公开(公告)号：US20090280644A1

公开(公告)日：2009-11-12

申请号：US12434007

申请日：2009-05-01

Applicant: Aziz ZENASNI

Inventor： Aziz ZENASNI

IPC: H01L21/768

CPC classification number: B81C1/00047 ,  B81C2201/0108 ,  B81C2201/0128 ,  H01L21/7682

Abstract: The invention relates to a process for producing at least one air gap in a microstructure, which comprises:1) the supply of a microstructure comprising at least one gap filled with a sacrificial material that decomposes starting from a temperature θ1, this gap being delimited over at least one part of its surface by a non-porous membrane, composed of a material that forms a matrix and of a pore-forming agent that decomposes at a temperature θ2

公开(公告)号：US07531457B2

公开(公告)日：2009-05-12

申请号：US11561902

申请日：2006-11-21

Applicant: Yu-Fu Kang ,  Chen-Hsiung Yang

Inventor： Yu-Fu Kang ,  Chen-Hsiung Yang

IPC: H01L21/20

CPC classification number: B81C1/0015 ,  B81C2201/0108 ,  B81C2201/0132

Abstract: A method of fabricating a suspended structure. First, a substrate including a photoresist layer hardened by heat is provided. Subsequently, the hardened photoresist layer is etched so as to turn the photoresist layer into a predetermined edge profile. Thereafter, a structure layer is formed on parts of the substrate and parts of the photoresist layer. Next, a dry etching process is performed so as to remove the photoresist layer, and to turn the structure layer into a suspended structure.

Abstract translation: 一种制造悬挂结构的方法。 首先，提供包含通过热硬化的光致抗蚀剂层的基板。 随后，蚀刻硬化的光致抗蚀剂层，以使光致抗蚀剂层变成预定的边缘轮廓。 此后，在基板的一部分和光致抗蚀剂层的一部分上形成结构层。 接下来，进行干蚀刻处理以去除光致抗蚀剂层，并将结构层转变成悬浮结构。

公开(公告)号：US20070293023A1

公开(公告)日：2007-12-20

申请号：US11561902

申请日：2006-11-21

Applicant: Yu-Fu Kang ,  Chen-Hsiung Yang

Inventor： Yu-Fu Kang ,  Chen-Hsiung Yang

IPC: H01L21/20

CPC classification number: B81C1/0015 ,  B81C2201/0108 ,  B81C2201/0132

Abstract: A method of fabricating a suspended structure. First, a substrate including a photoresist layer hardened by heat is provided. Subsequently, the hardened photoresist layer is etched so as to turn the photoresist layer into a predetermined edge profile. Thereafter, a structure layer is formed on parts of the substrate and parts of the photoresist layer. Next, a dry etching process is performed so as to remove the photoresist layer, and to turn the structure layer into a suspended structure.

Abstract translation: 一种制造悬挂结构的方法。 首先，提供包含通过热硬化的光致抗蚀剂层的基板。 随后，蚀刻硬化的光致抗蚀剂层，以使光致抗蚀剂层变成预定的边缘轮廓。 此后，在基板的一部分和光致抗蚀剂层的一部分上形成结构层。 接下来，进行干蚀刻处理以去除光致抗蚀剂层，并将结构层转变成悬浮结构。

公开(公告)号：US07298015B2

公开(公告)日：2007-11-20

申请号：US10523267

申请日：2003-07-31

Applicant: Tohru Ishizuya

Inventor： Tohru Ishizuya

IPC: H01L29/82

CPC classification number: B81B3/0072 ,  B81C2201/0108 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/3572 ,  G02B6/3584 ,  G02B6/3596 ,  Y10S438/926

Abstract: A three-dimensional structure element having a plurality of three-dimensional structural bodies and capable of being uniformly formed without producing a dispersion in shape of the three-dimensional structural bodies, comprising a substrate (11) and the three-dimensional structural bodies (1) disposed in a predetermined effective area (20) on the substrate (11), the three-dimensional structural bodies (1) further comprising space parts formed in the clearances thereof from the substrate (11) by removing sacrificing layers, the substrate (11) further comprising a dummy area (21) having dummy structural bodies (33) so as to surround the effective area (20), the dummy structural body (33) further comprising space parts formed in the clearances thereof from the substrate (11) by removing the sacrificing layers, whereby since the dummy area (21) is heated merely to approx. the same temperature as the effective area (20) in an ashing process for removing the sacrificing layers to prevent a temperature distribution from occurring in the effective area (20).

