公开(公告)号：US5858884A

公开(公告)日：1999-01-12

申请号：US856548

申请日：1997-05-15

Applicant: Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

Inventor： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

IPC: B32B15/14 ,  C08J5/04 ,  C09D5/25 ,  D04H1/00 ,  D04H1/42 ,  D04H1/58 ,  D21H13/26 ,  D21H17/52 ,  H05K1/02 ,  H05K1/03 ,  C08J5/24

CPC classification number: H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

Abstract: A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan.delta.) peak value at 30.degree.-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

Abstract translation: 一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基材的预浸料坯和印刷线路板。

公开(公告)号：US5116670A

公开(公告)日：1992-05-26

申请号：US589578

申请日：1990-09-28

Applicant: Noboru Suzuki ,  Masaharu Yoshida ,  Satoshi Noda ,  Minoru Takaishi ,  Kenichiro Takiguchi ,  Hiroshi Uchida ,  Takeshi Onoda

Inventor： Noboru Suzuki ,  Masaharu Yoshida ,  Satoshi Noda ,  Minoru Takaishi ,  Kenichiro Takiguchi ,  Hiroshi Uchida ,  Takeshi Onoda

IPC: C08F299/04 ,  C08J5/06 ,  C08J5/24 ,  H05K1/03 ,  H05K3/38

CPC classification number: C08J5/24 ,  C08F299/0485 ,  C08J5/06 ,  H05K1/0366 ,  C08J2367/07 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K3/386 ,  Y10S428/901 ,  Y10T428/31522 ,  Y10T428/3162 ,  Y10T428/31652 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31703 ,  Y10T428/3179 ,  Y10T428/31794 ,  Y10T442/3415

Abstract: Resin compositions for laminated sheets and laminated sheets produced therefrom are disclosed, the compositions comprising at least one allyl ester resin composed of a polybasic acid and a polyhydric alcohol, wherein an allyl ester group of said resin is bonded to at least one of terminals thereof.

公开(公告)号：US4997702A

公开(公告)日：1991-03-05

申请号：US475454

申请日：1990-02-06

Applicant: Samuel Gazit ,  Gary W. Adams

Inventor： Samuel Gazit ,  Gary W. Adams

IPC: B32B27/20 ,  H05K1/00 ,  H05K1/03

CPC classification number: H05K1/0373 ,  B32B27/20 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/057 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2713

Abstract: A printed circuit board composed of an epoxy impregnated nonwoven web substrate laminated to electrically conductive sheets is presented. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems. The printed circuit board also has improved thermal properties achieved through the addition of up to 70% by weight of low coefficient of thermal expansion (CTE) particulate fillers and/or the use of thermally stable reinforcement fibers in the non-woven web.

Abstract translation: 提出了一种印刷电路板，其由层压在导电片上的环氧树脂浸渍非织造网基材组成。 印刷电路板的灵活性在于它可以弯曲成任何所需的多平面形状，并且在电气互连系统所要求的安装之后将保持该形状。 印刷电路板还具有通过添加高达70重量％的低热膨胀系数（CTE）颗粒填料和/或在无纺布网中使用热稳定的增强纤维而获得的改进的热性能。

公开(公告)号：US4894271A

公开(公告)日：1990-01-16

申请号：US190986

申请日：1988-05-06

Applicant: Kiyoshi Hani ,  Mutsuko Hayama ,  Yoshio Nishimoto ,  Hiroshi Hishiki ,  Minoru Kimura ,  Tatsushi Nakai

Inventor： Kiyoshi Hani ,  Mutsuko Hayama ,  Yoshio Nishimoto ,  Hiroshi Hishiki ,  Minoru Kimura ,  Tatsushi Nakai

IPC: B32B15/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/42 ,  H05K3/44

CPC classification number: B32B15/14 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0251 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K3/427 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24934 ,  Y10T428/31678

Abstract: Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.

