公开(公告)号：US20170096566A1

公开(公告)日：2017-04-06

申请号：US15317076

申请日：2015-08-03

Applicant: LG CHEM, LTD.

Inventor： Chee-Sung PARK ,  Han Nah JEONG ,  Eun Kyu SEONG ,  Su Jeong LEE ,  Ha Na LEE

IPC: C09D5/24 ,  H05K1/09 ,  H01B5/14 ,  H01B13/00 ,  C08K3/16 ,  H01B1/22

CPC classification number: C09D5/24 ,  C08K3/16 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/40 ,  H01B1/22 ,  H01B5/14 ,  H01B13/0026 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107

Abstract: Provided are a composition for forming a conductive pattern, which enables formation of a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simplified process, a method of forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern includes a polymer resin; and a non-conductive metal compound including a coinage metal element [Group 11 (Group IB)] and a non-metal element, the non-conductive metal compound having a three-dimensional structure formed by vertex sharing of tetrahedrons including the Group 11 metal element, in which a metal core including the Group 11 metal element or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

公开(公告)号：US20160278206A1

公开(公告)日：2016-09-22

申请号：US15165458

申请日：2016-05-26

Applicant: SIERRA CIRCUITS, INC.

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis

IPC: H05K1/03 ,  H05K3/40 ,  H05K3/18 ,  H05K3/00 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K3/4038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0154 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/0716 ,  H05K2203/107

Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

Abstract translation: 印刷电路板包括层叠基板。 层压基板包括抵抗金属电镀的催化材料，除了催化材料的表面被烧蚀之外。 金属痕迹形成在层压基板内的痕迹通道内。 通道延伸到催化材料的表面之下。

公开(公告)号：US20160233152A1

公开(公告)日：2016-08-11

申请号：US15133244

申请日：2016-04-20

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu

IPC: H01L23/495 ,  H01L21/768

CPC classification number: H01L23/49586 ,  H01L21/4828 ,  H01L21/76823 ,  H01L21/76825 ,  H01L23/13 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package structure includes a lead frame, a selective-electroplating epoxy compound, conductive vias and a patterned circuit layer. The lead frame includes a metal stud array having metal studs. The selective-electroplating epoxy compound covers the metal stud array. The selective-electroplating epoxy compound includes non-conductive metal complex. The conductive vias are directly embedded in the selective electroplating epoxy compound to be respectively connected to the metal studs and extended to a top surface of the selective-electroplating epoxy compound. Each of the conductive vias includes a lower segment connected to the corresponding metal stud and an upper segment connected to the lower segment and extended to the top surface, and a smallest diameter of the upper segment is greater than a largest diameter of the lower segment. The patterned circuit layer is directly disposed on the top surface and electrically connected to the conductive vias.

Abstract translation: 封装结构包括引线框，选择性电镀环氧化合物，导电通孔和图案化电路层。 引线框架包括具有金属螺柱的金属螺柱阵列。 选择性电镀环氧化合物覆盖金属螺柱阵列。 选择性电镀环氧化合物包括非导电金属络合物。 导电通孔直接嵌入选择性电镀环氧化合物中，以分别连接到金属螺柱并延伸到选择性电镀环氧化合物的顶表面。 每个导电通孔包括连接到相应的金属螺柱的下部段和连接到下部段并延伸到顶部表面的上段，并且上段的最小直径大于下段的最大直径。 图案化电路层直接设置在顶表面上并电连接到导电通孔。

公开(公告)号：US20160174370A1

公开(公告)日：2016-06-16

申请号：US14777670

申请日：2014-04-17

Applicant: LG CHEM, LTD.

Inventor： Chee-Sung PARK ,  Cheol-Hee PARK ,  Shin Hee JUN ,  Sang Yun JUNG ,  Han Nah JEONG

IPC: H05K1/03 ,  H01B1/22 ,  H05K3/02

CPC classification number: H05K1/036 ,  C08J7/123 ,  C08J2300/22 ,  C08J2300/24 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1658 ,  C23C18/204 ,  C23C18/405 ,  H01B1/22 ,  H05K1/0373 ,  H05K3/027 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107 ,  C08K3/22 ,  C08L69/00

Abstract: The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern, including a polymer resin; and a non-conductive metal compound containing a first metal and a second metal, in which the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contains at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other and a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

Abstract translation: 本发明涉及一种用于形成导电图案的组合物，其能够通过非常简单的工艺在各种聚合物树脂产品或树脂层上形成精细的导电图案，使用其形成导电图案的方法，以及 具有导电图案的树脂结构。 用于形成导电图案的组合物，包括聚合物树脂; 以及含有第一金属和第二金属的非导电金属化合物，其中非导电金属化合物具有包含多个第一层的三维结构，所述第一层包含至少一种第一和第二金属的金属并具有 彼此二维连接的边缘共享八面体和包含与第一层不同的金属并且布置在相邻的第一层之间的第二层; 并且通过电磁辐射由非导电金属化合物形成包含第一或第二金属或其离子的金属芯。

公开(公告)号：US20160135297A1

公开(公告)日：2016-05-12

申请号：US15001140

申请日：2016-01-19

Applicant: SIERRA CIRCUITS, INC.

