公开(公告)号：US20120081867A1

公开(公告)日：2012-04-05

申请号：US13200672

申请日：2011-09-28

Applicant: Thomas P. Warwick ,  James V. Russell

Inventor： Thomas P. Warwick ,  James V. Russell

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0233 ,  H05K1/113 ,  H05K1/185 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

Abstract: The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.

Abstract translation: 本公开涉及减少包含RF设备的印刷电路板（PCB）中的不期望的RF噪声。 隔离滤波器嵌入在包含RDF设备的PCB中。 通过将隔离滤波器放置在尽可能靠近RF器件的位置，以便显着减少不必要的RF噪声，这是由于通孔和PCB结构中的平面之间的不可避免的耦合。

公开(公告)号：US08149082B2

公开(公告)日：2012-04-03

申请号：US12666704

申请日：2008-06-26

Applicant: Koichi Hirasawa ,  Hitoshi Amemiya ,  Atsunori Hayashi

Inventor： Koichi Hirasawa ,  Hitoshi Amemiya ,  Atsunori Hayashi

IPC: H01C1/02

CPC classification number: H01C1/084 ,  H01C1/028 ,  H01C1/14 ,  H01C7/003 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49083 ,  Y10T29/49087

Abstract: The resistor device is provided with a resistive plate (11) of metal plate material, which is used as a resistance body; a radiative plate (15) of metal plate material, which is spaced from the resistive plate and intercrossed on the resistive plate; a molded resin body (19), which encloses an intercrossing portion of the resistive plate and the radiative plate; terminal portions of the resistive plate (11a), which comprises so that both ends of the resistive plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body; and terminal portions of the radiative plate (15a), which comprises so that both ends of the radiative plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body. Accordingly, the surface-mountable resin-sealed metal plate resistor device is enabled to increase the power capacity drastically and to improve the reliability without changing most of the size.

Abstract translation: 电阻器件设有金属板材的电阻板（11），用作电阻体; 金属板材的辐射板（15），与电阻板间隔开并交叉在电阻板上; 模制树脂体（19），其包围所述电阻板和所述辐射板的交叉部分; 电阻板（11a）的端子部分，其包括使得从模制树脂体延伸的电阻板的两端沿着模制树脂体的端面和底面弯曲; 和辐射板（15a）的端子部分，其包括使得从模制树脂体延伸的辐射板的两端沿着模制树脂体的端面和底面弯曲。 因此，能够在不改变大部分尺寸的情况下，使表面贴装型树脂密封型金属板电阻元件大幅度地提高功率容量，提高可靠性。

公开(公告)号：US08124883B2

公开(公告)日：2012-02-28

申请号：US12635782

申请日：2009-12-11

Applicant: Osamu Chikagawa

Inventor： Osamu Chikagawa

IPC: H05K1/00

CPC classification number: H05K1/186 ,  B32B18/00 ,  C04B35/632 ,  C04B35/634 ,  C04B35/63404 ,  C04B35/653 ,  C04B37/008 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/656 ,  C04B2235/6583 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/562 ,  C04B2237/68 ,  C04B2237/704 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/091 ,  H05K2201/10636 ,  H05K2203/308 ,  Y02P70/611 ,  Y10T428/24926

Abstract: In a method for manufacturing a ceramic multilayer substrate, when a green ceramic stack prepared by stacking a plurality of ceramic green sheets is fired simultaneously with a ceramic chip electronic component disposed inside the green ceramic stack and including an external terminal electrode to produce a ceramic multilayer substrate having the ceramic chip electronic component inside, a paste layer is disposed in advance between the ceramic chip electronic component and the green ceramic stack, and these three are fired.

Abstract translation: 在制造陶瓷多层基板的方法中，当通过堆叠多个陶瓷生片制备的生坯陶瓷堆叠与设置在生陶瓷堆叠内的陶瓷芯片电子部件同时烧制并且包括外部端子电极以制造陶瓷多层基板 内部具有陶瓷芯片电子部件的基板，预先在陶瓷芯片电子部件和绿色陶瓷叠层之间设置糊状层，将其烧成。