Abstract translation: 印刷电路板制造方法和所得板。 在具有通孔的芯金属片的每一侧上放置多个由陶瓷纸构成并含有不同量树脂的预浸料片。 在芯的每一侧上的预浸片上放置铜箔。 所有的层在加热下压在一起以制成金属芯印刷线路板。 预浸片形成在芯的每一侧具有高散热能力的绝缘层和在其通孔中的可靠的绝缘体。 陶瓷纸基本上由直径不超过纤维微米并且长度为5至500微米的短陶瓷纤维组成，并且包含3至10重量％的作为陶瓷纤维的粘合剂的微纤化纤维素纤维。

公开(公告)号：US4799996A

公开(公告)日：1989-01-24

申请号：US78166

申请日：1987-07-27

Applicant: Robert Cassat

Inventor： Robert Cassat

IPC: C08L61/06 ,  C08G59/00 ,  C08G59/18 ,  C08G85/00 ,  C08L61/00 ,  C08L61/04 ,  C08L63/00 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  D21H1/48

CPC classification number: H05K3/188 ,  H05K1/0373 ,  H05K3/387 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0245 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/256

Abstract: Substrate composites, well adopted for the production of metallized printed circuits and facilely prepared by, e.g., papermaking procedures, include a central core layer comprising fibrous cellulosic material or flaked mica within a matrix of a thermosetting resin binder, said central core element having coextensively laminated to at least one of the face surfaces thereof, a lamina of a thermosetting resin comprising non-conductive metal oxide filler material distributed therethrough, and said metal oxide being borohydride reduceable and reactive to form unstable metal hydride intermediates.

Abstract translation: 用于生产金属化印刷电路并通过例如造纸方法容易制备的基材复合材料包括在热固性树脂粘合剂的基体内包含纤维状纤维素材料或薄片状云母的中心芯层，所述中心芯部元件具有共同层压 至少一个其表面，包含分布在其中的非导电金属氧化物填充材料的热固性树脂的层，并且所述金属氧化物是硼氢化物可还原和反应以形成不稳定的金属氢化物中间体。

公开(公告)号：US4784893A

公开(公告)日：1988-11-15

申请号：US14742

申请日：1987-02-13

Applicant: Yoshio Nishimoto ,  Kiyoshi Hani ,  Shohei Etoh

Inventor： Yoshio Nishimoto ,  Kiyoshi Hani ,  Shohei Etoh

IPC: B32B7/02 ,  H05K1/03 ,  H05K1/05 ,  B32B3/00 ,  D21D3/00

CPC classification number: H05K1/0366 ,  B32B7/02 ,  H05K1/0386 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0269 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24934 ,  Y10T428/31993 ,  Y10T442/616 ,  Y10T442/656

Abstract: A heat conductive circuit board includes an insulating layer provided on a metal substrate, and an electrically conductive metal foil formed on the insulating layer, and the insulating layer is formed by impregnating an alumina paper with organic polymer. The alumina paper is made by subjecting a material containing alumina fiber as the principal components to a paper-making process. The insulating layer has excellent properties of heat transfer not only in the thickness direction but also in the surface direction, and thus, the heat conductive circuit board is excellent in heat dissipation properties.

Abstract translation: 导热电路板包括设置在金属基板上的绝缘层和形成在绝缘层上的导电金属箔，并且通过用有机聚合物浸渍氧化铝纸形成绝缘层。 氧化铝纸通过将含有氧化铝纤维的材料作为主要成分进行制造。 绝缘层不仅在厚度方向上而且在表面方向上具有优异的热传递性，因此导热电路板的散热特性优异。

公开(公告)号：US4571279A

公开(公告)日：1986-02-18

申请号：US555836

申请日：1983-11-28

Applicant: Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

Inventor： Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

IPC: B32B37/00 ,  B29C57/00 ,  B29C63/00 ,  B29C67/00 ,  B29C70/00 ,  B29C70/50 ,  B32B15/08 ,  B32B27/04 ,  B32B38/08 ,  D21H25/06 ,  H05K1/03 ,  H05K3/02 ,  B32B31/00 ,  C09J5/02

CPC classification number: B32B38/08 ,  B29C70/50 ,  B32B27/04 ,  D21H25/06 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K3/022 ,  Y10S428/901 ,  Y10T156/1085 ,  Y10T29/49124 ,  Y10T442/3431 ,  Y10T442/3528 ,  Y10T442/656 ,  Y10T442/67

Abstract: A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated substrates into a unitary member, sandwiching the laminate between a pair of covering sheets, and curing the laminate between said pair of covering sheets without applying appreciable pressure. The improvement comprises adjusting the final resin content in said resin impregnated substrate at 10 to 90% by weight based on the total weight of said impregnated substrate.