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl

IPC: H05K1/11 ,  H05K3/42 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K3/387 ,  H05K3/427 ,  H05K2201/0221 ,  H05K2201/0236 ,  H05K2203/0709 ,  Y10T29/49167

Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.

Abstract translation: 印刷电路板中的通孔由延伸穿过介电层压材料中的孔的图案化金属层组成。 一层催化粘合剂涂在孔内的墙壁。 图案化金属层放置在孔内的催化粘合剂上。

公开(公告)号：US09241435B2

公开(公告)日：2016-01-19

申请号：US13709472

申请日：2012-12-10

Applicant: Po-Feng Ho ,  Shi-Jie Yan

Inventor： Po-Feng Ho ,  Shi-Jie Yan

IPC: H05K1/03 ,  H05K13/00 ,  H05K7/00 ,  H01Q1/40 ,  H05K3/18

CPC classification number: H05K13/00 ,  H01Q1/40 ,  H05K3/184 ,  H05K7/00 ,  H05K2201/0236 ,  H05K2201/0999

Abstract: An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed.

Abstract translation: 电子设备外壳包括塑料基板。 塑料基板包括第一表面。 电子设备壳体还包括形成在第一表面上的激活层。 活化层含有金属粉末。 激活层限定凹陷部分。 一些金属粉末部分露出在凹部的表面上。 一些金属粉末部分地插入到与凹部对应的塑料基板中。 电子设备壳体还包括形成在凹部上的天线层。 天线层是金属层。 还公开了一种用于制造电子设备外壳的方法。

公开(公告)号：US20160002791A1

公开(公告)日：2016-01-07

申请号：US14655056

申请日：2013-12-06

Applicant: LPKF LASER & ELECTRONICS AG

Inventor： Robin Alexander KRÜGER ,  Bernd RÖSENER ,  Wolfgang JOHN ,  Arne SCHNOOR ,  Roman OSTHOLT

IPC: C23C18/18 ,  C23C18/28 ,  H01B1/02 ,  C23C18/20

CPC classification number: C23C18/1868 ,  C08J3/226 ,  C08J2323/06 ,  C08J2323/12 ,  C08J2375/04 ,  C08J2467/02 ,  C08J2467/03 ,  C08K3/22 ,  C08K2003/2248 ,  C08K2003/2272 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1639 ,  C23C18/1641 ,  C23C18/1642 ,  C23C18/204 ,  C23C18/28 ,  H01B1/02 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/0999 ,  H05K2203/107 ,  H05K2203/1157 ,  C08L67/02

Abstract: A method for producing an electrically conductive structure, e.g., a conducting track, on a non-conductive substrate material, having an additive (1) having at least one metal compound. The substrate material may be irradiated using a laser to selectively activate the metal compounds, for example inorganic metal compounds, contained in the additive (1). The metal seeds formed by the activation are then metallized to create the electrically conductive structure on the substrate material. Because the additive (1) has a preferably full-surface coating before the additive is introduced into the substrate material, such that the additive (1) is reduced and the coating is oxidized by the laser activation, the reaction partners necessary for the required chemical reaction with the additive (1) are provided by the coating. Because of the thereby significantly reduced interaction with the substrate material, the limitation to certain plastics or plastic groups also is lifted.

Abstract translation: 一种在具有具有至少一种金属化合物的添加剂（1）的不导电基底材料上制造导电结构例如导电轨迹的方法。 可以使用激光照射基板材料，以选择性地激活添加剂（1）中所含的金属化合物，例如无机金属化合物。 然后通过激活形成的金属种子被金属化以在基底材料上产生导电结构。 因为添加剂（1）在将添加剂引入基底材料之前具有优选的全表面涂层，使得添加剂（1）被还原并且涂层被激光活化氧化，所需化学物质所需的反应伴侣 与添加剂（1）的反应由涂层提供。 由于与衬底材料的相互作用显着降低，对某些塑料或塑料组的限制也被提升。

公开(公告)号：US20150373849A1

公开(公告)日：2015-12-24

申请号：US14663447

申请日：2015-03-19

Applicant: IBIS Innotech Inc.

Inventor： Chih-Kung Huang ,  Wei-Jen Lai ,  Wen-Chun Liu

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H01L21/568 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L25/04 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2224/96 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/1715 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/19105 ,  H05K1/113 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014

Abstract: A package structure includes a selective-electroplating epoxy compound, a first patterned circuit layer, second patterned circuit layers, metal studs, contact pads and conductive vias. The selective-electroplating epoxy compound includes cavities, a first surface and a second surface. The cavities disposed on the first surface in array arrangement. The selective-electroplating epoxy compound is formed by combining non-conductive metal complex. The metal studs are disposed in the cavities respectively and protruded from the first surface. The first patterned circuit layer is directly disposed on the first surface. The selective-electroplating epoxy compound exposes a top surface of the patterned circuit layer. The top surface is lower than or coplanar with the first surface. The second patterned circuit layers are directly disposed on the second surface. The conductive vias are disposed at the selective-electroplating epoxy compound to electrically connect the second patterned circuit layers to the corresponding metal studs.

