公开(公告)号：US20150022872A1

公开(公告)日：2015-01-22

申请号：US14382734

申请日：2013-02-21

Applicant: Lemoptix SA

Inventor： Faouzi Khechana ,  Nicolas Abele

IPC: G02B26/08 ,  B81C3/00

CPC classification number: G02B26/085 ,  B81B7/007 ,  B81B2201/042 ,  B81B2207/098 ,  B81C1/00214 ,  B81C1/00873 ,  B81C3/005 ,  B81C2203/054 ,  B81C2203/057 ,  G02B7/1821 ,  G02B26/0833 ,  G02B26/105 ,  G03B21/008 ,  H01L2224/48091 ,  H01L2924/1461 ,  H05K1/0269 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/189 ,  H05K3/328 ,  H05K3/34 ,  H05K2201/083 ,  H05K2201/10083 ,  H05K2203/049 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to the present invention there is provided a method of manufacturing a MEMS micro mirror assembly (250), comprising the step of mounting a PCB board (205) on a metallic plate (206), mounting a MEMS device (240) on the PCB board (205), wherein the MEMS device (240) comprises a MEMS die (241) and a magnet (230).

Abstract translation: 根据本发明，提供了一种制造MEMS微镜组件（250）的方法，包括将PCB板（205）安装在金属板（206）上的步骤，将MEMS器件（240）安装在PCB上 板（205），其中MEMS器件（240）包括MEMS管芯（241）和磁体（230）。

公开(公告)号：US08928834B2

公开(公告)日：2015-01-06

申请号：US13380901

申请日：2011-12-05

Applicant: Chong Huang

Inventor： Chong Huang

IPC: G02F1/1333

CPC classification number: H05K3/0061 ,  G02F1/133308 ,  G02F2001/133314 ,  G02F2001/133322 ,  G02F2001/133325 ,  H05K2201/083 ,  H05K2201/09063 ,  H05K2203/104 ,  H05K2203/167

Abstract: A printed circuit board (PCB) and an LCD (liquid crystal display) module are disclosed. The PCB comprises at least one magnetic hole and at least one magnetic element, and the at least one magnetic element is fixedly disposed in the at least one magnetic hole. The LCD module comprises a backplate and a PCB. The PCB is fixed to the backplate by means of at least one magnetic element, and comprises at least one magnetic hole and the at least one magnetic element fixedly disposed in the at least one magnetic hole. The PCB and the LCD module of the present disclosure can improve the efficiency of fixing and assembling the PCB of the LCD module, make it convenient to re-process and assemble the LCD module and reduce the complexity of the backplate structure. Thereby, the production efficiency is greatly improved.

Abstract translation: 公开了印刷电路板（PCB）和LCD（液晶显示器）模块。 所述PCB包括至少一个磁性孔和至少一个磁性元件，并且所述至少一个磁性元件固定地设置在所述至少一个磁性孔中。 LCD模块包括背板和PCB。 PCB通过至少一个磁性元件固定到背板，并且包括至少一个磁性孔和固定地设置在至少一个磁性孔中的至少一个磁性元件。 本公开的PCB和LCD模块可以提高LCD模块的PCB的固定和组装效率，使得LCD模块的重新处理和组装方便，降低了背板结构的复杂性。 从而大大提高了生产效率。

公开(公告)号：US20140085837A1

公开(公告)日：2014-03-27

申请号：US13922493

申请日：2013-06-20

Applicant: SNU R&DB FOUNDATION

Inventor： Yongtaek Hong ,  Sangwoo Kim

IPC: H01B1/20 ,  H01B13/00 ,  H05K1/09

CPC classification number: H01B1/20 ,  H01B1/22 ,  H01B13/00 ,  H05K1/0283 ,  H05K1/09 ,  H05K1/092 ,  H05K1/189 ,  H05K2201/0314 ,  H05K2201/083 ,  H05K2203/104

Abstract: A flexible conduction trace includes a flexible line; and a plurality of conductive particles arranged in the form of pillars within the flexible line.

Abstract translation: 灵活的导电迹线包括柔性线; 以及在柔性线内以柱状的形式布置的多个导电颗粒。

公开(公告)号：US20130319547A1

公开(公告)日：2013-12-05

申请号：US13980677

申请日：2012-01-23

Applicant: Lienhard Pagel ,  Stefan Gassmann

Inventor： Lienhard Pagel ,  Stefan Gassmann

IPC: F16K17/00

CPC classification number: F16K17/00 ,  A61M13/003 ,  A61M16/20 ,  A61M16/202 ,  A61M16/209 ,  A61M2205/3331 ,  B01J2219/0027 ,  H05K1/0272 ,  H05K2201/083 ,  Y10T137/7793

Abstract: The present invention concerns a circuit board (100) having at least one fluid passage (110) arranged in the interior of a circuit board (100), having a fluid passage opening (120) which is arranged on a surface of the circuit board (100) and which leads to the fluid passage (110, and a multi-part pressure-relief valve arrangement (200) for reducing an excess pressure in the fluid passage (110), which includes a first magnet (210), a second magnet (220) and a sealing closure (230), wherein the first magnet (210) and the second magnet (220) are so arranged that they press the sealing closure (230) on to the fluid passage opening (2120) by a magnetic force (250) afforded by the first magnet (210) and by the second magnet (220).

