Abstract:
There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns are transferred onto a thermoplastic resin, without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method. The method for manufacturing a printed circuit board includes the steps of manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as the thickness of a copper foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with the copper foil and side surfaces different from the flat or projecting curved surface, and heating under pressure the protruding patterns of the original plate against a thermoplastic resin with the copper foil interposed therebetween to transfer portions of the copper foil in contact with the protruding patterns onto the surface of the thermoplastic resin, thereby forming the circuit patterns.
Abstract:
Electrical interconnection of first and second sides of a flex circuit is provided by a tab formed in the flex circuit. At least one circuit trace extends along the tab and provides a contact area on the flex circuit first side. The tab is folded so that the contact area overlays the flex circuit second side. The contact area is then electrically interconnected as by reflow soldering to a contact area on the flex circuit second side.
Abstract:
A keyboard of a membrane contact type comprises a membrane contact unit having movable contacts, fixed contacts disposed respectively opposite to the movable contacts, and a printed wiring board having electronic circuit elements and provided with printed wiring lines. The membrane contact unit comprises a flexible, insulating, membranous substrate having movable contacts formed in a movable contact section and fixed contacts formed in a fixed contact section demarcated by a folding line, in the same surface as the movable contacts and arranged symmetrically about the folding line. First and second wiring lines connect the movable contacts and the fixed contacts respectively in a predetermined connecting pattern. A first terminal section having first terminals is connected respectively to the first wiring lines, and a second terminal section having second terminals is connected respectively to the second wiring lines. The first and second terminal sections are formed near the folding line. U-shaped slits are formed in the substrate so as to embrace the extremities of the first and second terminal sections, respectively, so that the first and second terminal sections project from the folded edge of the membranous substrate when the same is folded along the folding line to facilitate electrically and mechanically connecting the membrane contact unit to the printed wiring board.
Abstract:
An accessory circuit component for an electrical package is disclosed. This circuit component includes a conductive path for connecting an accessory component to selected contacts of the electrical package. The conductive path includes portions thereof which are selectively removable to create an open electrical circuit between the selected package contacts.
Abstract:
Folded membrane switches (20, 50, 70) formed from foldable blanks (21, 51, 71) including two spaced contact-carrying panels (22,23) connected by an intermediate third panel (24). The blanks (21, 51, 71) are folded along the third panel (24) to position contacts (25, 27) on the contact-carrying panels (22,23) in alignment with one another, with a spacer layer (35, 61, 76) positioned therebetween to maintain the contacts (25, 27) in a normally separated or off condition. Part of the intermediate third panel (24) may be slit to define a tail (32, 58) or a tail (72) may extend from one of the contact-carrying panels (22, 23), the tail being used to connect the switch to external circuitry.
Abstract:
An accessory circuit component interconnected with the contacts of an electrical package comprises a flexible substrate with a circuit pattern of conductive traces thereon and a decoupling capacitor connected to selected conductive traces. A plurality of deflectable tabs inclusive of a portion of the substrate and a conductive trace are provided interiorly of side margins of the substrate. Upon assembly of the accessory component to a socket, the tabs deflect as urged by the contacts thereby providing openings through the substrate for receipt of the contacts therethrough. The conductive trace portions of the deflected tabs are connected to the contacts bearing thereagainst.
Abstract:
A cable connector module includes a cable card assembly including a circuit card, cables terminated to the circuit card, and a cable holder coupled to the circuit card and holding the cables relative to the circuit card. The cables include cable conductors electrically connected to corresponding cable contacts of the circuit card. The cable holder holds each of the contacts and includes a connecting tab coupled to the circuit card. The circuit card includes front and rear retaining tabs. The cable connector module includes a connector shell having a cavity that receives the cable card assembly. The connector shell includes a front retainer at the front receiving the front retaining tab to hold the front of the circuit card relative to the connector shell. The connector shell includes a rear retainer at the rear receiving the rear retaining tab to hold the rear of the circuit card relative to the connector shell.
Abstract:
A flexible substrate includes one end portion, the other end portion, and a pattern portion formed at least between the one end portion and the other end portion. The pattern portion has a tongue piece formed by a notch. The tongue piece is configured to be electrically connected to another member.
Abstract:
A monitoring device includes a substrate having a circuit trace disposed thereon and a circuit carrier having a recessed portion. The substrate includes a flexible flange portion having a component disposed thereon. The substrate is disposed on the circuit carrier such that the flange portion and the component are disposed in the recessed portion.