Abstract translation: 封装结构包括选择性电镀环氧化合物，第一图案化电路层，第二图案化电路层，金属柱，接触焊盘和导电通孔。 选择性电镀环氧化合物包括空腔，第一表面和第二表面。 排列在第一表面上的空腔。 选择性电镀环氧化合物通过组合非导电金属络合物形成。 金属螺柱分别设置在空腔中并从第一表面突出。 第一图案化电路层直接设置在第一表面上。 选择性电镀环氧化合物暴露图案化电路层的顶表面。 顶面低于或与第一表面共面。 第二图案化电路层直接设置在第二表面上。 导电通孔设置在选择性电镀环氧化合物处，以将第二图案化电路层电连接到相应的金属螺柱。

公开(公告)号：US20150334826A1

公开(公告)日：2015-11-19

申请号：US14281631

申请日：2014-05-19

Applicant: Konstantine Karavakis ,  Kenneth S. Bahl ,  Steve Carney

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl ,  Steve Carney

IPC: H05K1/03 ,  H05K3/40 ,  H05K3/08 ,  H05K3/10 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/08 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4038 ,  H05K2201/017 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/0716 ,  H05K2203/107

Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

Abstract translation: 印刷电路板包括层叠基板。 层压基板包括抵抗金属电镀的催化材料，除了催化材料的表面被烧蚀之外。 金属痕迹形成在层压基板内的痕迹通道内。 通道延伸到催化材料的表面之下。

公开(公告)号：US20150291778A1

公开(公告)日：2015-10-15

申请号：US14665260

申请日：2015-03-23

Applicant: The Shepherd Color Company ,  LPKF Laser & Electronics AG

Inventor： Michael D. MUSICK ,  David ZIEMNIK ,  James P. WHITE ,  Robin Alexander KRÜGER ,  Bernd RÖSENER ,  Malte Sebastian FENGLER

IPC: C08K9/10 ,  C08L55/02 ,  B23K26/00 ,  C08L69/00

CPC classification number: C08K9/10 ,  C01P2002/70 ,  C01P2004/04 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/84 ,  C08L55/02 ,  C08L69/00 ,  C09C3/063 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/107

Abstract: This invention relates to products of aqueous and other chemical synthetic routes for encapsulation of a core material with an inorganic shell and finished compositions of a core-shell particulate material for application in thermoplastic, thermoset, and coatings resins prior to compounding or application or subsequent thermal processing steps. Disclosed is a composition of particles containing a shell of inorganic oxides or mixed-metal inorganic oxides and a core material of complex inorganic colored pigment, laser direct structuring additives, laser marking, or other beneficial metal oxides, metal compounds, or mixed-metal oxide materials, wherein the shell material is comprised of any single oxide or combination of oxides is taught. Preferred elements of composition for the shell are oxides and silicates of B, Ni, Zn, Al, Zr, Si, Sn, Bi, W, Mo, Cr, Mg, Mn, Ce, Ti, and Ba (or mixtures thereof). Applications may include, but are not limited to, coatings or plastic articles or materials for molded interconnect devices, durable goods, housings, assemblies, devices, and articles that are to be exposed to additional thermal processing. The resulting core-shell materials function in plastic and coatings formulations by minimizing or eliminating detrimental interactions with the resins and metal containing additives resulting in loss of mechanical properties.

Abstract translation: 本发明涉及用于将芯材料与无机壳包封的水性和其它化学合成路线的产品以及用于在复合或应用或后续热处理之前用于热塑性，热固性和涂料树脂的芯 - 壳颗粒材料的成品组合物 处理步骤。 公开了包含无机氧化物或混合金属无机氧化物的壳的颗粒和复合无机着色颜料的核心材料，激光直接结构化添加剂，激光标记或其它有益金属氧化物，金属化合物或混合金属氧化物的组合物 材料，其中壳材料由任何单一氧化物或氧化物的组合组成。 壳的组成的优选元素是B，Ni，Zn，Al，Zr，Si，Sn，Bi，W，Mo，Cr，Mg，Mn，Ce，Ti和Ba（或其混合物）的氧化物和硅酸盐。 应用可以包括但不限于用于模制的互连装置，耐用品，外壳，组件，装置和待暴露于额外热处理的制品的涂层或塑料制品或材料。 所得的核 - 壳材料通过最小化或消除与树脂和含金属的添加剂的有害相互作用导致机械性能的损失，在塑料和涂料配方中起作用。