公开(公告)号：US09743167B2

公开(公告)日：2017-08-22

申请号：US14950568

申请日：2015-11-24

Applicant: Knowles Electronics, LLC

Inventor： John Nielsen ,  Selvakumar Sivarajah ,  Aziz Yurrtas

IPC: H04R1/04 ,  B81B7/00 ,  B81B7/02 ,  H04R1/22 ,  H04R3/00 ,  H04R19/01

CPC classification number: H04R1/04 ,  B81B7/008 ,  B81B7/02 ,  H04R1/222 ,  H04R3/007 ,  H04R19/016 ,  H04R2201/003 ,  H04R2499/11

Abstract: An apparatus includes a microelectromechanical system (MEMS) device having a diaphragm and a back plate; a clipping circuit coupled to the MEMS device, wherein the clipping circuit is configured to clip an output signal of the MEMS device so that the maximum signal drawn by a buffer is substantially constant over a temperature range; and an integrated circuit coupled to the clipping circuit, the integrated circuit including the buffer.

公开(公告)号：US09738515B2

公开(公告)日：2017-08-22

申请号：US13925076

申请日：2013-06-24

Applicant: Invensense, Inc.

Inventor： David Bolognia ,  Kieran P. Harney

IPC: B81C1/00 ,  B81B7/00 ,  B81B3/00 ,  H04R19/00

CPC classification number: B81C1/00333 ,  B81B3/0094 ,  B81B7/0032 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/16152 ,  H04R19/005 ,  H04R2201/003 ,  H01L2924/00014

Abstract: A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.

公开(公告)号：US20170238108A1

公开(公告)日：2017-08-17

申请号：US15114314

申请日：2015-02-24

Applicant: Robert Bosch GmbH

Inventor： John Matthew Muza

IPC: H04R29/00 ,  H04R19/04 ,  H04R19/00

CPC classification number: H04R29/004 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A self-testing electro-mechanical capacitive sensor system. The system includes an electro-mechanical capacitive sensor and a controller. The controller is configured to receive a signal to activate a test mode, and upon receiving the signal to activate the test mode: (a) apply a bias voltage step to the electro-mechanical capacitive sensor, (b) measure a corresponding deflection of a membrane of the electro-mechanical capacitive sensor for the bias voltage as a function of time, and repeat steps (a) and (b) for a plurality of magnitudes of the bias voltage to determine at least one performance parameter of the electro-mechanical capacitive sensor.

公开(公告)号：US20170236547A1

公开(公告)日：2017-08-17

申请号：US15584557

申请日：2017-05-02

Applicant: SOWHAT STUDIO DI MICHELE BAGGIO

Inventor： Michele BAGGIO ,  Dino BAGGIO

IPC: G11B20/10 ,  H04R3/00 ,  H04R5/027 ,  H04R1/40

CPC classification number: G11B20/10527 ,  G11B2020/10546 ,  G11B2020/10601 ,  H04R1/406 ,  H04R3/005 ,  H04R5/027 ,  H04R2201/003 ,  H04R2201/401 ,  H04S2400/15

Abstract: The portable sound recorder (1) according to the invention comprises A) a plurality of microphones (1A-F) arranged for picking up voices or sounds from an external environment; B) a protective outer shell (10) that encloses: B.1) a logic unit (2) programmed or in any case arranged for processing the electrical or opto-electronic signals emitted by the plurality of microphones improving the quality of the sounds recorded; B.2) a mass memory (4) arranged for memorising and store/conserve the sounds picked up by the plurality of microphones; B.3) an electric power supply (6) that supplies the logic unit and the mass memory; and where the plurality of microphones comprises at least two microphones of the Micro-ElectroMechanical System (MEMS) type. The recorder is suitable for semi-professional use, is very small in size, can very faithfully reproduce atmosphere and directionality effects, is suitable for example for making cinematographic recordings or recordings of natural phenomena, live concerts or other music or sports events and press conferences.

公开(公告)号：US20170236506A1

公开(公告)日：2017-08-17

申请号：US15583861

申请日：2017-05-01

Applicant: Chirp Microsystems, Inc.

