公开(公告)号：US08900741B2

公开(公告)日：2014-12-02

申请号：US12379079

申请日：2009-02-12

Applicant: Bong-Young Kim

Inventor： Bong-Young Kim

IPC: H01M2/26 ,  H01M2/34 ,  H01M2/04 ,  H01M10/42 ,  H05K1/11 ,  H05K3/32 ,  H01M2/12 ,  H01M2/36

CPC classification number: H01M2/34 ,  H01M2/0404 ,  H01M2/1241 ,  H01M2/36 ,  H01M10/4257 ,  H01M2200/00 ,  H05K1/117 ,  H05K3/328 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/09845 ,  H05K2201/10037

Abstract: A protective circuit board includes a printed circuit board, the printed circuit board including a first region and a second region, at least one safety device on the first region of the printed circuit board, the first region being thinner than the second region along a direction perpendicular to a contact plane between the printed circuit board and the safety device, and an external connection terminal on the printed circuit board.

Abstract translation: 保护电路板包括印刷电路板，所述印刷电路板包括第一区域和第二区域，所述印刷电路板的所述第一区域上的至少一个安全装置，所述第一区域比所述第二区域薄， 垂直于印刷电路板和安全装置之间的接触平面，以及印刷电路板上的外部连接端子。

公开(公告)号：US08889999B2

公开(公告)日：2014-11-18

申请号：US13280008

申请日：2011-10-24

Applicant: Aritharan Thurairajaratnam ,  David Senk

Inventor： Aritharan Thurairajaratnam ,  David Senk

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K1/024 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09063 ,  H05K2203/0242

Abstract: A printed circuit board (PCB) stack-up has a signal via configured to transmit a signal through at least two different layers of the PCB stack-up, a reference structure that is at least a portion of a return path for the signal; and an unplated via disposed in an area surrounding the signal via. The unplated via is disposed in the area surrounding the signal via to improve the characteristic impedance of the signal via.

Abstract translation: 印刷电路板（PCB）叠层具有被配置为通过PCB堆叠的至少两个不同层传输信号的信号通道，该参考结构是用于信号的返回路径的至少一部分; 以及设置在围绕信号通孔的区域中的未电镀通孔。 未经电镀的通孔设置在信号通孔周围的区域中，以改善信号通路的特性阻抗。

公开(公告)号：US08878089B2

公开(公告)日：2014-11-04

申请号：US13654618

申请日：2012-10-18

Applicant: Sigmatron International, Inc.

Inventor： Yoshio W. Kano

IPC: H01H13/68

CPC classification number: H01H19/11 ,  H01H19/585 ,  H05K1/119 ,  H05K1/182 ,  H05K2201/09063 ,  H05K2201/10053 ,  H05K2201/10083

Abstract: A switch includes a printed circuit board and a contact piece with first and second contacts. The printed circuit board has a power input contact, a power output contact, a noncontact area, and a plurality of signal contacts that are disposed at a plurality of predetermined positions. The power input contact and the plurality of signal contacts are disposed on the printed circuit board such that, upon movement of the first contact from the noncontact area to a signal contact, the second contact will align with the power input contact prior to the first contact aligning with the signal contact.

Abstract translation: 开关包括印刷电路板和具有第一和第二触点的接触片。 印刷电路板具有设置在多个预定位置处的电源输入触点，电源输出触点，非接触区域和多个信号触点。 电源输入触点和多个信号触点设置在印刷电路板上，使得当第一触点从非接触区域移动到信号触点时，第二触点将在第一触点之前与电源输入触点对齐 与信号触点对齐。

公开(公告)号：US08878073B2

公开(公告)日：2014-11-04

申请号：US13526186

申请日：2012-06-18

Applicant: Philip W. Johnson

Inventor： Philip W. Johnson

IPC: H05K1/16 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/0256 ,  H01L31/0203 ,  H01L31/153 ,  H05K1/0262 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10166

Abstract: A printed circuit board is provided. The printed circuit board includes a base having a top and a bottom. The top has a first circuit area, a second circuit area and a slotted area disposed between the first circuit area and the second circuit area. The slotted area includes a first row of a plurality of first slots, each first slot of the plurality of first slots has a first length and is separated from an adjacent first slot by a first space. The slotted area includes a second row of a plurality of second slots that is positioned parallel with respect to the first row. Each second slot of the plurality of second slots has a second length that is different than the first length and is separated from an adjacent second slot by a second space. The second space includes a different length than the first space.

