公开(公告)号：US07723620B2

公开(公告)日：2010-05-25

申请号：US11572334

申请日：2005-08-30

Applicant: Masanori Kawade ,  Hiroyuki Tsuruga ,  Makoto Ebina

Inventor： Masanori Kawade ,  Hiroyuki Tsuruga ,  Makoto Ebina

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/05599

Abstract: A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.

Abstract translation: 半导体负载引脚，在回流时不倾斜。 在电极焊盘和半导体负载引脚的凸缘之间的焊料中有时留下空隙。 当进行回流以加载IC芯片时，用于连接的焊料熔化，并且同时焊料中的空隙膨胀。 焊料沿着槽部侧向逸出，由此凸缘不会被空隙升高，使得半导体负载引脚不倾斜。

公开(公告)号：US20090315064A1

公开(公告)日：2009-12-24

申请号：US12318171

申请日：2008-12-23

Applicant: Chih-Yang Wang

Inventor： Chih-Yang Wang

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H05K1/112 ,  H05K1/182 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10106 ,  H05K2201/1084 ,  H05K2203/0405 ,  H05K2203/0455 ,  Y02P70/613

Abstract: A light emission device includes a substrate, at least one light-emitting diode (LED), and a plurality of electrical connection elements. The substrate defines a plurality of pilot holes, each having a conductive layer formed in a circumference thereof. The LED is set on the substrate and has a plurality of terminals each forming a through hole corresponding to a respective pilot hole of the substrate. Each electrical connection element is arranged between the conductive layer of each pilot hole of the substrate and each terminal of the LED. The electrical connection element is molten by being heated to form an electric connection portion, which attaches to the conductive layer of the pilot hole and the terminal of the light-emitting diode. In this way, precise positioning between the substrate and the LED is realized, bonding strength is enhanced, and overall thickness is reduced.

Abstract translation: 发光器件包括衬底，至少一个发光二极管（LED）和多个电连接元件。 衬底限定多个导向孔，每个导孔具有在其圆周上形成的导电层。 LED设置在基板上，并且具有多个端子，每个端子形成对应于基板的相应引导孔的通孔。 每个电连接元件布置在基板的每个引导孔的导电层和LED的每个端子之间。 电连接元件通过被加热而熔化，形成连接到引导孔的导电层和发光二极管的端子的电连接部分。 以这种方式实现了基板与LED之间的精确定位，提高了接合强度，降低了总体厚度。

公开(公告)号：US20090236617A1

公开(公告)日：2009-09-24

申请号：US12115515

申请日：2008-05-05

Applicant: CHIN-LONG KU

Inventor： CHIN-LONG KU

IPC: H01L33/00 ,  F21V21/00

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21S2/005 ,  F21V29/70 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K2201/10106 ,  H05K2201/1053 ,  H05K2201/10787 ,  H05K2201/1084 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED includes a base and a first and a second electrode leads inserted in the base. The first lead forms a groove in an end thereof, and the second lead forms a tab from an end thereof. The tab of each LED is received in the groove of an adjacent LED to thereby cooperatively define an accommodating space in the groove and above the tab. The accommodating space is used for receiving excess solder when soldering the first and the second leads together.

Abstract translation: LED组件包括衬底和安装在衬底上的多个LED。 每个LED包括基座和插入基座中的第一和第二电极引线。 第一引线在其端部形成凹槽，并且第二引线从其端部形成突片。 每个LED的突片被接收在相邻LED的凹槽中，从而在凹槽中并在凸片上方协同地限定容纳空间。 当将第一和第二引线焊接在一起时，容纳空间用于接收多余的焊料。

公开(公告)号：US20090087694A1

公开(公告)日：2009-04-02

申请号：US12232815

申请日：2008-09-24

Applicant: Seokryun Park

Inventor： Seokryun Park

IPC: H01M10/02 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H01M2/04 ,  H01M2/20 ,  H01M10/052 ,  H01M10/425 ,  H05K2201/1031 ,  H05K2201/1084 ,  Y02P70/611 ,  Y02P70/613

Abstract: A protection circuit board for a secondary battery includes: a printed circuit board; a protection circuit attached to the printed circuit board and electrically connected thereto; a conducting pad electrically connected to a conducting pad of the protection circuit; a charging/discharging terminal electrically connected to the protection circuit and the conducting pad; a lead plate electrically connected to the conducting pad, the lead plate including at least one soldering hole arranged on a surface thereof to couple the lead plate to the conducting pad.