Inventor： Richard Przybyla ,  Andre Guedes ,  Stefon Shelton ,  Meng-Hsiung Kiang ,  David Horsley

IPC: G10K11/00 ,  G01S15/10 ,  G01S7/521 ,  G10K11/34

CPC classification number: G10K11/002 ,  G01S7/521 ,  G01S15/10 ,  G10K11/346 ,  H04R3/04 ,  H04R17/00 ,  H04R29/002 ,  H04R29/005 ,  H04R2201/003 ,  H04R2217/03

Abstract: A system and method use an array of ultrasonic transducers to emit and receive sound in a phased array fashion by using acoustic waveguides to achieve a desired acoustic radiation and reception pattern. A chip package attached to an acoustic transducer array includes acoustic waveguides coupled to acoustic ports. Each waveguide is coupled between a corresponding acoustic transducer and a corresponding acoustic port. A spacing of a pair of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers.

公开(公告)号：US20170215014A1

公开(公告)日：2017-07-27

申请号：US15402474

申请日：2017-01-10

Applicant: Sonion Nederland B.V.

Inventor： Rasmus Voss

IPC: H04R25/00 ,  H04R19/04

CPC classification number: H04R25/604 ,  H04R1/1016 ,  H04R11/02 ,  H04R19/005 ,  H04R19/01 ,  H04R19/04 ,  H04R25/00 ,  H04R2201/003 ,  H04R2225/021 ,  H04R2225/023 ,  H04R2225/025

Abstract: A receiver assembly including a moving armature having a first portion and a second portion, and a first diaphragm being operatively connected to the first portion of the moving armature. The first portion of the moving armature is operatively connected to the first diaphragm in a manner so that an angular momentum induced by movements of the first portion of the moving armature is essentially counteracted by an angular momentum induced by movements of the first diaphragm.

公开(公告)号：US20170215001A1

公开(公告)日：2017-07-27

申请号：US15482637

申请日：2017-04-07

Applicant: Invensense, Inc.

Inventor： Kieran P. Harney ,  Dipak Sengupta ,  Brian Moss ,  Alain V. Guery

IPC: H04R1/34 ,  H04R19/04 ,  H04R19/00 ,  H04R1/04

CPC classification number: H04R1/342 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/04 ,  H04R1/08 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

公开(公告)号：US20170214994A1

公开(公告)日：2017-07-27

申请号：US15005951

申请日：2016-01-25

Applicant: Knowles Electronics, LLC

Inventor： Sharon Gadonniex ,  Sarmad Qutub ,  William Ryan

IPC: H04R1/10 ,  H04R29/00 ,  G01H7/00

CPC classification number: H04R1/1016 ,  G01H7/00 ,  H04R1/1041 ,  H04R1/105 ,  H04R1/1091 ,  H04R29/001 ,  H04R2201/003 ,  H04R2420/07 ,  H04R2460/01 ,  H04R2460/15

Abstract: Systems and methods for earbud control based on proximity detection are provided. An example method includes transmitting ultrasonic signals and receiving reflected ultrasonic signals. Based at least partially on the reflected ultrasonic signals, a distance of an earbud to an ear canal may be determined. If the distance is above a first predetermined threshold value, a low-power mode is activated. If the distance is below the first predetermined threshold value, a functionality of the earbud is modified. Modifying the functionality of the earbud may include activating a full power mode and may further include determining a quality of a seal, provided by the earbud, in the ear canal. If the quality of the seal is above a second predetermined threshold value, a positive feedback is provided to a user. If the quality of the seal is below the second predetermined threshold value, a negative feedback is provided to the user.

公开(公告)号：US20170195814A1

公开(公告)日：2017-07-06

申请号：US15463291

申请日：2017-03-20

Applicant: Robert Bosch GmbH

Inventor： Jay Scott Salmon

IPC: H04R31/00 ,  H04R1/04

CPC classification number: H04R31/006 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/0792 ,  H01L2224/48137 ,  H01L2224/73265 ,  H04R1/04 ,  H04R19/04 ,  H04R2201/003

Abstract: A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.

公开(公告)号：US20170190571A1

公开(公告)日：2017-07-06

申请号：US15468066

申请日：2017-03-23

Applicant: INVENSENSE, Inc.

Inventor： Julius Ming-Lin Tsai ,  Baris Cagdaser ,  Martin Lim ,  Aleksey S. Khenkin

IPC: B81B7/02 ,  H04R1/04 ,  H04R29/00 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16152 ,  H04R1/04 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.