Abstract translation: 提供印刷电路板。 印刷电路板包括具有顶部和底部的底座。 顶部具有第一电路区域，第二电路区域和布置在第一电路区域和第二电路区域之间的开槽区域。 开槽区域包括多个第一槽的第一排，多个第一槽中的每个第一槽具有第一长度并且通过第一空间与相邻的第一槽分离。 开槽区域包括相对于第一排平行定位的多个第二槽的第二排。 多个第二槽中的每个第二槽具有与第一长度不同的第二长度，并且与相邻的第二槽分开第二空间。 第二空间包括与第一空间不同的长度。

公开(公告)号：US20140321126A1

公开(公告)日：2014-10-30

申请号：US14357687

申请日：2012-11-20

Applicant: 3M INNOVATION PROPERTIES COMPANY

Inventor： Alejandro Aldrin II Agcaoili Narag ,  Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Justine A. Mooney

IPC: F21V21/14 ,  F21V29/00 ,  F21K99/00

CPC classification number: F21V21/14 ,  F21K9/00 ,  F21K9/232 ,  F21V3/00 ,  F21V29/70 ,  F21W2107/00 ,  F21W2121/00 ,  F21Y2101/00 ,  F21Y2107/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/10106 ,  H01L2924/00

Abstract: Provided is an article comprising a flexible circuit comprising a polymeric dielectric layer having first and second major surfaces, one or both of the first and second major surfaces having a conductive layer thereon, wherein at least one conductive layer comprises an electrical circuit configured to power one or more light emitting semiconductor devices located on the flexible circuit, wherein the flexible circuit is shaped to form a three dimensional structure.

Abstract translation: 提供了一种包括柔性电路的制品，其包括具有第一和第二主表面的聚合物电介质层，第一和第二主表面中的一个或两个在其上具有导电层，其中至少一个导电层包括电路， 或更多个位于柔性电路上的发光半导体器件，其中柔性电路成形为形成三维结构。

公开(公告)号：US08863375B2

公开(公告)日：2014-10-21

申请号：US13393697

申请日：2010-09-01

Applicant: Christoph Thumser ,  Gerhard Freydl

Inventor： Christoph Thumser ,  Gerhard Freydl

IPC: H05K3/30 ,  H05K3/00 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K3/305 ,  H05K1/0269 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1089

Abstract: The invention relates to a method for connecting a plurality of elements for a circuit board, comprising the following steps: providing the elements of a circuit board to be connected to each other, the elements having contours adapted to each other; arranging the elements to be connected to each other in close proximity in at least one of two peripheral areas that have complementary contours, while maintaining a distance between opposing peripheral areas; and mechanically connecting the opposing peripheral areas by means of at least one sub-area thereof in order to connect the elements of the circuit board to be connected to each other. Furthermore, a circuit board produced from a plurality of elements connected to each other is provided.

Abstract translation: 本发明涉及一种用于连接电路板的多个元件的方法，包括以下步骤：提供要彼此连接的电路板的元件，所述元件具有彼此适配的轮廓; 将彼此连接的元件彼此紧密地布置在具有互补轮廓的两个外围区域中的至少一个中，同时保持相对的外围区域之间的距离; 并且通过其至少一个子区域机械地连接相对的外围区域，以将要连接的电路板的元件连接起来。 此外，提供了由彼此连接的多个元件制造的电路板。

公开(公告)号：US20140307396A1

公开(公告)日：2014-10-16

申请号：US14135362

申请日：2013-12-19

Applicant: LG DISPLAY CO., LTD.

Inventor： Dal Jae LEE

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K1/028 ,  G02F1/133305 ,  G02F1/13452 ,  G09G3/2096 ,  G09G2300/0408 ,  G09G2380/02 ,  H01L2251/5338 ,  H05K1/111 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10128 ,  H05K2201/10136 ,  Y10T29/49126

Abstract: Discussed is a flexible display device with a reduced bezel width. The flexible display device according to an embodiment includes a display panel configured to display images, and including a flexible first substrate having a plurality of pixels disposed therein and a second substrate coupled to the flexible first substrate, the flexible first substrate including a display area, a bent part extending from the display area, and a pad part extending from the bent part; a panel driver connected to the pad part, and configured to supply signals to the respective pixels; and a supporting member configured to support the flexible first substrate, and including a bent part for guiding the bent part of the first substrate.