Abstract translation: 本发明涉及一种具有布置在电路板（100）内部的至少一个流体通道（110）的电路板（100），其具有布置在电路板表面上的流体通道开口（120） 100），并且其导致流体通道（110）和用于减少流体通道（110）中的过大压力的多部分减压阀装置（200），其包括第一磁体（210），第二磁体 （220）和密封闭合件（230），其中所述第一磁体（210）和所述第二磁体（220）被布置成使得它们通过磁力将所述密封封闭件（230）按压到所述流体通道开口（2120） （250）由第一磁体（210）和第二磁体（220）提供。

公开(公告)号：US20130201637A1

公开(公告)日：2013-08-08

申请号：US13574789

申请日：2011-01-31

Applicant: Margaretha Maria De Kok ,  Jeroen Van Den Brand ,  Gerardus Titus Van Heck

Inventor： Margaretha Maria De Kok ,  Jeroen Van Den Brand ,  Gerardus Titus Van Heck

IPC: H05K1/02 ,  H05K13/04 ,  H05B33/08

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40), wherein the tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier, and the tiles overlay according to a fish scale pattern.

Abstract translation: 具有载体（40）的多个瓦片（1）的组件，其中瓦片（1）包括具有电 - 物理换能器（10）的箔（20）和到所述换能器的电连接器（24,28）。 瓦片机械地和电耦合到载体上，并且瓦片根据鱼鳞图案覆盖。

公开(公告)号：US20130163142A1

公开(公告)日：2013-06-27

申请号：US13771022

申请日：2013-02-19

Applicant: Haixiao Sun

Inventor： Haixiao Sun

IPC: H01G13/00 ,  H01G2/02

CPC classification number: H01G13/00 ,  H01G2/02 ,  H01L2924/0002 ,  H05K3/244 ,  H05K3/303 ,  H05K3/3442 ,  H05K2201/083 ,  H05K2201/10909 ,  H05K2203/043 ,  Y02P70/613 ,  Y10T428/24826 ,  H01L2924/00

Abstract: A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component bonded to the substrate by way of the solidified solder and including a magnetic layer disposed on a substrate side thereof, the magnetic layer being adapted to cooperate with the ferromagnetic material in the bonding pads to establish a magnetic force of a sufficient magnitude to hold the surface mount component on the substrate before and during soldering.

Abstract translation: 微电子组件，表面安装部件和提供表面安装部件的方法。 组件包括：具有设置在其安装表面上的接合焊盘的衬底，所述接合焊盘在其中包括铁磁材料; 设置在接合焊盘上的固化焊料; 以及表面安装部件，其通过固化的焊料结合到基板，并且包括设置在其基板侧上的磁性层，所述磁性层适于与焊盘中的铁磁材料配合以建立足够的磁力 在焊接之前和期间将表面安装部件保持在基板上。

公开(公告)号：US08378228B2

公开(公告)日：2013-02-19

申请号：US12839091

申请日：2010-07-19

Applicant: Haixiao Sun

Inventor： Haixiao Sun

IPC: H05K1/11

CPC classification number: H01G13/00 ,  H01G2/02 ,  H01L2924/0002 ,  H05K3/244 ,  H05K3/303 ,  H05K3/3442 ,  H05K2201/083 ,  H05K2201/10909 ,  H05K2203/043 ,  Y02P70/613 ,  Y10T428/24826 ,  H01L2924/00

Abstract: A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component bonded to the substrate by way of the solidified solder and including a magnetic layer disposed on a substrate side thereof, the magnetic layer being adapted to cooperate with the ferromagnetic material in the bonding pads to establish a magnetic force of a sufficient magnitude to hold the surface mount component on the substrate before and during soldering.

