公开(公告)号：US06866524B2

公开(公告)日：2005-03-15

申请号：US10724642

申请日：2003-12-02

Applicant: Kensaku Takata

Inventor： Kensaku Takata

IPC: H01R12/71 ,  H01R43/02 ,  H05K3/34 ,  H01R12/00

CPC classification number: H01R43/0256 ,  H01R12/7047 ,  H01R12/707 ,  H01R12/716 ,  H01R12/722 ,  H05K3/341 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10969 ,  H05K2203/048 ,  Y02P70/613

Abstract: In a mounting structure, a housing is supported while being raised from a printed circuit board by first molten solders provided between the housing and the printed circuit board, the supported housing is positioned such that terminals come to be located in the centers of lands by a self-alignment effect of second molten solders provided between the terminals and the lands and is fastened onto the printed circuit board by screws and the like with the first and second molten solders naturally cooled. The connector mounting structure is inexpensive and has a good durability and enables the miniaturization of a connector and a narrow arrangement of terminals.

Abstract translation: 在安装结构中，通过设置在壳体和印刷电路板之间的第一熔融焊料从壳体被印刷电路板升起时，壳体被支撑，所述支撑的壳体定位成使得端子通过一个 设置在端子和焊盘之间的第二熔融焊料的自对准效应，并通过螺钉等固定到印刷电路板上，第一和第二熔融焊料自然冷却。 连接器安装结构便宜并且具有良好的耐久性，并且能够使连接器的小型化和端子的布置变窄。

公开(公告)号：US06770813B1

公开(公告)日：2004-08-03

申请号：US10439542

申请日：2003-05-16

Applicant: Prasanna Ramsagar ,  Andrew Z. Glovatsky

Inventor： Prasanna Ramsagar ,  Andrew Z. Glovatsky

IPC: H02G308

CPC classification number: H05K1/189 ,  B60R16/0207 ,  H05K2201/056 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: A microelectronic package includes a flexible substrate and is adapted to be installed onto a support structure, which is preferably a nonplanar support structure. The package includes a frame that is affixed to a perimeter of a first portion of the flexible substrate and forms the substrate into a shape corresponding to the support structure. The package is installed so that the obverse surface of the flexible substrate is intimately against the support structure, so that the support structure not only reinforces the package to prevent damage, but also extracts heat generated during operation of the electronics.

Abstract translation: 微电子封装包括柔性基板，并且适于安装在支撑结构上，支撑结构优选为非平面支撑结构。 该包装包括固定到柔性基底的第一部分的周边并将基底形成与支撑结构对应的形状的框架。 安装包装使得柔性基底的正面紧贴支撑结构，使得支撑结构不仅加强包装以防止损坏，而且还提取在电子器件的操作期间产生的热量。

公开(公告)号：US06762944B2

公开(公告)日：2004-07-13

申请号：US10263201

申请日：2002-10-03

Applicant: Manabu Mizusaki

Inventor： Manabu Mizusaki

IPC: H05K714

CPC classification number: H05K1/0271 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.

Abstract translation: 公开了一种便携式装置的新型抗变形结构，其能够通过减少由便携式装置的印刷电路板和安装在电路板上的电气部件之间的焊接部分产生的变形而导致的电气故障，这是由于机械 压力如跌落或压力。 通过狭缝形成在印刷布线板中的与设置在壳体的角部的具有预定孔的凸起相对应的位置。 通过将穿过狭缝将螺钉插入预备的孔中，将印刷电路板安装在壳体中。 虽然当壳体施加外部机械应力时壳体变形，但是螺钉和凸台可以沿着每个通孔滑动。 因此，不会引起印刷电路板的变形量或变得小于壳体的变形量。

