公开(公告)号：US09140042B2

公开(公告)日：2015-09-22

申请号：US14207796

申请日：2014-03-13

Applicant: Raviv Erlich ,  Yuval Gerson

Inventor： Raviv Erlich ,  Yuval Gerson

IPC: E05D1/02 ,  B81C1/00 ,  G02B26/08

CPC classification number: F16C11/12 ,  B81B3/0043 ,  B81B2201/0235 ,  B81B2201/034 ,  B81B2201/042 ,  B81B2203/0118 ,  B81B2203/0163 ,  B81C1/0015 ,  B81C1/00198 ,  B81C1/00523 ,  B81C2201/013 ,  E05D1/02 ,  E05D7/00 ,  E05D11/0081 ,  F16F1/48 ,  F16F2224/025 ,  F16F2226/00 ,  F16F2226/042 ,  G01C19/02 ,  G01P15/09 ,  G01P15/093 ,  G01P15/125 ,  G02B26/0833 ,  G02B26/105 ,  Y10T16/522 ,  Y10T16/525 ,  Y10T29/24 ,  Y10T29/25

Abstract: A mechanical device includes a long, narrow element made of a rigid, elastic material. A rigid frame is configured to anchor at least one end of the element, which is attached to the frame, and to define a gap running longitudinally along the element between the beam and the frame, so that the element is free to move within the gap. A solid filler material, different from the rigid, elastic material, fills at least a part of the gap between the element and the frame so as to permit a first mode of movement of the element within the gap while inhibiting a different, second mode of movement.

Abstract translation: 机械装置包括由刚性弹性材料制成的长而窄的元件。 刚性框架构造成锚固附接到框架的元件的至少一个端部并且限定沿着梁和框架之间的元件纵向延伸的间隙，使得元件在间隙内自由移动 。 与刚性弹性材料不同的固体填充材料填充元件和框架之间的间隙的至少一部分，以便允许元件在间隙内的第一移动模式，同时抑制不同的第二模式 运动。

公开(公告)号：US09041128B2

公开(公告)日：2015-05-26

申请号：US13768246

申请日：2013-02-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： George A. Dunbar, III ,  Jeffrey C. Maling ,  William J. Murphy ,  Anthony K. Stamper

IPC: H01L29/84 ,  H01H1/00 ,  H01L41/113 ,  B81C1/00 ,  H01H57/00 ,  B81B3/00 ,  G06F17/50

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A Micro-Electro-Mechanical System (MEMS). The MEMS includes a lower chamber with a wiring layer and an upper chamber which is connected to the lower chamber. A MEMS beam is suspended between the upper chamber and the lower chamber. A lid structure encloses the upper chamber, which is devoid of structures that interfere with a MEMS beam. The lid structure has a surface that is conformal to a sacrificial material vented from the upper chamber.

Abstract translation: 微机电系统（MEMS）。 MEMS包括具有布线层的下室和连接到下室的上室。 MEMS梁悬挂在上室和下室之间。 盖结构包围上室，其没有干扰MEMS梁的结构。 盖结构具有与从上室排出的牺牲材料共形的表面。

公开(公告)号：US20140270272A1

公开(公告)日：2014-09-18

申请号：US13973812

申请日：2013-08-22

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jung-Huei Peng ,  Chia-Hua Chu ,  Yao-Te Huang ,  Chin-Yi Cho ,  Li-Min Hung ,  Chun-Wen Cheng

IPC: H04R1/08

CPC classification number: H04R31/003 ,  B81C1/00158 ,  B81C2201/0125 ,  B81C2201/013 ,  B81C2201/053 ,  B81C2203/036 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/003 ,  H04R2307/027

Abstract: The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate; a silicon oxide layer formed on one side of the first silicon substrate; a second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates; and a diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates, wherein the first plate and the diaphragm are configured to form a capacitive microphone.

