公开(公告)号：US08253031B2

公开(公告)日：2012-08-28

申请号：US12633653

申请日：2009-12-08

Applicant: Yung-Chieh Chen ,  Cheng-Hsien Lee ,  Shou-Kuo Hsu ,  Shen-Chun Li ,  Hsien-Chuan Liang ,  Shin-Ting Yen

Inventor： Yung-Chieh Chen ,  Cheng-Hsien Lee ,  Shou-Kuo Hsu ,  Shen-Chun Li ,  Hsien-Chuan Liang ,  Shin-Ting Yen

IPC: H05K1/11

CPC classification number: H05K1/0295 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/029 ,  H05K3/222 ,  H05K2201/09481 ,  H05K2201/09636 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A printed circuit board can support different connectors by selectively setting connection components on the printed circuit board without changing wiring of transmission lines or making new vias in the printed circuit board.

Abstract translation: 印刷电路板可以通过选择性地设置印刷电路板上的连接部件来支持不同的连接器，而不改变传输线的接线或在印刷电路板中形成新的通孔。

公开(公告)号：US08242587B2

公开(公告)日：2012-08-14

申请号：US12177210

申请日：2008-07-22

Applicant: Hiromichi Ebine ,  Katsuhiko Kikuchi ,  Satoshi Shimada ,  Masahide Hayashi

Inventor： Hiromichi Ebine ,  Katsuhiko Kikuchi ,  Satoshi Shimada ,  Masahide Hayashi

IPC: H01L23/31

CPC classification number: H05K3/3442 ,  H01L2924/0002 ,  H05K3/202 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Abstract translation: 电子设备需要为了静电屏蔽而安装电子部件。 这种电子部件的安装提出了避免由于部件材料的线性膨胀系数之间的差异而产生的热应力和裂纹的问题。 在各引线的电子部件安装部中，以组合的方式形成定位凹部，接合物质厚度确保凹部，接合物质厚度确保凹部等，由此在接合物质中产生的裂纹的扩散可以 可以提高抑制和可靠性。 填充密封材料以密封和限制安装在电子部件安装部分中的电子部件而不留空隙有助于进一步抑制在接合物质中产生的裂纹的扩散，并确保接合物质的可靠性更好。

公开(公告)号：US20120186861A1

公开(公告)日：2012-07-26

申请号：US13273532

申请日：2011-10-14

Applicant: Keisuke SHIMIZU ,  Yukinobu Mikado

Inventor： Keisuke SHIMIZU ,  Yukinobu Mikado

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/30 ,  H05K1/16

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2224/92144 ,  H05K1/183 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/063 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49133

Abstract: A wiring board with a built-in electronic component includes a substrate having an opening portion and having a first surface and a second surface on the opposite side of the first surface, and an electronic component having a third surface and a fourth surface on the opposite side of the third surface and positioned in the opening portion of the substrate such that the third surface faces the same direction as the first surface of the substrate. The electronic component has a curved surface joining the fourth surface and a side surface of the electronic component, and the opening portion of the substrate has a tapered portion formed by a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface.

Abstract translation: 具有内置电子部件的布线基板包括：具有开口部的基板，具有与第一面相反一侧的第一面和第二面;以及电子部件，其具有第三面和第四面， 并且定位在基板的开口部分中，使得第三表面面向与基板的第一表面相同的方向。 电子部件具有连接电子部件的第四面和侧面的弯曲面，基板的开口部具有锥形部，该锥部由基板的锥形面形成，该基部与开口部的内壁连接，第一 表面和从第一表面朝向第二表面逐渐变细。

公开(公告)号：US08222539B2

公开(公告)日：2012-07-17

申请号：US12490409

申请日：2009-06-24

Applicant: Yoichiro Kawamura ,  Keisuke Shimizu

Inventor： Yoichiro Kawamura ,  Keisuke Shimizu

IPC: H05K1/11

CPC classification number: H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/0035 ,  H05K3/025 ,  H05K3/4602 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/063 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2224/82 ,  H01L2924/00

Abstract: A wiring board has a conductive pattern, an electronic component connected to the conductive pattern by means of a via hole, and a substrate where the electronic component is built into. The connection interface between the via hole and the electronic component inclines toward the connection interface between the via hole and the conductive pattern.