公开(公告)号：US20120037411A1

公开(公告)日：2012-02-16

申请号：US12967791

申请日：2010-12-14

Applicant: Shih-Ping Hsu ,  Zhao-Chong Zeng

Inventor： Shih-Ping Hsu ,  Zhao-Chong Zeng

IPC: H05K1/16 ,  H05K3/30

CPC classification number: H05K3/32 ,  H01L23/49822 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: A packaging substrate includes: a core board with at least a cavity; a dielectric layer unit having upper and lower surfaces and encapsulating the core board and filling the cavity; a plurality of positioning pads embedded in the lower surface of the dielectric layer unit; at least a passive component having upper and lower surfaces with electrode pads disposed thereon and embedded in the dielectric layer unit so as to be received in the cavity of the core board at a position corresponding to the positioning pads; first and second wiring layers disposed on the upper and lower surfaces of the dielectric layer unit and electrically connected to the electrode pads of the upper and lower surfaces of the passive component through conductive vias, respectively. By embedding the passive component in the core board and the dielectric layer unit, the invention effectively reduces the height of the overall structure.

Abstract translation: 封装基板包括：具有至少空腔的芯板; 介电层单元，具有上表面和下表面并且封装所述芯板并填充所述空腔; 多个定位焊盘，其嵌入在所述电介质层单元的下表面中; 至少一个无源部件，具有上表面和下表面，其上设置有电极焊盘并且嵌入在电介质层单元中，以便在对应于定位焊盘的位置处容纳在芯板的空腔中; 第一和第二布线层分别设置在电介质层单元的上表面和下表面上，并分别通过导电通孔与无源部件的上表面和下表面的电极焊盘电连接。 通过将无源部件嵌入在核心板和电介质层单元中，本发明有效地降低了整体结构的高度。

公开(公告)号：US08116092B2

公开(公告)日：2012-02-14

申请号：US12035819

申请日：2008-02-22

Applicant: Yuji Ishida ,  Hideto Takekawa ,  Masato Harikae ,  Kazutaka Terada

Inventor： Yuji Ishida ,  Hideto Takekawa ,  Masato Harikae ,  Kazutaka Terada

IPC: H05K7/06 ,  H05K3/32

CPC classification number: H05K1/0268 ,  H05K1/0293 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2203/0545 ,  H05K2203/162 ,  H05K2203/168 ,  H05K2203/175 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A circuit board includes a substrate, a conductive pattern arranged on the substrate that includes an interconnecting circuit. The circuit board also includes a plurality of land pads having a pair of first land pads on which no electronic components are mounted and electrically connected to each other through the interconnecting circuit. The circuit board further includes an insulating layer on the substrate. The insulating layer has first openings that allow the pair of the first land pads to be exposed through the insulating layer.

Abstract translation: 电路板包括衬底，布置在衬底上的导电图案，其包括互连电路。 电路板还包括多个接地焊盘，其具有一对第一接地焊盘，其上没有安装电子部件并且通过互连电路彼此电连接。 电路板还包括在基板上的绝缘层。 绝缘层具有允许一对第一焊盘通过绝缘层露出的第一开口。

公开(公告)号：US08107253B2

公开(公告)日：2012-01-31

申请号：US12034517

申请日：2008-02-20

Applicant: Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

Inventor： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC: H05K1/18

CPC classification number: H05K1/115 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/248 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/112 ,  H05K1/181 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

Abstract: A printed circuit board includes a chip capacitor having electrodes and a metal film formed on one or more of the electrodes, an accommodating layer accommodating the chip capacitor inside the accommodating layer, a connection layer formed over the accommodating layer and having a via hole opening extending to the metal film, and a first via hole structure formed in the via hole opening of the connection layer and connected to the metal film on the one or more of the electrodes of the chip capacitor.

Abstract translation: 印刷电路板包括具有电极的片状电容器和形成在一个或多个电极上的金属膜，在容纳层内容纳片状电容器的容纳层，形成在容纳层上的连接层，并且具有通孔开口延伸 以及形成在连接层的通孔开口中并连接到片式电容器的一个或多个电极上的金属膜的第一通孔结构。

公开(公告)号：US08105687B2

公开(公告)日：2012-01-31

申请号：US12959752

申请日：2010-12-03

Applicant: Akihiro Nomura ,  Hidekiyo Takaoka ,  Kosuke Nakano

Inventor： Akihiro Nomura ,  Hidekiyo Takaoka ,  Kosuke Nakano

IPC: B32B7/12 ,  H01L23/29

CPC classification number: H05K3/321 ,  C08K3/08 ,  C08K7/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/0425 ,  Y02P70/611 ,  Y10T428/2857 ,  Y10T428/31678

Abstract: An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0. Thereby, an electroconductive bonding material is provided which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.