公开(公告)号：US20040070947A1

公开(公告)日：2004-04-15

申请号：US10415816

申请日：2003-11-26

Inventor： Georg Hofmann

IPC: H05K007/20

CPC classification number: H05K7/142 ,  H01H2003/026 ,  H01H2003/0286 ,  H05K1/0271 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: The invention relates to an electronic device for a motor vehicle, for example a car radio, an onboard computer or a vehicle navigation device. According to the invention, a printed circuit board (5) is connected to a housing (1) of the device by predetermined breaking points (17). Actuating elements (8, 9) with operating parts (10, 11) are located on said printed circuit board, these operating parts protruding out from a front panel (2) of the housing (1). In the event that the operating parts (10, 11) are subjected to excessive forces, the predetermined breaking points (17) enable the printed circuit board (5) to detach from the housing (1) and move further into said housing (1), whereby the operating parts (10, 11) move into the housing (1) accordingly.

Abstract translation: 本发明涉及一种用于机动车辆的电子装置，例如汽车收音机，车载计算机或车辆导航装置。 根据本发明，印刷电路板（5）通过预定的断点（17）与设备的壳体（1）连接。 具有操作部件（10,11）的致动元件（8,9）位于所述印刷电路板上，这些操作部件从壳体（1）的前面板（2）突出。 在操作部件（10,11）受到过大的力的情况下，预定的断点（17）能够使印刷电路板（5）从外壳（1）脱离并进一步移动到所述壳体（1）中， ，由此操作部件（10,11）相应地移动到壳体（1）中。

公开(公告)号：US06633488B1

公开(公告)日：2003-10-14

申请号：US09452060

申请日：1999-11-30

Applicant: Yoshihiro Morita

Inventor： Yoshihiro Morita

IPC: H05K714

CPC classification number: H05K3/0061 ,  H05K7/1461 ,  H05K2201/09745 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A printed circuit board unit comprising a printed circuit board and a correction member. The correction member contacts the printed circuit board at a pair of contact points and support points arranged between the contact points. The support points are defined at a position withdrawing from a plane including the contact points. Screws serve to urge the printed circuit board against the correction member. The correction member is adapted to generate an intentional warp or bend. Such warp serves to correct or modify the curvature of the front surface of the printed circuit board. The front surface of the printed circuit board can be maintained flat.

Abstract translation: 一种印刷电路板单元，包括印刷电路板和校正构件。 校正构件在布置在接触点之间的一对接触点和支撑点处接触印刷电路板。 支撑点被限定在从包括接触点的平面退出的位置处。 螺丝用于将印刷电路板推向校正构件。 校正构件适于产生有意的翘曲或弯曲。 这种翘曲用于校正或改变印刷电路板的前表面的曲率。 印刷电路板的前表面可以保持平坦。

公开(公告)号：US06606789B2

公开(公告)日：2003-08-19

申请号：US09836298

申请日：2001-04-18

Applicant: Ulf Jansson

Inventor： Ulf Jansson

IPC: H05K330

CPC classification number: H05K3/303 ,  H05K3/341 ,  H05K7/142 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/53174

Abstract: The invention relates to a method for mounting at least one electronic or mechanical component on a printed board comprising the steps of: surface-mounting at least one guide element on the printed board or placing the at least one guide element in a dead end hole in the printed board, fastening the at least one guide element to the printed board by soldering before guiding the at least one electronic or mechanical component towards the printed board, and placing the at least one electronic or mechanical component on the printed board with the help of the at least one guide element. The invention also relates to a guide element and a electronic or mechanical component to be used in the method.

公开(公告)号：US20030051340A1

公开(公告)日：2003-03-20

申请号：US10179552

申请日：2002-06-24

Applicant: Honeywell International , Inc.