Abstract translation: 布线板具有导电图案，通过通孔连接到导电图案的电子部件和内置电子部件的基板。 通孔和电子部件之间的连接接口朝向通孔和导电图案之间的连接接口倾斜。

公开(公告)号：US20120168959A1

公开(公告)日：2012-07-05

申请号：US13197177

申请日：2011-08-03

Applicant: Chih-Kuei Yang

Inventor： Chih-Kuei Yang

IPC: H01L23/48 ,  H01L21/28

CPC classification number: H05K1/184 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/11 ,  H05K3/0032 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0242 ,  Y02P70/611 ,  H01L2924/00

Abstract: A package substrate includes a core board having a through hole; a circuit layer formed on the core board; a metallic ring disposed on the core board surrounding a contour of the through hole, the metallic ring having opening portions positioned opposite to each other, making the metallic ring having a disconnected manner; and an embedded component installed in the through hole. When the embedded component is deviated in the through hole to allow the electrodes to be in contact with the metallic ring, the electrodes are prevented from coming into contact with the same section of the metallic ring to thereby avoid short circuit.

Abstract translation: 封装基板包括具有通孔的芯板; 形成在所述芯板上的电路层; 金属环，其设置在所述芯板上，围绕所述通孔的轮廓，所述金属环具有彼此相对定位的开口部，使得所述金属环具有断开的方式; 并安装在通孔中的嵌入式组件。 当嵌入部件在通孔中偏离以允许电极与金属环接触时，防止电极与金属环的相同部分接触，从而避免短路。

公开(公告)号：US08212152B2

公开(公告)日：2012-07-03

申请号：US12390856

申请日：2009-02-23

Applicant: Masaaki Togashi

Inventor： Masaaki Togashi

IPC: H05K1/16

CPC classification number: H05K1/0271 ,  H01G4/38 ,  H05K1/111 ,  H05K1/114 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic device has a multilayer capacitor and a circuit board on which the capacitor is mounted. The capacitor is formed in a nearly rectangular parallelepiped shape and has a first terminal electrode and a second terminal electrode arranged at respective ends thereof. On the circuit board there are a first land to which the first terminal electrode of the capacitor is fixed and a second land to which the second terminal electrode is fixed. The circuit board has a slit formed so as to open on the second land side and surround the first land, when viewed from a direction perpendicular to a principal surface of the circuit board. An imaginary straight line connecting one end and the other end of the slit intersects with the capacitor when viewed from the direction perpendicular to the principal surface of the circuit board.

Abstract translation: 电子器件具有层叠电容器和安装电容器的电路板。 电容器形成为大致长方体形状，并且具有设置在其各端的第一端子电极和第二端子电极。 在电路板上有电容器的第一端子电极固定的第一焊盘和固定有第二端子电极的第二焊盘。 电路板具有从垂直于电路板的主表面的方向观察时形成为在第二焊盘侧上打开并围绕第一焊盘的狭缝。 当从与电路板的主表面垂直的方向观察时，连接狭缝的一端和另一端的假想直线与电容器相交。

公开(公告)号：US08209859B2

公开(公告)日：2012-07-03

申请号：US12123733

申请日：2008-05-20

Applicant: Louis H. Feinstein

Inventor： Louis H. Feinstein

IPC: H05K3/30

CPC classification number: H05K3/284 ,  H05K2201/068 ,  H05K2201/0769 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49227 ,  Y10T29/52 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A technique for processing an electronic apparatus (e.g., manufacturing an assembled circuit board, treating an assembled circuit board, etc.) involves applying encasement material to an area of the circuit board assembly while leaving at least a portion of the circuit board assembly exposed. The technique further involves causing the applied encasement material to harden (e.g., heating the encasement material in a curing oven, applying radiation, providing a chemical catalyst, etc.). Application and hardening of the encasement material may take place shortly after circuit board assembly (e.g., by automated equipment at a manufacturing facility in order to treat newly assembled boards) or at some later time in the field (e.g., by a technician servicing a legacy board).