公开(公告)号：US20120008064A1

公开(公告)日：2012-01-12

申请号：US13257679

申请日：2009-11-04

Applicant: Hiroki Miyazaki

Inventor： Hiroki Miyazaki

IPC: G02F1/1335 ,  H05K1/16 ,  H05K3/30 ,  H05K7/00

CPC classification number: H05K3/321 ,  H01L2224/27334 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83851 ,  H01L2224/97 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2224/83

Abstract: Provided are a chip component mounting structure and a chip component mounting method, wherein when a plurality of chip components having different heights are mounted on a substrate via an anisotropic conductive film, position gaps which occur when the chip components are pressure-bonded to the substrate are prevented, and the chip components can be accurately mounted to the substrate at target positions; and a liquid crystal display device provided with the substrate. In the chip component mounting structure, a position fixing resin (4) for maintaining the orientation of chip components (2) which are pressure-bonded to a substrate (1) via an anisotropic conductive film (7) is provided. In the chip component mounting method, after the position fixing resin (4) for maintaining the orientation of the chip components (2) which are mounted to the substrate (1) via the anisotropic conductive film (7) is applied to the substrate (1) and cured, the chip components (2) are heated at a predetermined temperature and pressed at a predetermined pressure via an elastic sheet (5) provided on the chip components (2) and, then, pressure-bond to the substrate (1) together. The liquid crystal display is provided with such a substarate.

Abstract translation: 提供了一种芯片部件安装结构和芯片部件安装方法，其中当通过各向异性导电膜将多个具有不同高度的芯片部件安装在基板上时，当芯片部件被压接在基板上时发生位置间隙 并且能够将芯片部件精确地安装在基板的目标位置; 以及设置有该基板的液晶显示装置。 在芯片部件安装结构中，设置有用于通过各向异性导电膜（7）将用于保持与基板（1）压接的芯片部件（2）的取向保持的定位树脂（4）。 在芯片部件安装方法中，在用于将经由各向异性导电膜（7）安装到基板（1）的芯片部件（2）的取向的位置固定树脂（4）施加到基板（1） ）并固化，芯片部件（2）被加热到预定温度，并通过设置在芯片部件（2）上的弹性片（5）以预定压力压制，然后压接到基板（1） 一起。 液晶显示器设置有这样的基底。

公开(公告)号：US20110292625A1

公开(公告)日：2011-12-01

申请号：US13117614

申请日：2011-05-27

Applicant: HAN-CHUNG CHEN ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

Inventor： HAN-CHUNG CHEN ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

IPC: H05K7/06

CPC classification number: H05K1/111 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/8338 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H05K1/0295 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611

Abstract: A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

Abstract translation: 公开了一种焊盘结构，其由相对于轴线对称设置的两个焊盘单元组成。 每个焊盘单元进一步由至少两个焊盘组成，即每个焊盘单元由至少一个第一焊盘和至少一个第二接合焊盘构成。 在一个实施例中，第一焊盘靠近轴线布置，并且第二焊盘布置在相对应的第一焊盘的远离轴线的一侧，同时使得第一焊盘和相应的第二焊盘是 通过第一颈部部彼此互连。 因此，可以通过互连可以用于焊接不同尺寸的电子部件的至少两个焊盘单元来形成不同尺寸的多个焊料区域。

公开(公告)号：US20110279990A1

公开(公告)日：2011-11-17

申请号：US13145768

申请日：2009-02-26

Applicant: Makoto Hirano

Inventor： Makoto Hirano

IPC: H05K1/02

CPC classification number: H05K1/111 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/094 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed board includes footprints which are electrically solder-bonded to a surface-mounting substrate, on which electronic components are mounted, and which assists the heat release from the surface-mounting substrate. The footprint comprises a fillet-forming division which is placed on an outer-edge side of the surface-mounting substrate and where solder is supplied independently when solder-bonding is performed. The fillet-forming division is solder-bonded to the same electrode as the electrode of the surface-mounting substrate to which the footprint is solder-bonded.

Abstract translation: 印刷电路板包括与焊接到表面安装基板上的电焊焊接，其上安装有电子部件，并且有助于从表面安装基板释放热量。 占地面积包括一个放置在表面安装基板的外边缘侧的焊脚形成部分，并且在进行焊接时独立地供应焊料。 圆角形成部分焊接到与焊接焊点的表面安装基板的电极相同的电极上。