Abstract translation: 一种用于生产增强树脂层压板的连续方法，包括以下步骤：用不含挥发性溶剂的液体树脂浸渍纤维基材，并且能够固化而不产生液体和气体副产物，将多个浸渍树脂的基材层压成单一 构件，将层压体夹在一对覆盖片之间，并且在施加明显的压力之间固化所述一对覆盖片之间的层压体。 该改进包括基于所述浸渍的基材的总重量将所述树脂浸渍的基材中的最终树脂含量调节为10至90重量％。

公开(公告)号：US4547421A

公开(公告)日：1985-10-15

申请号：US663272

申请日：1984-10-22

Applicant: Sidney G. Dunbar

Inventor： Sidney G. Dunbar

IPC: B29C70/38 ,  D04H1/42 ,  D04H5/00 ,  H05K1/03 ,  B32B31/08

CPC classification number: H05K1/0366 ,  B32B17/02 ,  B32B5/26 ,  D04H3/004 ,  D04H3/12 ,  B29C70/18 ,  H05K2201/0293 ,  Y10T442/60 ,  Y10T442/662

Abstract: A mat comprised of at least one layer of highly dispersed continuous glass fiber strands is produced according to defined parameters for use in reinforcing thermoplastic as well as thermosetting materials.

Abstract translation: 根据用于增强热塑性材料以及热固性材料的确定参数制造由至少一层高度分散的连续玻璃纤维束组成的垫。

公开(公告)号：US4451317A

公开(公告)日：1984-05-29

申请号：US384438

申请日：1982-06-02

Applicant: Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

Inventor： Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

IPC: B32B37/00 ,  B29C57/00 ,  B29C63/00 ,  B29C67/00 ,  B29C70/00 ,  B29C70/50 ,  B32B15/08 ,  B32B27/04 ,  B32B38/08 ,  D21H25/06 ,  H05K1/03 ,  H05K3/02 ,  C09J5/02

CPC classification number: B32B38/08 ,  B29C70/50 ,  B32B27/04 ,  D21H25/06 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K3/022 ,  Y10S428/901 ,  Y10T156/1085 ,  Y10T29/49124 ,  Y10T442/3431 ,  Y10T442/3528 ,  Y10T442/656 ,  Y10T442/67

Abstract: A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated substrates into a unitary member, sandwiching the laminate between a pair of covering sheets, and curing the laminate between said pair of covering sheets without applying appreciable pressure. The improvement comprises adjusting the final resin content in said resin impregnated substrate at 10 to 90% by weight based on the total weight of said impregnated substrate.

Abstract translation: 一种用于生产增强树脂层压板的连续方法，包括以下步骤：用不含挥发性溶剂的液体树脂浸渍纤维基材，并且能够固化而不产生液体和气体副产物，将多个浸渍树脂的基材层压成单一 构件，将层压体夹在一对覆盖片之间，并且在施加明显的压力之间固化所述一对覆盖片之间的层压体。 该改进包括基于所述浸渍的基材的总重量将所述树脂浸渍的基材中的最终树脂含量调节为10至90重量％。

公开(公告)号：USRE31124E

公开(公告)日：1983-01-11

申请号：US969363

申请日：1978-12-14

Applicant: Hendrik Jongetjes

Inventor： Hendrik Jongetjes

IPC: B32B15/04 ,  A01K5/02 ,  B29C70/00 ,  B32B15/08 ,  B32B17/04 ,  B32B27/30 ,  D04H1/14 ,  D06M13/148 ,  D06N7/06 ,  D21H17/36 ,  H01B3/08 ,  H01B3/44 ,  H05K1/03

CPC classification number: H05K1/0366 ,  A01K5/0208 ,  B29C70/00 ,  D21H17/36 ,  H01B3/084 ,  H01B3/448 ,  B29K2309/08 ,  H05K2201/0293 ,  Y10T428/31511 ,  Y10T428/31525

Abstract: Non-woven glass-fiber webs for reinforcing plastics material carrying printed circuits are produced by the wet process from E-glass fibers bonded with polyvinyl alcohol. The polyvinyl alcohol used is a powder or suspension, has a degree of hydrolization of 98-100%, and a viscosity, as a 4% solution in water of 20.degree. C., of 20-100 cP. Preferably the polyvinyl alcohol has a degree of swelling at 20.degree. C. of between 3 and 8, and in the dry form a particle size of between 50 and 180.mu.. A plurality of these glass fiber webs are impregnated with a solution of an epoxy resin, arranged as a laminate, then compressed at elevated pressure and temperature to form the final laminate.