Inventor： David A. Nelson ,  Tuan N. Nguyen ,  Chris L. Joseph ,  Glen M. Whiting

IPC: H05K005/00 ,  H05K005/04 ,  H05K005/06 ,  H05K003/02 ,  H05K003/10

CPC classification number: H05K9/0039 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/10409 ,  Y10T29/49155

Abstract: A circuit on a printed circuit board transmits radio frequency (RF) signals. A modulator operatively coupled to the printed circuit board modulates a signal to be transmitted by modulating an information signal onto a carrier signal. A ground plane attaches to edges and to first and second surfaces of the printed circuit board. The ground plane electrically connects to components of the modulator. A power transistor physically attaches to the printed circuit board and electrically connects to the ground plane through a slot in the printed circuit board. The ground plane provides a suitable ground reference potential for both the modulator and the power transistor without individually constructed circuit boards for each. A ground isolation barrier formed on the ground plane may prevent nullcross talknull between the modulator and the power transistor.

Abstract translation: 印刷电路板上的电路传输射频（RF）信号。 可操作地耦合到印刷电路板的调制器通过将信息信号调制到载波信号上来调制要发送的信号。 接地平面连接到印刷电路板的边缘和第一和第二表面。 接地平面电连接到调制器的组件。 功率晶体管物理地连接到印刷电路板，并通过印刷电路板中的槽电连接到接地平面。 接地平面为调制器和功率晶体管提供合适的接地参考电位，而不需要为每个电路板提供单独的电路板。 在接地平面上形成的接地隔离屏障可以防止调制器和功率晶体管之间的“串扰”。

公开(公告)号：US06490165B2

公开(公告)日：2002-12-03

申请号：US09987325

申请日：2001-11-14

Applicant: Manabu Mizusaki

Inventor： Manabu Mizusaki

IPC: H05K714

CPC classification number: H05K1/0271 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.

公开(公告)号：US06473146B1

公开(公告)日：2002-10-29

申请号：US09401963

申请日：1999-09-22

Applicant: Sang-Chul Lee

Inventor： Sang-Chul Lee

IPC: G02F11333

CPC classification number: G02F1/13452 ,  G02F2001/133334 ,  H05K1/0215 ,  H05K3/0061 ,  H05K3/325 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/10409 ,  H05K2203/043

Abstract: An LCD device in which a plurality of grounding protrusions are formed in a region not having a signal transmission pattern among the bottom surface of a printed circuit board in contact with a bottom chassis so as to increase a contact area between the printed circuit board and the bottom chassis, to thereby prevent a damage caused by an electromagnetic wave and error of devices.

公开(公告)号：US06424536B1

公开(公告)日：2002-07-23

申请号：US09627999

申请日：2000-07-28

Applicant: Martin Filla ,  Lawrence L. D'Anna

Inventor： Martin Filla ,  Lawrence L. D'Anna

IPC: H05K714

CPC classification number: H05K1/0271 ,  H05K3/0058 ,  H05K7/1417 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: Method and apparatus for affixing a circuit board with a protective chassis by affixing the circuit board substantially near the center of the long axis of the circuit board so that ends of the circuit board along the longer axis of the circuit board can flex freely uninhibited by the chassis. In the event that the circuit board-chassis unit is hit or dropped, since the mechanical shock is transmitted from the impact point on the chassis only to the approximate center of the circuit board, circuit components on the circuit board located away from the center of the circuit board will experience a reduced level of mechanical shock. Also, solder joints will experience less mechanical stress because there is less circuit board bending. This reduction in the level of mechanical shock to the circuit board increases the chances that the circuit components will not be damaged or become detached from the circuit board.

Abstract translation: 通过将电路板固定在电路板的长轴的中心附近，将电路板固定在保护底座上的方法和装置，使得电路板沿着电路板的长轴线的端部可以自由地弯曲 机壳。 在电路板 - 机架单元被击中或掉落的情况下，由于机械冲击从底盘上的撞击点传送到电路板的大致中心，电路板上的电路部件位于远离中心的位置 电路板会遇到机械冲击的程度降低。 此外，由于电路板弯曲较少，因此焊点的机械应力将会降低。 对电路板的机械冲击的这种降低会增加电路部件不会被损坏或者从电路板脱离的机会。