公开(公告)号：US06815053B2

公开(公告)日：2004-11-09

申请号：US10221373

申请日：2003-01-02

Applicant: Tomoko Inoue ,  Hiroya Okumura ,  Isao Hirata ,  Shigehiro Okada

Inventor： Tomoko Inoue ,  Hiroya Okumura ,  Isao Hirata ,  Shigehiro Okada

IPC: B32B516

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B5/024 ,  B32B27/04 ,  B32B27/20 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/02 ,  B32B2305/72 ,  B32B2307/734 ,  B32B2398/20 ,  B32B2605/00 ,  B32B2605/12 ,  C08F283/01 ,  C08F290/064 ,  C08J5/24 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  Y10T428/249924 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/2904 ,  Y10T428/2927 ,  Y10T428/298 ,  Y10T428/2991 ,  Y10T428/31786

Abstract: A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150° C. is not higher than 20×10−6/° C. can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.

Abstract translation: 具有优异的耐热性，耐水性和韧性以及在40至150℃的温度范围内的平均线性膨胀系数的低热膨胀层压板不高于20×10 -6 /℃可以通过 层压和固化由可自由基聚合的树脂，可自由基聚合的单体和与特定量的热塑性树脂组合的无机填料组成的树脂组合物浸渍的纤维增强层。

公开(公告)号：US06777464B1

公开(公告)日：2004-08-17

申请号：US09402274

申请日：1999-12-16

Applicant: Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

Inventor： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

IPC: C08K308

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09D5/24 ,  C09D175/16 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract translation: 一种电路连接材料，其插入在彼此面对的电路电极之间，并且通过将相对的电极彼此相压来使按压方向的电极电连接; 电路连接材料作为必要成分（1）含有能够在加热时产生自由基的固化剂，（2）分子量为10,000以上的含羟基的树脂和（3）可自由基聚合的物质。 还提供了使用这种材料的电路端子连接结构和电路端子连接方法。

公开(公告)号：US06562179B1

公开(公告)日：2003-05-13

申请号：US09697134

申请日：2000-10-27

Applicant: Nobuyuki Ikeguchi ,  Masahiro Shimoda

Inventor： Nobuyuki Ikeguchi ,  Masahiro Shimoda

IPC: C09J502

CPC classification number: C08J5/24 ,  C08G59/4014 ,  C08G73/0655 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0038 ,  H05K2201/0112 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2203/0315

Abstract: A high relative-permittivity B-staged sheet obtained by incorporating an insulating inorganic filler having a relative permittivity of at least 500 at room temperature into a solvent-less resin component so as to have an insultaing inorganic filler content of 80 to 99% by weight, a high relative-permittivity prepreg obtained from the above high relative-permittivity B-staged sheet, a process for the production of the high relative-permittivity prepreg, and a printed wiring board obtained from any one of the above high relative-permittivity B-staged sheet and the high relative-permittivity prepreg.

Abstract translation: 将相对介电常数至少为500的绝缘无机填料在室温下加入到无溶剂树脂成分中而获得的高相对介电常数B阶片，以使无机填料含量为80-99重量％ ，由上述高相对介电常数B阶片材得到的高相对介电常数预浸料坯，高相对介电常数预浸料坯的制造方法以及由上述高相对介电常数B - 高级相对介电常数预浸料。

公开(公告)号：US20020162218A1

公开(公告)日：2002-11-07

申请号：US09846705

申请日：2001-05-01

Applicant: OAK-MITSUI, Inc.

Inventor： Edward C. Skorupski ,  Jeffrey T. Gray ,  John A. Andresakis ,  Wendy Herrick

IPC: H05K003/02 ,  H05K003/10

CPC classification number: H05K1/036 ,  H05K3/381 ,  H05K3/386 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0793 ,  H05K2203/095 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/53804

Abstract: The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil is laminated to an etched surface of a polyimide substrate having a polyimide film thereon. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.

Abstract translation: 本发明涉及具有改进的层间粘合性的印刷电路板的制造。 更具体地，本发明涉及具有优异的热性能并且可用于生产高密度电路的无粘合剂印刷电路板。 将金属箔层压到其上具有聚酰亚胺膜的聚酰亚胺基板的蚀刻表面上。 蚀刻基板表面允许纯聚酰亚胺膜与基板的强粘附。

公开(公告)号：US06384340B1

公开(公告)日：2002-05-07

申请号：US09800408

申请日：2001-03-06

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H05K103

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K3/4688 ,  H05K2201/0145 ,  H05K2201/0191 ,  H05K2201/09327

Abstract: A multi-layer circuit board includes first, second, third, fourth and fifth insulating substrates, first, second, third and fourth signal wiring layers, a ground wiring layer, and a power wiring layer. The insulating substrates and the wiring layers are press-bonded to each other to form the circuit board with a thickness of about 1.2 mm. Each of the first and fifth insulating substrates has a thickness ranging from 4.175 to 4.725 mil. Each of the second and fourth insulating substrates has a thickness ranging from 5.7 to 6.3 mil. The third insulating substrate has a thickness ranging to 16.8 mil.