Abstract translation: 一种用于二次电池的保护电路板包括：印刷电路板; 附接到印刷电路板并与其电连接的保护电路; 导电焊盘，其电连接到所述保护电路的导电焊盘; 电连接到保护电路和导电焊盘的充电/放电端子; 导电板，其电连接到所述导电焊盘，所述引线板包括布置在其表面上的至少一个焊接孔，以将所述引线板耦合到所述导电焊盘。

公开(公告)号：US20090068864A1

公开(公告)日：2009-03-12

申请号：US12222321

申请日：2008-08-07

Applicant: Takayoshi Honda ,  Minoru Hozuka

Inventor： Takayoshi Honda ,  Minoru Hozuka

IPC: H01R12/00

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

Abstract translation: 电子设备包括印刷电路板和具有端子的电子元件。 端子具有表面部分和插入部分。 印刷电路板包括从印刷电路板的第一表面延伸到第二表面的通孔，设置在第一表面上的表面焊盘，以及一体地设置在通孔的侧壁上和周围的周边的插入槽 通孔。 表面部分通过焊料与表面焊盘耦合。 插入部设置在通孔中，并通过焊料与插入平台联接。 表面部分具有凹部，凹部的一部分设置成与通孔的一部分轴向对齐。

公开(公告)号：US20080284535A1

公开(公告)日：2008-11-20

申请号：US11975753

申请日：2007-10-22

Applicant: Takeshi Uchida ,  Manabu Ito ,  Tomotaka Kuroda

Inventor： Takeshi Uchida ,  Manabu Ito ,  Tomotaka Kuroda

IPC: H03B5/30 ,  B32B3/24

CPC classification number: H01R43/0256 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/09463 ,  H05K2201/10303 ,  H05K2201/1084 ,  H05K2201/10871 ,  H05K2203/1178 ,  Y10T428/24612

Abstract: The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.

Abstract translation: 本发明涉及一种二级安装板，其中第二基板由位于外基座表面上的具有安装电极的第一基板上的金属销水平支撑，金属销的自由下端插入 并且所述金属销通过焊料固定到设置在所述第一基板的表面上的环形电极焊盘，以形成所述孔的外周，其中所述环形电极的环的一部分 被切开打开一样。 这提供了两级安装板，其中金属引脚可以可靠地连接到第一基板以水平地支撑第二基板，以及使用其的晶体振荡器。

公开(公告)号：US20080085616A1

公开(公告)日：2008-04-10

申请号：US11663770

申请日：2005-09-27

Applicant: Hiroki Hirai ,  Kenji Okamura ,  Masahide Hio ,  Tetsuya Aihara ,  Hiroshi Nakano ,  Shigeki Shimada

Inventor： Hiroki Hirai ,  Kenji Okamura ,  Masahide Hio ,  Tetsuya Aihara ,  Hiroshi Nakano ,  Shigeki Shimada

IPC: H01R12/14

CPC classification number: H05K3/3426 ,  H01R12/707 ,  H01R12/714 ,  H05K3/341 ,  H05K2201/10189 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A plurality of terminal fittings 11 are mounted to a housing 20, board connecting portions 13 having mounting portions 14 at lower ends protrude rearward, fixed fittings 30 having mounting plates 32 at lower edges are mounted to opposite side surfaces of the housing 20, and the mounting portion 14 of each terminal fitting 11 and the mounting plates 32 of the fixed fittings 30 are secured to a PCB 40 by reflow soldering. During the reflow soldering, a drawing force toward the PCB 40 acts on each of the terminal fittings 11 and the fixed fittings 30 based on surface tension of molten solder H, but the center of the fixed fitting 30 in the fore/aft direction of the board connecting portion 13 is positioned forward of the center of gravity position O of a connector 10, and rotation moment Mb toward the PCB 40 acts on the front of the housing 20 based on a drawing force Fb on the side of the fixed fitting 30 to prevent the front from being raised.