Abstract translation: 一种具有多个三维结构体并能够均匀形成而不产生三维结构体形状分散的三维结构元件，包括基底（11）和三维结构体（1） ），所述三维结构体（1）还包括通过去除牺牲层从所述基板（11）形成在其间隙中的空间部分，所述基板（11）被布置在所述基板（11）上的预定有效区域（20） ）还包括具有虚拟结构体（33）以围绕所述有效区域（20）的虚拟区域（21），所述虚拟结构体（33）还包括通过所述基板（11）从所述基板（11）的间隙形成的空间部分， 去除牺牲层，由此由于虚拟区域（21）被加热到约 在用于去除牺牲层的灰化过程中与有效区域（20）相同的温度以防止在有效区域（20）中发生温度分布。

公开(公告)号：US20070155051A1

公开(公告)日：2007-07-05

申请号：US11321134

申请日：2005-12-29

Applicant: Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

Inventor： Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

IPC: H01L21/00

CPC classification number: B81C1/00047 ,  B81B2201/047 ,  B81C2201/0108 ,  B81C2201/0111 ,  G02B26/001

Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.

Abstract translation: 可以使用包含热可汽化聚合物以在可移动层和基底之间形成间隙的牺牲层来制造MEMS器件（例如干涉式调制器）。 一个实施例提供了一种制造MEMS器件的方法，该MEMS器件包括在衬底上沉积聚合物层，在聚合物层上形成导电层，并蒸发聚合物层的至少一部分以在衬底和电 导电层。 另一个实施例提供了制造干涉式调制器的方法，该方法包括提供衬底，在衬底的至少一部分上沉积第一导电材料，在第一导电材料的至少一部分上沉积牺牲材料，沉积绝缘体 在所述衬底上并且邻近所述牺牲材料以形成支撑结构，以及在所述牺牲材料的至少一部分上沉积第二导电材料，所述牺牲材料可通过热蒸发而被去除，从而在所述第一电 导电层和第二导电层。

公开(公告)号：US20070013266A1

公开(公告)日：2007-01-18

申请号：US11212611

申请日：2005-08-29

Applicant: Ming-Wei Chang ,  Da-Chen Pang ,  Chao-Sheng Tseng

Inventor： Ming-Wei Chang ,  Da-Chen Pang ,  Chao-Sheng Tseng

IPC: H01L41/00

CPC classification number: B81B7/0012 ,  B06B1/0292 ,  B81C2201/0108 ,  Y10T29/435 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49172 ,  Y10T29/49194

Abstract: A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity.

Abstract translation: 一种制造基于聚合物的电容式超声换能器的方法，包括以下步骤：（a）提供基底; （b）在所述基板上形成第一导体; （c）在衬底上涂覆牺牲层，同时覆盖第一导体; （d）蚀刻用于形成岛的牺牲层，同时保持岛与第一导体接触; （e）在衬底上涂覆第一聚合物基材料同时覆盖该岛; （f）在第一聚合物基材料上形成第二导体; （g）在第一聚合物基材料上形成通孔，同时使通孔能够引导到岛上; 和（h）利用通孔蚀刻并去除用于形成空腔的岛。

公开(公告)号：US06994950B2

公开(公告)日：2006-02-07

申请号：US10391122

申请日：2003-03-18

Applicant: Yu-Chong Tai ,  Qing He

Inventor： Yu-Chong Tai ,  Qing He

IPC: G03F7/00

CPC classification number: B81C1/00333 ,  B01L3/502707 ,  B01L2200/0668 ,  B01L2200/12 ,  B01L2300/0896 ,  B81C1/00182 ,  B81C1/00476 ,  B81C2201/0108 ,  B82Y30/00 ,  G01N30/6095 ,  G01N2030/562 ,  G01N2030/6056

Abstract: MEMs devices are integrally fabricated with included micro or nanoparticles by providing a mixture of a sacrificial material and a multiplicity of particles, disposing the mixture onto a substrate, fabricating a MEMs structure on the substrate including at least part of the mixture, so that at least some of the mixture is enclosed in the MEMs structure, removing the sacrificial material, and leaving at least some of the multiplicity of particles substantially free and enclosed in the MEMs structure. The step of fabricating a MEMs structure is quite general and is contemplated as including one or a multiplicity of additional steps for creating some type of structure in which the particles, which may be microbeads or nanobeads, are included. A wide variety of useful applications for MEMs integrated with micro or nanoparticles are available.