Abstract translation: 多层电路板包括第一，第二，第三，第四和第五绝缘基板，第一，第二，第三和第四信号布线层，接地布线层和电源布线层。 绝缘基板和布线层彼此压接，形成约1.2mm厚度的电路板。 第一和第五绝缘基板中的每一个的厚度范围为4.175至4.725密耳。 第二绝缘基板和第四绝缘基板中的每一个具有5.7至6.3密耳的厚度。 第三绝缘基板的厚度为16.8密耳。

公开(公告)号：US06368698B1

公开(公告)日：2002-04-09

申请号：US09573977

申请日：2000-05-19

Applicant: Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: B32B300

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

Abstract translation: 印刷电路板由至少一种包含至少50重量％的丙烯酸纤维的无纺布片材或纤维网层制成，任何平衡物基本上不导电的纤维，填料和粘合剂。 片材或纤维网优选通过泡沫方法制成，并且可以含有60-80％的直链聚丙烯腈纤维和40-20％的原纤化（纸浆）纤维。 纤维网或片材优选通过热压延来压缩，使其具有约0.1-1克/立方厘米的密度; 并且网或片可以具有介于约20-120克/平方米之间的基重。 幅材或片材还可以具有1-40％的基本上不导电的有机或无机粘合剂，或者可以是基本上不含粘合剂的。 使用这些非织造网或片的层制成的印刷电路板是常规的，包括预浸材料，导电电路元件和电子元件，并且与机织玻璃和非织造芳族聚酰胺产品相比具有改进的性能， 包括改进的纤维固结，易于板的构建，以及改善的MD / CD比和稳定性。

公开(公告)号：US06270900B1

公开(公告)日：2001-08-07

申请号：US09530033

申请日：2000-04-24

Applicant: Yasuhiro Wakizaka ,  Kei Sakamoto

Inventor： Yasuhiro Wakizaka ,  Kei Sakamoto

IPC: B32B1508

CPC classification number: B32B27/08 ,  B32B15/08 ,  B32B27/281 ,  B32B27/285 ,  B32B27/34 ,  B32B27/36 ,  B32B2367/00 ,  B32B2371/00 ,  B32B2377/00 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/024 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  Y10T428/24917 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: A composite film having a layer structure of at least two layers, wherein a film (A) formed from a ring structure-containing polymer comprising a repeating unit derived from ring-opening or addition polymerization of a monomer having a ring structure, and a film (B) formed from a polycondensation polymer adjoin each other directly or through an adhesive layer.

Abstract translation: 一种具有至少两层的层结构的复合膜，其中由含有环结构的聚合物形成的膜（A）包含衍生自具有环结构的单体的开环或加成聚合的重复单元和膜 （B）由直接或通过粘合剂层彼此相邻的缩聚聚合物形成。

公开(公告)号：US06258203B1

公开(公告)日：2001-07-10

申请号：US09399775

申请日：1999-09-21

Applicant: Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: D04H500

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

公开(公告)号：US6042936A

公开(公告)日：2000-03-28

申请号：US936045

申请日：1997-09-23

Applicant: Ulrich W. Kempf

Inventor： Ulrich W. Kempf

IPC: B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H21/54 ,  D21H25/06 ,  H05K1/03 ,  B32B5/16 ,  B32B9/00

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K1/0373 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.

Abstract translation: 具有低介电常数且含有基本均匀分布的中空玻璃 - 微球填料的预浸料基板及其制造方法。 用浸渍和层压技术处理预浸料底物以形成具有低介电常数和良好机械和电学性能的层压材料，适合作为用于高性能电路中的表面安装装置的基材。 改进了用于制造高性能电路板和制造表面贴装集成电路的预浸料。 改进用于制造表面贴装集成电路的高性能电路板。

公开(公告)号：US5987739A

公开(公告)日：1999-11-23

申请号：US596472

申请日：1996-02-05

Applicant: Rickie Charles Lake

Inventor： Rickie Charles Lake

IPC: H01L21/48 ,  H01L23/14 ,  H05K1/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/30 ,  B05D3/06

CPC classification number: H01L21/4803 ,  H01L23/145 ,  H01L24/97 ,  H05K3/28 ,  H05K3/381 ,  H01L2924/0002 ,  H01L2924/14 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K3/284 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155

Abstract: A polymer based circuit production method provides a polymer based circuit by exposing a surface of a polymer substrate to ultraviolet radiation resulting in an adhesion promoted polymer substrate surface. A circuit is fabricated on the polymer substrate surface and a coating material is applied to at least a portion of the adhesion promoted polymer substrate surface. A portion of the circuit fabricated on the polymer substrate surface may be encapsulated. The polymer based circuit resulting from the method includes a polymer substrate having an ultraviolet radiation treated surface, a circuit formed on the polymer substrate surface, and a coating material encapsulating at least a portion of the at least one circuit between the polymer substrate and the coating material.

Abstract translation: 基于聚合物的电路制备方法通过将聚合物基材的表面暴露于紫外线辐射而提供基于聚合物的电路，导致粘附促进的聚合物基材表面。 在聚合物基材表面上制造电路，并且将涂料施加到粘合促进的聚合物基材表面的至少一部分上。 在聚合物衬底表面上制造的电路的一部分可以被封装。 由该方法得到的基于聚合物的电路包括具有紫外线辐射处理表面的聚合物基材，形成在聚合物基材表面上的电路以及封装聚合物基材和涂层之间的至少一个电路的至少一部分的涂料 材料。