Abstract translation: 多个端子配件11安装在壳体20上，具有下端的安装部分14的板连接部分13向后突出，在下边缘处具有安装板32的固定配件30安装在壳体20的相对侧表面上， 每个端子接头11的安装部分14和固定配件30的安装板32通过回流焊接固定到PCB40上。 在回流焊接期间，基于熔融焊料H的表面张力，朝向PCB 40的拉力作用在端子配件11和固定配件30中的每一个上，但固定配件30的中心在前后方向上 板连接部分13位于连接器10的重心位置O的前方，并且朝向PCB 40的转动力矩Mb基于固定配件30侧的拉拔力Fb作用在壳体20的前部上 防止前方被抬起。

公开(公告)号：US07145230B2

公开(公告)日：2006-12-05

申请号：US11024597

申请日：2004-12-30

Applicant: Futoshi Hosoya

Inventor： Futoshi Hosoya

IPC: H01L23/043 ,  H01L23/10 ,  H01L23/12 ,  H01L23/06 ,  H01L23/04

CPC classification number: H01L23/492 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/73153 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00

Abstract: The present invention provides a semiconductor device which includes a U-shaped metal package base, and a semiconductor chip having at least surface electrodes and being mounted on the inner bottom portion of the U-shaped metal package base, wherein the metal package base has, in a portion thereof ranging from the opened side end portion of the inner side wall to the semiconductor chip, a creep-up preventive zone preventing solder entering from the opened side end portion from creeping up. The device makes it possible to solve problems which have been apprehended for conventional semiconductor devices configured as mounting a semiconductor chip on a small semiconductor package, in that reduction in distance between external terminal portions of the metal package and the semiconductor chip results in contact of a solder for mounting with the semiconductor chip to thereby adversely affect the electrical properties and reliability thereof, and in that resin filling or partial plating for avoiding intrusion of the solder raises the cost.

Abstract translation: 本发明提供了一种半导体器件，其包括U形金属封装基座和至少具有表面电极并且安装在U形金属封装基座的内底部的半导体芯片，其中金属封装基座具有， 在从内侧壁的开放侧端部到半导体芯片的一部分中，防止从开口侧端部进入的焊料的蠕变防止区域爬行。 该装置使得可以解决已经被配置为将半导体芯片安装在小型半导体封装上的常规半导体器件所理解的问题，因为金属封装的外部端子部分与半导体芯片之间的距离的减小导致接触 用于与半导体芯片一起安装的焊料，从而不利地影响其电性能和可靠性，并且为了避免焊料侵入的树脂填充或部分电镀增加了成本。

公开(公告)号：US07138584B1

公开(公告)日：2006-11-21

申请号：US11399318

申请日：2006-04-07

Applicant: Ted Ju

Inventor： Ted Ju

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H05K3/341 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10969 ,  Y02P70/613

Abstract: An electrical connector is disclosed to include an electrically insulative housing, which houses a plurality of metal contact pins, each metal contact pin having a bottom bonding face protruding over the bottom side of the housing, a metal shield, which is coupled to the housing and has two bonding portions at two sides, and a bonding adjustment architecture provided between the metal shield and the housing for allowing vertical movement of the metal shield relative to the housing to adjust the elevation of the bonding portions so that the bonding portions and the bonding face of each metal contact pin can be positively bonded to a circuit board by SMT.

Abstract translation: 公开了一种电连接器，其包括电绝缘壳体，其容纳多个金属接触销，每个金属接触销具有在壳体的底侧上突出的底部接合面，金属屏蔽，其联接到壳体和 在两侧具有两个接合部分，并且设置在金属屏蔽件和壳体之间的接合调整结构，用于允许金属屏蔽件相对于壳体的垂直移动，以调节接合部分的高度，使得接合部分和接合面 每个金属接触销可以通过SMT积极地结合到电路板。

公开(公告)号：US20060255455A1

公开(公告)日：2006-11-16

申请号：US11263115

申请日：2005-10-31

Applicant: Craig Rotay

Inventor： Craig Rotay

IPC: H01L23/34

CPC classification number: H01L23/49562 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/3426 ,  H05K2201/10166 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high power density transistor structure includes a transistor package capable of housing a high power density transistor. The transistor package has a package insulator and a plurality of transistor leads. Each of the transistor leads has a far end, a near end and a lead periphery. The high power density transistor structure also includes a solder lock located on at least one of the transistor leads. At least a portion of the solder lock is attachable to a printed circuit board (PCB). At least a portion of the lead periphery of each transistor lead is attachable to at least one of: the PCB and the package insulator.

Abstract translation: 高功率密度晶​​体管结构包括能够容纳高功率密度晶​​体管的晶体管封装。 晶体管封装具有封装绝缘体和多个晶体管引线。 每个晶体管引线具有远端，近端和引线周边。 高功率密度晶​​体管结构还包括位于至少一个晶体管引线上的焊接锁。 焊接锁的至少一部分可附接到印刷电路板（PCB）。 每个晶体管引线的引线周边的至少一部分可附接到PCB和封装绝缘体中的至少一个。