Abstract translation: 本公开提供了集成麦克风结构的一个实施例。 集成麦克风结构包括图案化为第一板的第一硅衬底; 形成在所述第一硅衬底的一侧上的氧化硅层; 第二硅衬底，通过所述氧化硅层与所述第一衬底接合，使得所述氧化硅层夹在所述第一和第二硅衬底之间; 以及隔膜，其固定在所述氧化硅层上并且设置在所述第一和第二硅衬底之间，其中所述第一板和所述隔膜被构造成形成电容式麦克风。

公开(公告)号：US08685778B2

公开(公告)日：2014-04-01

申请号：US12973285

申请日：2010-12-20

Applicant: Christopher V. Jahnes ,  Anthony K. Stamper

Inventor： Christopher V. Jahnes ,  Anthony K. Stamper

IPC: B81C1/00

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) cavity includes forming a first sacrificial cavity layer over a lower wiring layer. The method further includes forming a layer. The method further includes forming a second sacrificial cavity layer over the first sacrificial layer and in contact with the layer. The method further includes forming a lid on the second sacrificial cavity layer. The method further includes forming at least one vent hole in the lid, exposing a portion of the second sacrificial cavity layer. The method further includes venting or stripping the second sacrificial cavity layer such that a top surface of the second sacrificial cavity layer is no longer touching a bottom surface of the lid, before venting or stripping the first sacrificial cavity layer thereby forming a first cavity and second cavity, respectively.

Abstract translation: 形成至少一个微机电系统（MEMS）腔的方法包括在下布线层上形成第一牺牲腔层。 该方法还包括形成层。 该方法还包括在第一牺牲层上形成与层接触的第二牺牲腔层。 该方法还包括在第二牺牲腔层上形成盖子。 该方法还包括在盖中形成至少一个通气孔，暴露第二牺牲腔层的一部分。 该方法还包括排气或剥离第二牺牲腔层，使得第二牺牲腔层的顶表面在不排除或剥离第一牺牲腔层之前不再接触盖的底表面，从而形成第一腔和第二腔 腔。

公开(公告)号：US20130221454A1

公开(公告)日：2013-08-29

申请号：US13768246

申请日：2013-02-15

Applicant: International Business Machines Corporation

Inventor： George A. DUNBAR, III ,  Jeffrey C. MALING ,  William J. MURPHY ,  Anthony K. STAMPER

IPC: B81B3/00

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A Micro-Electro-Mechanical System (MEMS). The MEMS includes a lower chamber with a wiring layer and an upper chamber which is connected to the lower chamber. A MEMS beam is suspended between the upper chamber and the lower chamber. A lid structure encloses the upper chamber, which is devoid of structures that interfere with a MEMS beam. The lid structure has a surface that is conformal to a sacrificial material vented from the upper chamber.

Abstract translation: 微机电系统（MEMS）。 MEMS包括具有布线层的下室和连接到下室的上室。 MEMS梁悬挂在上室和下室之间。 盖结构包围上室，其没有干扰MEMS梁的结构。 盖结构具有与从上室排出的牺牲材料共形的表面。

公开(公告)号：US20120281286A1

公开(公告)日：2012-11-08

申请号：US13202528

申请日：2010-02-19

Applicant: Sasikanth Manipatruni ,  Michal Lipson ,  Jacob T. Robinson

Inventor： Sasikanth Manipatruni ,  Michal Lipson ,  Jacob T. Robinson

IPC: G02B26/00

CPC classification number: G02B26/001 ,  A61F9/022 ,  A61F9/023 ,  B81B3/0083 ,  B81B2201/04 ,  B81B2201/047 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81C1/0015 ,  B81C2201/013 ,  G02B1/005 ,  G02B6/4209 ,  G02C7/104 ,  G02C7/107 ,  H01S3/005 ,  H01S3/0064

Abstract: There is set forth herein an optomechanical device which can comprise a first mirror and a second mirror forming with the first mirror a cavity. In one aspect the first mirror can be a movable mirror. The optomechanical device can be adapted so that the first mirror is moveable responsively to radiation force.