公开(公告)号：US20050170544A1

公开(公告)日：2005-08-04

申请号：US10769346

申请日：2004-01-30

Applicant: M.C. Chang ,  H.S. Wu ,  Tsang-Mu Lai

Inventor： M.C. Chang ,  H.S. Wu ,  Tsang-Mu Lai

IPC: B81B3/00 ,  H01L21/00

CPC classification number: B81C99/0085 ,  B81C2201/0108 ,  B81C2201/0133 ,  B81C2201/0152

Abstract: A method for forming a free standing micro-structural member including providing a substrate; blanket depositing a first sacrificial resist layer over the substrate; exposing and developing the first sacrificial resist layer to form a first resist portion; subjecting the first resist portion to at least a hard bake process to form the first resist portion having a predetermined first smaller volume compared to a desired final resist portion volume; blanket depositing at least a second sacrificial resist layer followed by exposure, development and the at least a hard bake process to form the final resist portion volume; and, depositing at least one structural material layer over the final resist portion.

Abstract translation: 一种形成独立式微结构构件的方法，包括提供基底; 在衬底上铺设第一牺牲抗蚀剂层; 曝光和显影第一牺牲抗蚀剂层以形成第一抗蚀剂部分; 使所述第一抗蚀剂部分至少进行硬烘烤处理，以形成具有预定的第一较小体积的第一抗蚀剂部分，与期望的最终抗蚀剂部分体积相比; 毯毯沉积至少第二牺牲抗蚀剂层，随后曝光，显影和至少硬烘烤工艺以形成最终的抗蚀剂部分体积; 并且在最终抗蚀剂部分上沉积至少一个结构材料层。

公开(公告)号：US06917086B2

公开(公告)日：2005-07-12

申请号：US10817270

申请日：2004-04-02

Applicant: Shawn Jay Cunningham ,  Svetlana Tatic-Lucic

Inventor： Shawn Jay Cunningham ,  Svetlana Tatic-Lucic

IPC: B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  H01L29/82 ,  H01L21/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure. Still furthermore, the method can include the following: depositing a second conductive layer on the structural layer and in the via; forming a second conductive microstructure by removing a portion of the second conductive layer, wherein the second conductive microstructure electrically communicates with the first conductive microstructure through the via; and removing a sufficient amount of the sacrificial layer so as to separate the first conductive microstructure from the substrate, wherein the structural layer is supported by the substrate at a first end and is freely suspended above the substrate at an opposing second end.

Abstract translation: 三层梁MEMS器件及相关方法。 根据一个实施例，提供一种制造三层梁的方法。 该方法可以包括在衬底上沉积牺牲层并在牺牲层上沉积第一导电层。 该方法还可以包括通过去除第一导电层的一部分来形成第一导电微结构。 此外，该方法可以包括在第一导电微结构，牺牲层和衬底上沉积结构层，并且通过结构层将通孔形成到第一导电微结构。 此外，该方法可以包括以下：在结构层和通孔中沉积第二导电层; 通过去除所述第二导电层的一部分来形成第二导电微结构，其中所述第二导电微结构通过所述通孔与所述第一导电微结构电连通; 以及去除足够量的牺牲层以便将第一导电微结构与衬底分开，其中结构层在第一端由衬底支撑并且在相对的第二端处自由地悬挂在衬底上方。

公开(公告)号：US06882264B2

公开(公告)日：2005-04-19

申请号：US10290807

申请日：2002-11-08

Applicant: Shawn Jay Cunningham

Inventor： Shawn Jay Cunningham

IPC: B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  H01H37/52 ,  H02N2/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch having a movable microcomponent is provided and includes a substrate having a stationary contact. The switch can also include a structural layer having a movable contact positioned for contacting the stationary contact when the structural layer moves toward the substrate. An electrothermal latch attached to the structural layer and having electrical communication with the movable contact to provide current flow between the electrothermal latch and the stationary contact when the movable contact contacts the stationary contact for maintaining the movable contact in contact with the stationary contact.

Abstract translation: 电热自锁式MEMS开关及方法。 根据一个实施例，提供具有可移动微组件的微型开关，并且包括具有固定触点的基板。 该开关还可以包括具有可移动触点的结构层，该结构层定位成当结构层向衬底移动时与固定触点接触。 一个电热锁定件，其连接到结构层并且当可动触点接触固定触点以便使可动触点与固定触点接触时，与可动触头电连通以提供电热闩和固定触点之间的电流。