Abstract translation: 一种用于处理电子设备（例如，制造组装电路板，处理组装电路板等）的技术涉及将外壳材料施加到电路板组件的区域，同时使电路板组件的至少一部分露出。 该技术还包括使所施加的包装材料硬化（例如，在固化炉中加热包装材料，施加辐射，提供化学催化剂等）。 封装材料的应用和硬化可能在电路板组装之后不久（例如，通过制造设施处的自动化设备来处理新组装的板）或在现场的某个稍后的时间（例如，由维护遗留物的技术人员） 板）。

公开(公告)号：US20120145445A1

公开(公告)日：2012-06-14

申请号：US13403042

申请日：2012-02-23

Applicant: Masashi ARAI ,  Mayuko NISHIHARA

Inventor： Masashi ARAI ,  Mayuko NISHIHARA

IPC: H05K1/18 ,  H05K3/40 ,  H05K1/11 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L23/49827 ,  H01L23/50 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/09481 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10636 ,  H05K2203/0191 ,  Y02P70/611 ,  Y10T29/4916

Abstract: A resin multilayer substrate includes a component-containing layer and a thin resin layer stacked on a surface of the component-containing layer. The resin multilayer substrate further includes a surface electrode located on a surface opposite to the surface of the thin resin layer stacked on the component-containing layer, a first via conductor provided in the component-containing layer, which includes an end reaching one surface of the component-containing layer, and a second via conductor provided in the thin resin layer, which includes a first end electrically connected to the surface electrode and a second end electrically connected to the via conductor. A portion of the thin resin layer in contact with the second via conductor defines a projection projecting into the first via conductor.

Abstract translation: 树脂多层基板包括层叠在含有成分层的表面上的成分含有层和薄树脂层。 树脂多层基板还包括位于与层叠在含有成分层的薄树脂层的表面相反的表面上的表面电极，设置在含有成分的层中的第一通孔导体， 所述部件含有层和设置在所述薄树脂层中的第二通路导体，所述第二通路导体包括电连接到所述表面电极的第一端和与所述通孔导体电连接的第二端。 与第二通孔导体接触的薄树脂层的一部分限定突出到第一通孔导体中的突起。

公开(公告)号：US20120142147A1

公开(公告)日：2012-06-07

申请号：US13369376

申请日：2012-02-09

Applicant: Shunsuke SAKAI ,  Kenji Sato ,  Toshiki Furutani

Inventor： Shunsuke SAKAI ,  Kenji Sato ,  Toshiki Furutani

IPC: H01L21/762

CPC classification number: H05K1/0298 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/184 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09781 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/049 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole.

Abstract translation: 具有内置电子部件的布线基板包括芯基板，该芯基板具有形成在芯基板上的贯通孔，容纳在芯基板的贯通孔中的电子部件，形成在芯基板的第一面上的导电图案层 并且包括第一导电图案和第二导电图案，以及形成在导电图案层和芯基板的第一表面之上的层间绝缘层。 第二导电图案邻近穿透孔的周边形成并且成形为使得用于将电子部件定位在穿透孔中的片材相对于芯基板的第一表面在穿孔上水平地​​层叠。

公开(公告)号：US20120138350A1

公开(公告)日：2012-06-07

申请号：US13309263

申请日：2011-12-01

Applicant: Pum San CHAE ,  Doo Young KIM ,  Kang Heon HUR ,  Hong Yeon CHO

Inventor： Pum San CHAE ,  Doo Young KIM ,  Kang Heon HUR ,  Hong Yeon CHO

IPC: H05K1/16 ,  H05K13/04 ,  B65G47/24

CPC classification number: H05K13/021 ,  H05K1/181 ,  H05K1/185 ,  H05K13/022 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/5317

Abstract: There is provided a device for electronic components including: a tray provided with electronic components formed by stacking dielectric sheets on which inner conductors are formed; a transfer unit continuously transferring the electronic components moved from the tray; and a magnetic field providing unit providing a magnetic field to the electronic components moved from the transfer unit to align the inner conductors in a direction in which the magnetic field and magnetic resistance are reduced.

Abstract translation: 提供了一种用于电子部件的装置，包括：托盘，其设置有通过堆叠形成有内导体的电介质片形成的电子部件; 传送单元连续地传送从托盘移动的电子部件; 以及磁场提供单元，其向从所述传送单元移动的所述电子部件提供磁场，以沿着所述磁场和磁阻减小的方向对准所述内部导体。