Abstract translation: 微电子组件，表面安装部件和提供表面安装部件的方法。 组件包括：具有设置在其安装表面上的接合焊盘的衬底，所述接合焊盘在其中包括铁磁材料; 设置在接合焊盘上的固化焊料; 以及表面安装部件，其通过固化的焊料结合到基板，并且包括设置在其基板侧上的磁性层，所述磁性层适于与焊盘中的铁磁材料配合以建立足够的磁力 在焊接之前和期间将表面安装部件保持在基板上。

公开(公告)号：US08304054B2

公开(公告)日：2012-11-06

申请号：US13274851

申请日：2011-10-17

Applicant: Xinhe Tang ,  Ka Chun Tse ,  Ernst Hammel ,  Ben Zhong Tang

Inventor： Xinhe Tang ,  Ka Chun Tse ,  Ernst Hammel ,  Ben Zhong Tang

IPC: B32B5/12 ,  B32B27/38 ,  C08L63/00 ,  C08L67/00 ,  H01F1/42

CPC classification number: C09J163/00 ,  B32B7/12 ,  B32B9/005 ,  B32B9/041 ,  B32B15/20 ,  B32B27/20 ,  B32B27/36 ,  B32B27/38 ,  B32B2250/40 ,  B32B2255/26 ,  B32B2262/02 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2307/208 ,  B32B2307/302 ,  B82Y10/00 ,  B82Y30/00 ,  C08K7/02 ,  C08K2201/011 ,  C09J11/00 ,  H01L23/373 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/386 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/24 ,  Y10T428/24058 ,  Y10T428/24132 ,  Y10T428/249942 ,  Y10T428/31515 ,  H01L2924/00

Abstract: Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.

Abstract translation: 公开了一种多层材料，其中至少两种组分经由粘合剂粘结而相互连接。 粘合剂粘合剂是由适合作为粘合剂的基质中含有纳米纤维材料的粘合剂或粘合层形成的。

公开(公告)号：US08174830B2

公开(公告)日：2012-05-08

申请号：US12116126

申请日：2008-05-06

Applicant: Nathan P. Lower ,  Ross K. Wilcoxon ,  Qizhou Yao ,  David W. Dlouhy ,  John A. Chihak

Inventor： Nathan P. Lower ,  Ross K. Wilcoxon ,  Qizhou Yao ,  David W. Dlouhy ,  John A. Chihak

IPC: H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC classification number: H05K7/20254 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K2201/083 ,  H05K2203/128 ,  H01L2924/00

Abstract: A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.

Abstract translation: 电路板包括泵和通道。 该通道包括液态金属和涂层。 液体金属通过泵泵送通过通道，并且涂层减少了液态金属与通道的至少部分之间的扩散和化学反应。 液体金属可以承载热能以在衬底上的两个或更多个位置之间用作热传递机构。 衬底可以包括电互连以允许将电气部件填充到衬底上以形成电子组件。

公开(公告)号：US20120106111A1

公开(公告)日：2012-05-03

申请号：US12916569

申请日：2010-10-31

Applicant: JOSEPH MAZZOCHETTE ,  Sarwan Kumar Khanna

Inventor： JOSEPH MAZZOCHETTE ,  Sarwan Kumar Khanna

IPC: H05K7/00 ,  H01F1/00 ,  H01F1/26 ,  C09K5/00 ,  H01F1/04 ,  B82Y99/00 ,  B82Y30/00

CPC classification number: H05K3/323 ,  B82Y30/00 ,  H01F1/26 ,  H01F1/37 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29388 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/83887 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/3011 ,  H05K2201/0218 ,  H05K2201/0266 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A composition of matter comprising a plurality of nanoparticles in a non-conductive binder, wherein, the type of nanoparticles form isolated parallel electrically and thermally conductive columns when cured in the presence of the magnetic field. Also wherein the plurality of nanoparticles are Paramagnetic or Ferromagnetic magnetic. Wherein the nano particles are coated, and of a particular shape. Wherein the particles are selected from the group consisting of; Al, Pt, Cr, Mn, crown glass, Fe, Ni, and Co, Ni—Fe/SiO2, Co/SiO2, Fe—Co/SiO2, Fe/nickel-ferrite, Ni—Zn-ferrite/SiO2, Fe—Ni/polymer, Co/polymer, ferrites, iron oxide and any combination and alloy thereof, and the Binder selected from the group consisting of; epoxies, polyurethanes, polyimides, polymeric materials, silicones, adhesives, acrylates, the UV curable modifier and any combination thereof.

Abstract translation: 一种在非导电粘合剂中包含多个纳米颗粒的物质组合物，其中当在磁场存在下固化时，纳米颗粒的类型形成隔离的平行的导电和导热柱。 而且其中多个纳米颗粒是顺磁性或铁磁性的。 其中纳米颗粒被涂覆并且具有特定形状。 其中颗粒选自： Al，Pt，Cr，Mn，冠状玻璃，Fe，Ni和Co，Ni-Fe / SiO2，Co / SiO2，Fe-Co / SiO2，Fe /镍铁氧体，Ni-Zn-铁素体/ Ni /聚合物，Co /聚合物，铁氧体，氧化铁及其任何组合和合金，以及选自以下的粘合剂： 环氧树脂，聚氨酯，聚酰亚胺，聚合物材料，硅酮，粘合剂，丙烯酸酯，UV可固化改性剂及其任何组合。