Abstract translation: 讨论的是具有减少的边框宽度的灵活的显示设备。 根据实施例的柔性显示装置包括被配置为显示图像并且包括其中布置有多个像素的柔性第一基板和耦合到柔性第一基板的第二基板的显示面板，所述柔性第一基板包括显示区域， 从显示区域延伸的弯曲部分和从弯曲部分延伸的垫部分; 连接到所述焊盘部分的面板驱动器，并且被配置为向各个像素提供信号; 以及支撑构件，其构造成支撑柔性第一基板，并且包括用于引导第一基板的弯曲部分的弯曲部分。

公开(公告)号：US20140306014A1

公开(公告)日：2014-10-16

申请号：US14223242

申请日：2014-03-24

Applicant: Johnson Electric S.A.

Inventor： Vincent Daniel Jean Salle ,  Martin Wallace Edmonds

IPC: G06K19/02

CPC classification number: G06K19/02 ,  G06F21/86 ,  G08B13/2434 ,  H05K1/0275 ,  H05K1/0386 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09445

Abstract: An electronic device is protected from unauthorized access by use of a security wrap having a security screen connected to an alarm circuit of the electronic device. The security screen has a pair of screen terminals interconnected by a conductor. The conductor is formed on a substrate. The substrate is arranged such that attempts to remove the security wrap will result in the substrate being torn and the conductor being damaged or broken whereby the resistance of the conductive path formed by the conductor changes to indicate an alarm condition.

Abstract translation: 通过使用具有连接到电子设备的报警电路的安全屏幕的安全保护装置来保护电子设备免受未经授权的访问。 安全屏幕具有通过导体互连的一对屏幕端子。 导体形成在基板上。 基板被布置成使得去除安全包裹的尝试将导致基板被撕裂并且导体被损坏或破坏，由此由导体形成的导电路径的电阻改变以指示报警状态。

公开(公告)号：US20140268581A1

公开(公告)日：2014-09-18

申请号：US14289335

申请日：2014-05-28

Applicant: YAZAKI CORPORATION

Inventor： Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal extended from the substrate and bending in a direction that is perpendicular to a surface of the substrate; and a heat radiation piece section integrally installed to the connection terminal.

Abstract translation: 公开了一种布线基板及其制造方法，所述布线基板包括：具有高导热层的基板，其中所述基板的前表面和后表面中的至少一个是用于各种部件的安装表面 ; 连接端子，从所述基板延伸并且在垂直于所述基板的表面的方向上弯曲; 以及一体地安装在连接端子上的散热片部分。

公开(公告)号：US08835774B2

公开(公告)日：2014-09-16

申请号：US13283824

申请日：2011-10-28

Applicant: Hyun-seok Kim ,  Inh-seok Suh ,  Tak-kyoum Kim

Inventor： Hyun-seok Kim ,  Inh-seok Suh ,  Tak-kyoum Kim

IPC: H05K1/16 ,  H05K1/11

CPC classification number: H05K3/3452 ,  H05K3/363 ,  H05K2201/09063

Abstract: According to an aspect of the invention, there is provided a circuit board assembly including a first circuit board including a first circuit pattern formed on a surface of the first circuit board, and an opening that is adjacent to the first circuit pattern; and a second circuit board including a second circuit pattern corresponding to the first circuit pattern and a protection film that is applied to a surface of the second circuit board so as to form a hollow place located corresponding to the opening, wherein the first circuit board and the second circuit board are combined with each other.

Abstract translation: 根据本发明的一个方面，提供了一种电路板组件，包括：第一电路板，包括形成在第一电路板的表面上的第一电路图案和与第一电路图案相邻的开口; 以及第二电路板，包括对应于第一电路图案的第二电路图案和保护膜，该保护膜施加到第二电路板的表面，以形成对应于开口的中空位置，其中第一电路板和 第二电路板彼此组合。