Abstract translation: 这里提出了一种光学机械装置，其可以包括第一反射镜和形成有第一反射镜的第二反射镜的腔。 在一个方面，第一镜可以是可移动镜。 光学机械装置可以适于使得第一反射镜能够响应于辐射力而移动。

公开(公告)号：US20110315527A1

公开(公告)日：2011-12-29

申请号：US12974854

申请日：2010-12-21

Applicant: Dinh DANG ,  Thai DOAN ,  George A. DUNBAR, III ,  Zhong-Xiang HE ,  Russell T. HERRIN ,  Christopher V. JAHNES ,  Jeffrey C. MALING ,  William J. MURPHY ,  Anthony K. STAMPER ,  John G. TWOMBLY ,  Eric J. WHITE

Inventor： Dinh DANG ,  Thai DOAN ,  George A. DUNBAR, III ,  Zhong-Xiang HE ,  Russell T. HERRIN ,  Christopher V. JAHNES ,  Jeffrey C. MALING ,  William J. MURPHY ,  Anthony K. STAMPER ,  John G. TWOMBLY ,  Eric J. WHITE

IPC: H01H57/00 ,  H01L21/66 ,  G06F17/50 ,  H01L21/28

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: Planar cavity Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structure are provided. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity having a planar surface using a reverse damascene process.

Abstract translation: 提供了平面腔微机电系统（MEMS）结构，制造方法和设计结构。 该方法包括使用反向镶嵌工艺形成具有平面表面的至少一个微机电系统（MEMS）空腔。

公开(公告)号：US20110314669A1

公开(公告)日：2011-12-29

申请号：US12973381

申请日：2010-12-20

Applicant: Anthony K. STAMPER ,  John G. TWOMBLY

Inventor： Anthony K. STAMPER ,  John G. TWOMBLY

IPC: H05K3/10 ,  H05K13/04

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is movable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

Abstract translation: 形成至少一个微电子机械系统（MEMS）的方法包括：对布线层进行图案化以形成至少一个固定板并在布线层上形成牺牲材料。 该方法还包括在至少一个固定板上形成一层或多层薄膜的绝缘体层，以及下层衬底的暴露部分，以防止在布线层和牺牲材料之间形成反应产物。 该方法进一步包括形成至少一个可在该至少一个固定板上移动的MEMS梁。 该方法还包括排出或剥离牺牲材料以形成至少第一腔。

公开(公告)号：US20110081138A1

公开(公告)日：2011-04-07

申请号：US12968150

申请日：2010-12-14

Applicant: Ming Fang ,  Fuchao Wang

Inventor： Ming Fang ,  Fuchao Wang

IPC: H05B3/82 ,  B23P19/04

CPC classification number: B81C1/00119 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/14137 ,  B41J2/16 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1639 ,  B81B1/006 ,  B81B2201/052 ,  B81B2201/058 ,  B81C2201/013 ,  B81C2203/075 ,  H01L28/20 ,  Y10T29/41 ,  Y10T29/49401 ,  Y10T29/49826

Abstract: An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

Abstract translation: 集成半导体加热组件包括半导体衬底，形成在其中的腔室以及与腔室流体连通的出口，允许流体响应于加热室而离开腔室。 集成加热组件包括邻近腔室的第一加热元件，该第一加热元件可以产生高于选定阈值的热量，并将腔室中的流体朝向出口偏压。 第二加热元件邻近出口定位以产生高于所选阈值的热量，便于流体通过出口远离腔室的运动。 添加第二加热元件减少了每个加热元件发出的热量，并使吸热材料的厚度最小化到出口的开口端。 由于这样的材料是昂贵的，所以这降低了组件的制造成本和零售价格，同时提高了其效率和使用寿命。

公开(公告)号：US20090236309A1

公开(公告)日：2009-09-24

申请号：US12052956

申请日：2008-03-21

Applicant: Dan B. Millward ,  Timothy Quick

Inventor： Dan B. Millward ,  Timothy Quick

IPC: B44C1/22 ,  B05D5/00

CPC classification number: H01L21/76828 ,  B81C1/00031 ,  B81C2201/013 ,  B81C2201/0149 ,  B81C2201/0198 ,  B82Y30/00 ,  C08F299/02 ,  C08F299/0492 ,  G03F7/0002 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/31133 ,  H01L21/76802 ,  H01L21/76877

Abstract: Methods for fabricating sublithographic, nanoscale microstructures utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.

Abstract translation: 提供了利用自组装嵌段共聚物制造亚光刻，纳米级微结构的方法，以及由这些方法形成的膜和器件。