b. An Interlayer insulating film 405 that composes a part of the multi-layer interconnect line structure is formed of a material having a relative dielectric constant within a range from 1.0 to 3.7, and a dielectric loss tangent within a range from 0.0001 to 0.02.

Abstract translation: 本发明提供一种具有改进的产品可靠性和更高频率性能的低轮廓和轻量级的半导体器件。 多层互连线结构正好位于电路器件410a和410b的正下方。 组成多层互连线结构的一部分的层间绝缘膜405由相对介电常数为1.0〜3.7，介电损耗角正切为0.0001〜0.02的材料形成。

公开(公告)号：US07301105B2

公开(公告)日：2007-11-27

申请号：US11214690

申请日：2005-08-29

Applicant: Kalu K. Vasoya

Inventor： Kalu K. Vasoya

IPC: H05K1/03 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC classification number: H05K3/4641 ,  H05K1/0271 ,  H05K1/0366 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2203/063

Abstract: Printed wiring boards are disclosed that include regions having different coefficients of thermal expansion. In one aspect of the invention, the regions can be matched to the coefficients of thermal expansion of devices mounted on the printed wiring board. In one embodiment, the invention includes a layer including a base material and at least one insert material that are combined using a resin. In addition, the base material and insert material are located within the same plane.

Abstract translation: 公开了包括具有不同热膨胀系数的区域的印刷线路板。 在本发明的一个方面，这些区域可以与安装在印刷线路板上的装置的热膨胀系数相匹配。 在一个实施方案中，本发明包括包含基材和使用树脂组合的至少一种嵌入材料的层。 此外，基材和插入材料位于同一平面内。

公开(公告)号：US20070262387A1

公开(公告)日：2007-11-15

申请号：US11798152

申请日：2007-05-10

Applicant: Kenichi Nonaka ,  Takeshi Kato ,  Kenji Oogushi ,  Yoshihiko Higashidani ,  Yoshimitsu Saito ,  Kenji Okamoto

Inventor： Kenichi Nonaka ,  Takeshi Kato ,  Kenji Oogushi ,  Yoshihiko Higashidani ,  Yoshimitsu Saito ,  Kenji Okamoto

IPC: H01L23/62

CPC classification number: H01L23/057 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/38 ,  H05K2201/0355 ,  H05K2201/068 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A power semiconductor module having an integral circuit board with a metal substrate electrode, an insulation substrate and a heat sink joined is disclosed. A SiC semiconductor power device is joined to a top of the metal substrate electrode of the circuit board. A difference in average coefficients of thermal expansion between constituent materials of the circuit board in a temperature range from room to joining time temperatures is 2.0 ppm/° C. or less, and a difference in expansion, produced by a difference between a lowest operating temperature and a joining temperature, of the circuit-board constituent materials is 2,000 ppm or less.

Abstract translation: 公开了具有金属基板电极，绝缘基板和散热片接合的集成电路板的功率半导体模块。 SiC半导体功率器件接合到电路板的金属衬底电极的顶部。 在从室温到接合时间温度的温度范围内，电路板的构成材料的平均热膨胀系数的差异为2.0ppm /℃以下，膨胀差由最低工作温度 并且电路板构成材料的接合温度为2000ppm以下。